公开(公告)号：JP2001077275A

公开(公告)日：2001-03-23

申请号：JP24753199

申请日：1999-09-01

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： TAKEMURA KUNIKAZU ,  MATSUO TAKAHIRO

IPC: H01L21/56 ,  H01L23/12 ,  H01L23/28 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To form a land electrode of the bottom surface of a resin-sealed semiconductor device from a frame, without using a circuit board and to reduce manufacturing cost and to improve the packaging reliability of a substrate. SOLUTION: In a lead frame for a land grid array, a step is formed in advance with a metal film layer 24 on the land portion of land lead portion 4 and receives pressure caused by poring resin to move a land electrode 16 downward to put the surface of the land electrode 16 of the land lead portion 4 into close contact with a sealing sheet 20, thereby preventing the resin from flowing into the surface of the land electrode 16, which results in preventing the resin from producing fins on the surface of the land electrode 16 of the land lead portion 4.

公开(公告)号：JP2001077272A

公开(公告)日：2001-03-23

申请号：JP24752799

申请日：1999-09-01

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： TAKEMURA KUNIKAZU ,  MATSUO TAKAHIRO

IPC: H01L21/56 ,  H01L23/12 ,  H01L23/28 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To form a land electrode of the bottom surface of a resin-sealed semiconductor device from a frame, without using a circuit board, and to reduce manufacturing costs and to improve the packaging reliability of a substrate. SOLUTION: In a lead frame for a land grid array, by making a projecting portion 24 on the surface of a land electrode surface of a land lead portion 4 through punching, when the lead frame is sealed with resin, the land electrode 16 bites into a sealing sheet 20 with the projecting portion 24 and closely contacts the sealing sheet 20 to prevent the land lead portion 4 from being separated from the sealing sheet 20 and the resin from flowing into the surface of the land electrode 16, which results in preventing the resin from producing fins on the surface of the land electrode 16 of the land lead portion 4.

公开(公告)号：JP2001077263A

公开(公告)日：2001-03-23

申请号：JP24751799

申请日：1999-09-01

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MATSUO TAKAHIRO ,  UCHIUMI KATSUKI ,  TAKEMURA KUNIKAZU ,  NANO MASANORI

IPC: H01L21/56 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To prevent metal burrs on the end surface of a lead portion by blade cutting in a lead cutting process after resin sealing. SOLUTION: When a resin sealed semiconductor device is separated from a lead frame by lead cutting, a first cutting groove 13 is formed in the upper surface of a lead portion 4. A second cutting groove is formed with a rotary blade, to cut the cutting portion and separate the lead portion 4 from the frame. Consequently, since a cutting grooves are formed gradually in multiple stages to cut the lead portion 4, the warped portions (metal burrs) on the cut end surface portion of the lead portion can be prevented.

公开(公告)号：JP2000294717A

公开(公告)日：2000-10-20

申请号：JP9518599

申请日：1999-04-01

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： NANO MASANORI ,  TAKEMURA KUNIKAZU ,  YAMADA YUICHIRO ,  ITO FUMITO ,  MATSUO TAKAHIRO

IPC: H01L23/50 ,  H01L23/12

Abstract: PROBLEM TO BE SOLVED: To realize a resin-sealed semiconductor device of a type in which a lower surface of a die pad is exposed from sealing resin and one faces of leads are sealed and which can suppress progressing peel-off between a surface of the die pad and sealing resin, and also to realize a method for manufacturing the semiconductor device. SOLUTION: In the resin-sealed semiconductor device, an annular groove 64 surrounding a central part 2a (support part) upset from a peripheral part 2b by a semi-cut part 11 of a die pad 2 is made in an upper surface of the central part 2a. And a gap between an upper surface of the peripheral part 2b and a rear surface of a semiconductor chip 4 is filled with sealing resin 6. Even when deterioration of a moisture resistance or generation of a thermal stress causes peel-off between the gap filled part 6a and die pad 2, and the peel-off is progressed, the peel-off itself is trapped by the groove 64. Therefore, the progress of the resin peel-off can be stopped and the semiconductor device can be maintained high in its reliability.

公开(公告)号：JP2001077266A

公开(公告)日：2001-03-23

申请号：JP24753499

申请日：1999-09-01

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MATSUO TAKAHIRO ,  OHIRO MASAHIKO ,  MARUO TETSUMASA

IPC: H01L21/56 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To prevent metal burrs on the end surface of a lead portion by blade cutting in a lead cutting process after resin sealing. SOLUTION: After a metal sheet 13 having an adhesive 14 is bonded to a lead portion 4 and resin sealed, leads are cut with a blade. Then, by peeling off the metal sheet 13 together with the adhesive 14, bent portions 12 (metal burrs) generated on the cut end surface of the lead portion 4 can be removed and a resin sealed semiconductor device wit high mounting reliability can be obtained.

