公开(公告)号：JPH10242182A

公开(公告)日：1998-09-11

申请号：JP3917097

申请日：1997-02-24

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： NARAOKA HIROKI ,  TAGUCHI TOSHIAKI ,  NAKATSUKA KENJI

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device and lead frame therefor which avoids mold resin-unfilled parts and improve the mass productivity of the semiconductor device. SOLUTION: A semiconductor chip 3 is adhered to a lead frame, which is then held between mold dies 4, mold resin 2 is injected from a mold gate 8 to fill the dies 4 with venting air through vent holes 5, and the dies are opened to take out a resin sealed and molded lead frame 1. Lead frame openings 7 are provided within the reach of the resin 2 injected in the air vents 5 of the lead frame 1 and upper and lower resin burrs 6 of the frame 1 are flowed into the openings 7 and mutually adhered.