公开(公告)号：JP2001077265A

公开(公告)日：2001-03-23

申请号：JP24752199

申请日：1999-09-01

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： TAKEMURA KUNIKAZU ,  NANO MASANORI ,  UCHIUMI KATSUKI ,  ADACHI OSAMU ,  MATSUO TAKAHIRO

IPC: H01L21/56 ,  H01L23/12 ,  H01L23/28 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To prevent metal burrs on the end surface of a lead portion by blade cutting in a lead cutting process after resin sealing. SOLUTION: When a resin sealed type semiconductor device is separated from a resin sealed lead frame by lead cutting, sealing resins 8a and 8b are formed on the top and the bottom, respectively of the lead portion 4 to be cut. By cutting the lead portion 4 together with these sealing resins 8a, 8b with a rotary blade 11, bent portions on a cut end surface of the lead portion can be prevented. Furthermore, by performing reciprocating blade cutting to cut the lead portion 4 twice, the bent inverted portion can be prevented. Therefore, a resin sealed semiconductor device wit high mounting reliability can be obtained without defects on the lead portion.

公开(公告)号：JP2001077264A

公开(公告)日：2001-03-23

申请号：JP24751999

申请日：1999-09-01

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MATSUO TAKAHIRO ,  TAKEMURA KUNIKAZU ,  UCHIUMI KATSUKI ,  NOMURA TORU

IPC: B23K26/00 ,  H01L21/50 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To prevent metal burrs on the end surface of a lead portion by blade cutting in a lead cutting process after resin sealing. SOLUTION: When a resin sealed semiconductor device is separated from a lead frame by lead cutting, a first cutting groove 13 is formed in the upper surface of a lead portion 4, and the lead thickness is reduced. Then, the first cutting groove 13 is irradiated with a laser, the remaining lead portion is removed, and the lead portion 4 is separated from the frame. Consequently, the warped portions (metal burrs) on the cut end surface portion of the lead portion can be prevented.

公开(公告)号：JPH08250639A

公开(公告)日：1996-09-27

申请号：JP5440895

申请日：1995-03-14

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MINAMIO MASANORI ,  TAKEMURA KUNIKAZU ,  KOGA AKIRA

IPC: H01L23/50

Abstract: PURPOSE: To realize high reliability of a plastic molded type semiconductor device. CONSTITUTION: A lead frame 1 is the part for mounting a semiconductor element, and consists of the following; an island part 3 retained by suspension leads 2, an inner lead part 4 for electric connection with a mounted semiconductor element, and an outer lead part 6 which is fixed by a tie bar part 5 and connects the inner lead part 4 with the outside. On the surface of the island part 3, silver plating parts 13 are formed point-wise on only the spreading positions of adhesive paste. Since silver plating is performed only for the above silver plating part 13, the leak of silver plating material to the back of the island part 3 is not generated. As the result, the adhesion of a semiconductor element and the island part and ohmic properties can be ensured, and the heat resistance and the reliability of a semiconductor device can be improved.

公开(公告)号：JPH11111879A

公开(公告)日：1999-04-23

申请号：JP27567197

申请日：1997-10-08

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： TAKEMURA KUNIKAZU

IPC: H01L23/02 ,  H01L23/08

Abstract: PROBLEM TO BE SOLVED: To reduce the stress of a joined part and to improve moisture resistance reliability, by suppressing the dimension change rate of a package by moisture absorption. SOLUTION: As the pre-processing of joining a glass material 2 to a plastic package 1 to which a semiconductor element 3 is housed and an inorganic filler is added, the processing of making the plastic package 1 absorb moisture at high temperature and high humidity, and drying and dehumidifying it at the high temperature is performed. In such a manner, the plastic package 1 is swollen and a dimension becomes large when it is made to absorb the moisture at the high temperature and the high humidity and the dimension becomes small when it is dried and dehumidified at the high temperature, however, since the moisture is not completely dehumidified even when drying is performed for a long time, the dimension becomes larger than an initial state. Since the glass material 2 is joined to the plastic package 1 in the state, dimension change by moisture absorption swelling becomes small even at the time of trying to make it absorb the moisture furthermore, and the stress generated at the joined part of the plastic package 1 and the glass material 2 is reduced.

公开(公告)号：JPH10173120A

公开(公告)日：1998-06-26

申请号：JP32642496

申请日：1996-12-06

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： TAKEMURA KUNIKAZU

IPC: H01L21/56 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To provide a lead frame having a structure which will not possibly exert a stress on mounted semiconductor elements at releasing of a lead frame after resin sealing, by considering the lead frame structure at releasing, and a semiconductor device using the same. SOLUTION: The lead frame has a die pad 12 for mounting a semiconductor element, suspension leads 13 for supporting the die pad 12, inner leads 14 and beams 16 disposed in the gaps between the die pad and top ends of the inner leads 14. Ejector pins push up the die pad and semiconductor element at releasing. Against this stress the beams 16 have rigidity enough to suppress the bending stress and hence keep the semiconductor element in the semiconductor device from deforming, thus preventing the semiconductor element from breaking or its characteristics from deteriorating due to the stress exerted on the semiconductor element.

