公开(公告)号：US6433285B2

公开(公告)日：2002-08-13

申请号：US73579200

申请日：2000-12-14

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MAEDA KENJI ,  TAKATA TAKASHI ,  NARAOKA HIROKI ,  HOMMA HAJIME ,  NONOYAMA SHIGERU ,  ARAI YOSHIYUKI ,  YAMADA YUICHIRO ,  ITO FUMITO

IPC: G06K19/077 ,  H01L21/56 ,  H01L23/498 ,  H05K3/28 ,  H05K1/16

CPC classification number: G06K19/072 ,  G06K19/07743 ,  G06K19/07745 ,  H01L21/565 ,  H01L23/49855 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/284 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention provides a printed wiring board, an IC card module including the printed wiring board, and a method for fabricating the IC card module, for improving reliability of IC cards. The printed wiring board and the IC card module of the invention include: a base having a resin sealing region, clamped regions in a periphery zone of the resin sealing region clamped with a sealing mold, and non-clamped regions in the periphery zone; and terminals for external connection formed on the top surface of the base. The terminals are formed in a region other than any of the resin sealing region, the clamped regions, and the non-claimed regions.

Abstract translation: 本发明提供一种印刷电路板，包括印刷电路板的IC卡模块以及用于提高IC卡的可靠性的IC卡模块的制造方法。 本发明的印刷线路板和IC卡模块包括：具有树脂密封区域的基座，用密封模具夹持的树脂密封区域的周边区域中的夹持区域和周边区域中的非夹紧区域; 以及形成在基座顶表面上的用于外部连接的端子。 端子形成在除了树脂密封区域，夹紧区域和非索赔区域中的任何一个以外的区域中。

公开(公告)号：JPH08264682A

公开(公告)日：1996-10-11

申请号：JP9190595

申请日：1995-03-27

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： ARAI YOSHIYUKI ,  SATO MOTOAKI

IPC: H01L23/28 ,  H01L23/48 ,  H01L23/50

Abstract: PURPOSE: To increase the degree of freedom of lead design in a resin sealed type semiconductor device in LOC structure. CONSTITUTION: A lead 31 is formed so that an edge part 31a for adhering an insulation tape 5 covers an edge part 5a of the tape 5. A semiconductor chip 1 is fixed to the leads 31 and 32 using the insulation tape 5, a bonding pad 2 and the leads 31 and 32 are connected using a metal small gauge wire 6, and then an entire part is sealed by mold resin 4. The edge part 5a of the insulation tape pressed out of the semiconductor cap 1 is protected by the edge part 31a of the lead 31, thus preventing the interface release from the semiconductor chip 1 and the mold resin 4 and hence enlarging the allowable range of position deviation when fixing the semiconductor chip 1 to the leads 31 and 32 and increasing the degree of freedom when designing the lead.

公开(公告)号：JP2001024134A

公开(公告)日：2001-01-26

申请号：JP19840999

申请日：1999-07-13

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： KAWABATA TAKESHI ,  ARAI YOSHIYUKI

IPC: H01L23/50

Abstract: PROBLEM TO BE SOLVED: To prevent internal stripping or cracking of a semiconductor device by employing a two-dimensional rudder or mesh structure having inner and outer compositional members in the suspension lead of a lead frame thereby enhancing rigidity of the suspension lead. SOLUTION: A die pad part 2 for mounting a semiconductor chip 1 is linked, at the opposite ends thereof in the longitudinal direction, with the outer frame 3 through a suspension lead part 14. The suspension lead part 14 has two-dimensional trapezoidal structure of an outer compositional member 14a and an inner compositional member 14b arranged in rudder. The suspension lead part 14 is held by an outer frame 3 through two holding leads 14c provided at the end parts on tlte outer frame 3 side. According to the structure, rigidity of the suspension lead is enhanced and strength of a semiconductor device is enhanced against a stress generated in the semiconductor chip 1 when it is released from a die after resin molding.