公开(公告)号：US3879837A

公开(公告)日：1975-04-29

申请号：US44367074

申请日：1974-02-19

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MIZUKOSHI KANJI ,  ANDOU MINORU ,  OKUNO HISAO

IPC: B23K1/20 ,  B23K3/08 ,  H01L21/00 ,  H01L21/60 ,  B23K31/02

CPC classification number: H01L21/00 ,  B23K1/20 ,  B23K3/087 ,  B23K2201/40 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/157 ,  H01L2924/15747 ,  H01L2924/00015 ,  H01L2924/00

Abstract: A method of soldering a semiconductor plate to a metal substrate comprising the steps of disposing or supplying solder at that portion of the metal substrate which is remote from the portion to be soldered with the semiconductor plate, and supplying the melted solder to the soldering portion of said semiconductor plate and said metal substrate through a groove provided in said metal substrate and extending from said remote portion to said soldering portion.

Abstract translation: 一种将半导体板焊接到金属基板的方法，包括以下步骤：在远离待与半导体板焊接的部分的金属基板的该部分处设置或供应焊料，并将熔融的焊料供应到 所述半导体板和所述金属基板通过设置在所述金属基板中并从所述远端部分延伸到所述焊接部分的凹槽。

公开(公告)号：DE2238569A1

公开(公告)日：1973-02-22

申请号：DE2238569

申请日：1972-08-04

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MIZUKOSHI KANJI ,  ANDOU MINORU ,  OKUNO HISAO

IPC: B23K1/20 ,  B23K3/08 ,  H01L21/00 ,  H01L21/60 ,  H01L7/34

公开(公告)号：CA970079A

公开(公告)日：1975-06-24

申请号：CA148789

申请日：1972-08-04

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MIZUKOSHI KANJI ,  ANDOU MINORU ,  OKUNO HISAO

IPC: B23K1/20 ,  B23K3/08 ,  H01L21/00 ,  H01L21/60