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公开(公告)号：EP3257969A1
公开(公告)日：2017-12-20
申请号：EP16748997.0
申请日：2016-01-21
Applicant: MEC COMPANY LTD.
Inventor： OGINO, Yuki , TOJIMA, Mami , HAYASHIZAKI, Masahiro , OTANI, Minoru
CPC classification number: C23F1/26 , C23F1/44 , H01L21/32133 , H05K3/108
Abstract: An object of the present invention is to provide: an etching liquid which is capable of etching titanium selectively in the presence of copper, and is further low in toxicity and excellent in storage stability; and an etching method using this etching liquid. The etching liquid of the present invention which is a liquid includes at least one acid selected from the group consisting of sulfuric acid, hydrochloric acid, and trichloroacetic acid, and at least one organic sulfur compound selected from the group consisting of a thioketone compound and a thioether compound, and makes it possible to etch titanium selectively in the presence of copper.
Abstract translation: 本发明的目的在于提供：在铜的存在下能够选择性蚀刻钛的蚀刻液，毒性更低，保存稳定性优异， 以及使用该蚀刻液的蚀刻方法。 作为液体的本发明的蚀刻液包含选自由硫酸，盐酸和三氯乙酸组成的组中的至少一种酸，以及选自由硫酮化合物和硫醇化合物组成的组中的至少一种有机硫化合物 硫醚化合物，并且使得有可能在铜的存在下选择性地蚀刻钛。
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Patent Agency Ranking2.发明公开
公开(公告)号：EP4410798A1
公开(公告)日：2024-08-07
申请号：EP23220281.2
申请日：2023-12-27
Applicant: MEC COMPANY., LTD.
Inventor： MORIKAWA, Koki , OGINO, Yuki , NISHIMINE, Jun
CPC classification number: C07F7/1804 , C09D5/00
Abstract: Provided is a chemical compound represented by the general formula (A), in which each of substituents Q1 to Q6 is bonded to a nitrogen atom of melamine backbone. In the general formula (A), at least one of Q1 to Q6 is X, and at least one of Q1 to Q6 is Y R1 is a hydrogen atom or an alkyl group having 1 to 12 carbon atoms. R2 is a hydrogen atom, or a monovalent hydrocarbon group selected from the group consisting of an alkyl group having 1 to 12 carbon atoms, an aryl group having 6 to 25 carbon atoms, and an aralkyl group having 7 to 30 carbon atoms. Each of R51 and R52 is a divalent organic group, and a is an integer of 1 to 3.
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3.发明授权
公开(公告)号：EP2878706B1
公开(公告)日：2016-11-09
申请号：EP13804745.1
申请日：2013-06-25
Applicant: MEC COMPANY LTD.
Inventor： KURII, Masayo , TAI, Kiyoto , NAKAMURA, Mami , OGINO, Yuki
IPC: C23F1/18 , H01L21/308 , H05K3/38
CPC classification number: C23F1/18 , H05K3/067 , H05K3/383 , H05K2203/0307 , H05K2203/0789
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4.发明公开
公开(公告)号：EP2878706A1
公开(公告)日：2015-06-03
申请号：EP13804745.1
申请日：2013-06-25
Applicant: MEC COMPANY LTD.
Inventor： KURII, Masayo , TAI, Kiyoto , NAKAMURA, Mami , OGINO, Yuki
IPC: C23F1/18 , H01L21/308 , H05K3/38
CPC classification number: C23F1/18 , H05K3/067 , H05K3/383 , H05K2203/0307 , H05K2203/0789
Abstract: Disclosed is a microetching solution, a replenishment solution added to said microetching solution and a method for production of a wiring board using said microetching solution. The microetching solution for copper consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, a polymer and a nonionic surfactant. The polymer is a water-soluble polymer including a polyamine chain and/ or a cationic group and having a weight average molecular weight of 1000 or more. In the microetching solution of the present invention, a value of A/B is 2000 to 9000 and a value of A/D is 500 to 9000, where a concentration of the halide ion is A% by weight, a concentration of the polymer is B% by weight and a concentration of the nonionic surfactant is D% by weight. Using this microetching solution, adhesion to a resin or the like can be uniformly maintained even with a low etching amount.
Abstract translation: 本发明提供一种微蚀刻剂，补充溶液加入到所述微蚀刻剂和用于生产使用所述微蚀刻剂的布线板的制造方法。 用于水溶液含有铜离子的有机酸，卤化物离子，聚合物和非离子表面活性的铜besteht的微蚀刻剂。 该聚合物是一种水溶性聚合物包含聚胺链和/或阳离子基团，并且具有1,000或更高的重均分子量。 在本发明的微蚀刻剂，A / B的值是2000到9000和A / D为500〜9000，其中所述卤化物离子的浓度按重量计为A％的值，该聚合物的浓度为 B％（重量），非离子表面活性剂的浓度为D％（重量）。 使用该微蚀刻溶液，粘接性树脂等能够即使在低蚀刻量被均匀地保持。
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5.发明公开
公开(公告)号：EP3680363A1
公开(公告)日：2020-07-15
申请号：EP18859430.3
申请日：2018-08-20
Applicant: MEC Company Ltd.
Inventor： OGINO, Yuki , SAKAMOTO, Takahiro , URUSHIBATA, Kaoru
Abstract: A microetching agent is an acidic aqueous solution containing an organic acid, cupric ions, and halide ions. The molar concentration of halide ion of the microetching agent is 0.005 to 0.1 mol/L. By bringing the microetching agent into contact with a copper surface, the copper surface is roughened. An average etching amount in the depth direction during roughening is preferably 0.4 µm or less. The microetching agent can impart on copper surfaces a roughened shape having excellent adhesiveness to resins and the like, even with a low etching amount.
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公开(公告)号：EP3257969B1
公开(公告)日：2020-04-22
申请号：EP16748997.0
申请日：2016-01-21
Applicant: MEC COMPANY LTD.
Inventor： OGINO, Yuki , TOJIMA, Mami , HAYASHIZAKI, Masahiro , OTANI, Minoru
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