公开(公告)号：JP2001168236A

公开(公告)日：2001-06-22

申请号：JP34700199

申请日：1999-12-07

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： YOSHIDA TAKAYUKI ,  KAWABATA TAKESHI

IPC: H01L23/12

Abstract: PROBLEM TO BE SOLVED: To reduce signal distortion at a package as much as possible in BGA or CSP packages mounting a semiconductor component. SOLUTION: A ball pad 7 and a plating stub 6 are formed so that they indicate a capacitive property within a desired frequency range, and the formation range of a signal line 4 for composing a micro strip line is limited to a range that is subjected to the electrical influence of the ball pad 7 and the plating stub 6, thus forming a desired uniform impedance line. In this manner, by making constant the characteristic impedance of a transmission line on a BGA, the distortion of signal waveform on a package transmission line can be eliminated.

公开(公告)号：JP2001024134A

公开(公告)日：2001-01-26

申请号：JP19840999

申请日：1999-07-13

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： KAWABATA TAKESHI ,  ARAI YOSHIYUKI

IPC: H01L23/50

Abstract: PROBLEM TO BE SOLVED: To prevent internal stripping or cracking of a semiconductor device by employing a two-dimensional rudder or mesh structure having inner and outer compositional members in the suspension lead of a lead frame thereby enhancing rigidity of the suspension lead. SOLUTION: A die pad part 2 for mounting a semiconductor chip 1 is linked, at the opposite ends thereof in the longitudinal direction, with the outer frame 3 through a suspension lead part 14. The suspension lead part 14 has two-dimensional trapezoidal structure of an outer compositional member 14a and an inner compositional member 14b arranged in rudder. The suspension lead part 14 is held by an outer frame 3 through two holding leads 14c provided at the end parts on tlte outer frame 3 side. According to the structure, rigidity of the suspension lead is enhanced and strength of a semiconductor device is enhanced against a stress generated in the semiconductor chip 1 when it is released from a die after resin molding.