Abstract:
Soft carbon-K X-rays (38) are used to expose a PMMA photoresist (31) on an oxide layer (32) of a silicon substrate (33) through a parent mask (30) separated a distance S from the resist by a spacer (34). The parent mask slits (12, 17) define a pattern of spatial period p, to establish an intensity pattern of period p/n at the resist with S = p 2 /nλ, where λ is the wavelength of the incident radiation and λ
Abstract:
The invention relates to a method of enhancing epitaxy and preferred orientation in films on solid substrates, which includes forming at predetermined locations, a plurality of artificial point defects or a surface relief structure (7) at the surface of a solid substrate (1). Thereafter a film (8) is deposited on the surface to form a substantially epitaxial or preferred orientation layer in tre film having crystalographic orientation influenced by the geometry of an artificial defect. The orienting influence of the article defects may be enhanged by applying an incident beam of energy (9) to the film (8).
Abstract:
Soft carbon-K X-rays (38) are used to expose a PMMA photoresist (31) on an oxide layer (32) of a silicon substrate (33) through a parent mask (30) separated a distance S from the resist by a spacer (34). The parent mask slits (12, 17) define a pattern of spatial period p, to establish an intensity pattern of period p/n at the resist with S = p 2 /nλ, where λ is the wavelength of the incident radiation and λ
Abstract:
The invention relates to a method of making multi-level semi conductor devices which include a first level of devices (12) in the surface of a wafer (11) of semi conductor material and a first film (13) of material deposited on the wafer surface. To produce a further level of devices one or more artificial defects (14) are fabricated in the surface of the first film (13) and a second film (15) of semi conductor material is deposited on the artificial defects so that the crystallographic orientation is influenced by the geometric arrangement of the defect or defects. A second level of semi conductor devices (16) can then be fabricated above the first level in the second film (15).
Abstract:
The invention relates to a method of producing X-ray masks by forming a relief pattern of predetermined section in silicon or silicon dioxide and then moulding a plastics material with an inverse relief pattern. Thereafter, an X-ray absorbing material such as tungsten is deposited at an oblique angle onto the relief structure in the plastics material.