公开(公告)号：JP2001024001A

公开(公告)日：2001-01-26

申请号：JP19756199

申请日：1999-07-12

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： UCHIUMI KATSUKI ,  YAMAGUCHI YUKIO ,  MATSUO TAKAHIRO

IPC: H01L25/18 ,  H01L21/50 ,  H01L21/56 ,  H01L23/12 ,  H01L23/28 ,  H01L23/50 ,  H01L25/10 ,  H01L25/11

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a resin-encapsulated semiconductor device which yields high productivity, low cost and good quality, and in which stresses inside the molding generated by warpage corrections of the molding in a cutting process can be reduced, and a lead frame thereof. SOLUTION: A lead frame 4 having openings 10 on outer peripheries of a plurality of chip-mounting regions Rcp is provided, on which electrode pads of semiconductor chips 2 and signal connection terminals 1 are connected electrically. A sealing sheet 6 is placed between a metal mold plane that faces the concave cavity of a metal mold 15 and the backside of the lead frame 4. The body 20 to be molded is placed in the concave cavity 14, which is filled with a resin 7 and is sealed up to the openings 10 of the lead frame 4. The sealing sheet 6 is peeled off, while the molding is pressed and heated to cure the resin, and is cut into individual devices.

公开(公告)号：JP2000332149A

公开(公告)日：2000-11-30

申请号：JP13820999

申请日：1999-05-19

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： NANO MASANORI ,  ADACHI OSAMU ,  NOMURA TORU ,  MATSUO TAKAHIRO

IPC: H01L23/12 ,  H01L23/28

Abstract: PROBLEM TO BE SOLVED: To easily obtain a resin sealed semiconductor device by eliminating the need of lead cutting and bending. SOLUTION: A terminal land frame has a frame main body 10 composed of a metallic sheet, a double land constituting body 30 composed of a plurality of first land constituting bodies 27 arranged in the area of the main body 10 and formed in projecting states, and second land constituting bodies 29 formed on the upper surfaces of the first land constituting bodies 27. At least, the first land constituting bodies 27 have such constitutions that their connecting sections are broken and the bodies 27 are separated when pressing forces are applied to the bodies 27 in the projecting directions. When a resin sealed semiconductor device is constituted by using this terminal land frame, the mounting accuracy and reliability of the semiconductor device can be improved, because adhesion between the sealing resin and land constituting body 30 is further improved and the body 30 surely holds solder at the time of mounting the semiconductor device.

公开(公告)号：JP2001168262A

公开(公告)日：2001-06-22

申请号：JP35130899

申请日：1999-12-10

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： UCHIUMI KATSUKI ,  MATSUO TAKAHIRO ,  FUKUDA TOSHIYUKI ,  YAMAGUCHI YUKIO

IPC: H01L23/12 ,  H01L21/56 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To solve a problem such that the frame of a separated lead frame flies off to have an adverse effect such as a reduction in productivity in the manufacture of a semiconductor device when leads are cut off with a rotary blade in place of a cutting die. SOLUTION: A connection part 13 as high as a sealing resin 8 is formed of the sealing resin 8 on the cutting line of a lead 4 which comes out of the sealing resin 8, a sealing resin is formed also on a runner, a lead frame is bonded to a resins heat 14, and the lead 4 is cut off by a rotary blade 15, and a frame is bonded to the resin sheet 14 with the connection part 13 after the lead 4 is cut off, so that a resin-sealed semiconductor device manufacturing method which is high in productivity, kept free from resin burrs and scattering of the cut frames can be obtained.

公开(公告)号：JP2001077265A

公开(公告)日：2001-03-23

申请号：JP24752199

申请日：1999-09-01

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： TAKEMURA KUNIKAZU ,  NANO MASANORI ,  UCHIUMI KATSUKI ,  ADACHI OSAMU ,  MATSUO TAKAHIRO

IPC: H01L21/56 ,  H01L23/12 ,  H01L23/28 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To prevent metal burrs on the end surface of a lead portion by blade cutting in a lead cutting process after resin sealing. SOLUTION: When a resin sealed type semiconductor device is separated from a resin sealed lead frame by lead cutting, sealing resins 8a and 8b are formed on the top and the bottom, respectively of the lead portion 4 to be cut. By cutting the lead portion 4 together with these sealing resins 8a, 8b with a rotary blade 11, bent portions on a cut end surface of the lead portion can be prevented. Furthermore, by performing reciprocating blade cutting to cut the lead portion 4 twice, the bent inverted portion can be prevented. Therefore, a resin sealed semiconductor device wit high mounting reliability can be obtained without defects on the lead portion.

公开(公告)号：JP2001077264A

公开(公告)日：2001-03-23

申请号：JP24751999

申请日：1999-09-01

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MATSUO TAKAHIRO ,  TAKEMURA KUNIKAZU ,  UCHIUMI KATSUKI ,  NOMURA TORU

IPC: B23K26/00 ,  H01L21/50 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To prevent metal burrs on the end surface of a lead portion by blade cutting in a lead cutting process after resin sealing. SOLUTION: When a resin sealed semiconductor device is separated from a lead frame by lead cutting, a first cutting groove 13 is formed in the upper surface of a lead portion 4, and the lead thickness is reduced. Then, the first cutting groove 13 is irradiated with a laser, the remaining lead portion is removed, and the lead portion 4 is separated from the frame. Consequently, the warped portions (metal burrs) on the cut end surface portion of the lead portion can be prevented.