公开(公告)号：JPH09181116A

公开(公告)日：1997-07-11

申请号：JP33646695

申请日：1995-12-25

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MARUO TETSUMASA ,  KOUTOU NORIO ,  TAKEMURA KUNIKAZU ,  MIZUTANI ATSUHITO

IPC: H01L21/60 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To efficiently reinforce inner lead parts, and provide a semiconductor device of high reliability. SOLUTION: As to the structure of a film carrier, inner lead parts 3 and reinforced lead parts 8 protrude from each side of a device hole 2 to the inside, to the device hole 2 of a base film 1. A semiconductor chip 6 is fitted in the film carrier, and the inner lead parts 3 and the reinforced lead parts are joined to bumps 7 formed in a bonding pad part on the semiconductor chip 6, thus forming a semiconductor device. The reinforced lead parts 8 are joined obliquely to the semiconductor chip 6 by bumps 7a formed at four corners of the semiconductor chip 6. Thereby the bond strength of the semiconductor chip 6 and the base film 1 can be improved, and the inner lead part 3 can be protected from disconnection.

公开(公告)号：JPH09172126A

公开(公告)日：1997-06-30

申请号：JP32860995

申请日：1995-12-18

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： KOUTOU NORIO ,  TAKEMURA KUNIKAZU ,  MIZUTANI ATSUHITO ,  MARUO TETSUMASA

IPC: H01L23/28 ,  H01L23/29 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To prevent a heat sink from moving outside at the time of resin- sealing. SOLUTION: A semiconductor chip 2 is bonded on the die pad 1 of a lead frame with silver paste adhesive 3, and a heat sink 4 is bonded between the protruding parts 9 provided at the bottom of the die pad 1 with adhesive 5. Then, the semiconductor chip 2 and the lead 6 of the lead frame are electrically connected by bonding wire 7, and the outer part is sealed by sealing resin 8. This structure permits a layer of the adhesive 5 to receive sealing pressure even in the resin sealing process, and prevents the heat sink 4 from flowing by the sealing resin even when the layer of the adhesive 5 is removed from the die pad 1. Thus, the heat sink 4 is prevented from removing from the bottom of the die pad 1, and resin-sealing is performed at the correct position.

公开(公告)号：JP2001077279A

公开(公告)日：2001-03-23

申请号：JP24751699

申请日：1999-09-01

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： UCHIUMI KATSUKI ,  TAKEMURA KUNIKAZU ,  MATSUO TAKAHIRO ,  NOMURA TORU

IPC: H01L23/50

Abstract: PROBLEM TO BE SOLVED: To prevent burrs at the end face of a lead when cutting with a blade, in a lead cutting process after resin sealed. SOLUTION: A lead frame has a portion 13 thinner than the other portion at a cut portion 5 of a lead 4, wherein the thickness and the width of the cut portion 5 is set at values which do not hamper blade cutting. Therefore, when the lead frame is cut with a rotary blade 11, it is possible to prevent burrs and hence to eliminate defects of lead, which results in ensuring the packaging reliability of a resin-sealed semiconductor device.

公开(公告)号：JP2001077130A

公开(公告)日：2001-03-23

申请号：JP24752299

申请日：1999-09-01

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MATSUO TAKAHIRO ,  TAKEMURA KUNIKAZU ,  ADACHI OSAMU ,  UCHIUMI KATSUKI ,  NANO MASANORI

IPC: H01L23/12 ,  H01L21/50

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a resin sealed semiconductor device, where no defect or chipping takes place at a lead or sealing resin in a cutting process where the resin sealed semiconductor device is separated from a lead frame or substrate, for enhanced productivity. SOLUTION: When cutting a lead after a metal sheet 13 is allowed to tightly contact a lead 4 before resin sealing, the metal sheet 13 together with the lead 4 are cut completely to prevent occurrence of a burr (metal burr) on the cut surface of the read part 4. In particular, with the metal sheet harder than the lead part 4, common-cut effect is enhanced, the occurrence of a burr is prevented, and lead cutting can be made.

公开(公告)号：JPH09162247A

公开(公告)日：1997-06-20

申请号：JP32421895

申请日：1995-12-13

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： TAKEMURA KUNIKAZU ,  KOUTOU NORIO ,  MIZUTANI ATSUHITO ,  MARUO TETSUMASA

IPC: H01L21/60 ,  H01L21/52

Abstract: PROBLEM TO BE SOLVED: To avoid the breakdown of inner leads junctioned with a semiconductor chip by winding up a carrier tape. SOLUTION: The corner parts 9 of a semiconductor chip 6 are fixed by forming the overlapped parts 10, (12) covering the conner parts of the semiconductor chip 6 when the semiconductor chip 6 is junctioned with the corner parts of an aperture part 4 of a carrier tape 3 made of a polyimide tape and a copper layer to be junctioned and fixed. Through these procedures, the semiconductor chip 6 can be more firmly held on the carrier tape 3 than in the case wherein the semiconductor chip 6 is support-fixed by inner lead group only so that the stress concentrated on the inner leads 5 may be suppressed even in case of winding up carrier tape after inner lead (ILB) bonding step to be carried.