公开(公告)号：EP2775808A4

公开(公告)日：2015-05-27

申请号：EP11874961

申请日：2011-10-31

Applicant: MEIKO ELECTRONICS CO LTD

Inventor： SHIMIZU RYOICHI ,  MATSUMOTO TOHRU ,  HASEGAWA TAKUYA ,  IMAMURA YOSHIO

IPC: H05K3/46

CPC classification number: H05K3/4038 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68359 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82132 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/14 ,  H05K1/0266 ,  H05K1/0269 ,  H05K1/115 ,  H05K1/118 ,  H05K1/188 ,  H05K3/303 ,  H05K3/421 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/09063 ,  H05K2201/09918 ,  H05K2203/063 ,  H05K2203/0703 ,  H05K2203/1461 ,  Y02P70/613 ,  Y10T29/49165

公开(公告)号：EP2624673A4

公开(公告)日：2014-12-03

申请号：EP10857881

申请日：2010-10-01

Applicant: MEIKO ELECTRONICS CO LTD

Inventor： TODA MITSUAKI ,  IMAMURA YOSHIO ,  HASEGAWA TAKUYA

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/182 ,  H05K1/0269 ,  H05K1/188 ,  H05K3/32 ,  H05K2201/09918 ,  H05K2201/10204 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A component-embedded substrate includes an electrically insulating base (11) of resin, an electric or electronic embedded component (8) and a dummy embedded component (7) both embedded in the insulating base (11), a conductor pattern (18) formed on at least one side of the insulating base (11) and connected directly to or indirectly via a connection layer (6) to the embedded component (8) and the dummy embedded component (7), and a mark (10) formed on a surface of the dummy embedded component (7) and used as a reference when the conductor pattern (18) is formed, whereby positional accuracy of the conductor pattern (18) relative to the embedded component (8) can be improved.