-
1.发明授权公开(公告)号：US11729516B2
公开(公告)日：2023-08-15
申请号：US17667646
申请日：2022-02-09
Applicant: Melexis Technologies NV
Inventor： Wouter Reusen , Adrian Hill , Luc Buydens
Abstract: A method of digitally processing an image comprises: generating an intensity distribution model (170) in respect of at least a portion of the array of sensing pixels (102) of a detector device (100). The array of sensing pixels comprises clusters of pixels. A pixel (140) from the array of sensing pixels is then selected (202) and a first distance and a second distance from the selected pixel to a first neighbouring pixel (142) and a second neighbouring pixel (144), respectively, are determined (402) and the intensity distribution model (170) referenced (406) by the first distance is used to calculate a first weight and a second weight to apply to the first and second neighbouring pixels, respectively. The first distance comprises an intra-cluster distance and the second distance comprises an inter-cluster distance, the intra-cluster distance being different from the inter-cluster distance. The first weight is applied (214) to the first neighbouring pixel (142) and the second weight is applied (214) to the second neighbouring pixel (144).
-
公开(公告)号：US11366016B2
公开(公告)日：2022-06-21
申请号：US16866698
申请日：2020-05-05
Applicant: Melexis Technologies NV
Abstract: A method of measuring temperature based upon a system of equations applying Stefan-Boltzmann's law and using a measurement value for an object to be measured and an ambient temperature value (Ta) comprises: pre-calculating (200, 202) a first vector (LUT1) and a second vector (LUT2). The first vector (LUT1) is a series of values proportional to received power based upon respective temperature values and in respect of a predetermined generic range of temperatures. The second vector (LUT2) is a series of sensitivity characteristic factor values based upon expected measured temperature values and in respect of a predetermined range of expected object measured temperatures. The first vector (LUT1) and the second vector (LUT2) are used (206) to generate a temporary vector (LUTT) of a series of values limited to the ambient temperature value to solve the system of equations in respect of the measurement value for the object, thereby determining (208) a temperature (To) for the object from the measurement value.
-
Patent Agency Ranking
公开(公告)号：US09267847B2
公开(公告)日：2016-02-23
申请号：US14744410
申请日：2015-06-19
Applicant: MELEXIS TECHNOLOGIES NV
Inventor： Viktor Kassovski , Luc Buydens , Sam Maddalena
CPC classification number: G01J5/12 , G01J5/0803 , G01J5/16 , G01J2005/0048 , G01J2005/066
Abstract: An infrared sensor for temperature sensing comprises a cap covering a substrate; an IR-radiation filtering window in the cap transparent to IR radiation; a first sensing element comprising a set of N thermocouples on the substrate covered by the cap, whose hot junctions may receive radiation; a second sensing element comprising a set of N thermocouples on the substrate covered by the cap whose hot junctions may not receive radiation; first connection modules for connecting a number N1 of thermocouples of the first sensing element, second connection modules for connecting a number N2 of thermocouples of the second sensing; connecting means for connecting an output of the first connection modules of the first sensing element with an output of the second connection modules of the second sensing element, and an output of the combined outputs of the sensing elements.
Abstract translation: 用于温度感测的红外传感器包括覆盖基板的盖子; IR辐射中的IR辐射过滤窗对IR辐射透明; 第一感测元件包括在由帽盖覆盖的衬底上的一组N个热电偶，其热接点可以接收辐射; 第二感测元件，包括一组N个热电偶，所述N个热电偶在所述基板上被所述盖子覆盖，所述盖子的热接头可能不接收辐射; 用于连接第一感测元件的N1个热电偶的第一连接模块，用于连接第二感测的热电偶的数量N2的第二连接模块; 连接装置，用于将第一感测元件的第一连接模块的输出与第二感测元件的第二连接模块的输出连接，以及感测元件的组合输出的输出。
-
公开(公告)号：US11959807B2
公开(公告)日：2024-04-16
申请号：US17512776
申请日：2021-10-28
Applicant: Melexis Technologies NV
Inventor： Jos Rennies , Wouter Reusen , Luc Buydens
IPC: G01J5/10 , H04N5/33 , H04N25/46 , H04N25/702 , G01J5/00
CPC classification number: G01J5/10 , H04N5/33 , H04N25/46 , H04N25/702 , G01J2005/0077 , G01J2005/106
Abstract: A thermal imaging apparatus comprising: a thermal detector device (100) comprising an array of thermal sensing pixels (102) and signal processing circuitry (104) coupled to the detector device (100). The circuitry (104) supports a background identifier (110) and a pixel classifier (112), the background identifier (110) comprising a common intensity identifier (114) and an expected background intensity calculator (116). The background identifier (110) receives pixel measurement data captured by the detector device (100) in respect of pixels of the array (102) and the common intensity identifier (114) identifies a largest number of substantially the same pixel intensity values from the pixel measurement data. The expected background intensity calculator (116) uses the largest number of substantially the same pixel intensity values to generate a model of expected background intensity levels. The pixel classifier (112) uses the model to determine whether an intensity measurement by a pixel (118) of the array (102) corresponds to a background or an object in an image.
-
公开(公告)号：US10809132B2
公开(公告)日：2020-10-20
申请号：US15785779
申请日：2017-10-17
Applicant: Melexis Technologies NV
Inventor： Luc Buydens
Abstract: An electronic device for measuring an ambient temperature (Tair) of the environment of an electronic device is described. It comprises at least one integrated infrared sensor, a blinded window preventing infrared radiation to directly impinge on the integrated infrared sensor and being in thermal contact with the environment as well as with a cover of the device resulting in the blinded window being at a surface temperature (Tsurface). The at least one integrated infrared sensor is adapted for sensing the temperature of the blinded window (Tsurface). The device also comprises at least one absolute temperature sensor for measuring a temperature of the at least one infrared sensor (Tsensor) itself, and a processing means for determining a temperature difference (ΔT) between the sensed surface temperature (Tsurface) and the temperature of the infrared sensor (Tsensor) and for calculating based thereon the ambient temperature (Tair).
-
公开(公告)号：US10096724B2
公开(公告)日：2018-10-09
申请号：US14951554
申请日：2015-11-25
Applicant: Melexis Technologies NV
Inventor： Carl Van Buggenhout , Appolonius Jacobus Van Der Wiel , Luc Buydens
IPC: H01L31/02 , B81B7/02 , G01J5/12 , H01L31/0203 , G01J5/04 , G01J5/08 , G01J1/02 , G01J5/02 , G01J5/06 , G01J1/42 , H01L31/0216 , H01L27/144 , H01L31/09 , H01L35/28 , H01L35/34
Abstract: A chip for radiation measurements, the chip comprising a first substrate comprising a first sensor and a second sensor. The chip moreover comprises a second substrate comprising a first cavity and a second cavity both with oblique walls. An internal layer is present on the inside of the second cavity. The second substrate is sealed to the first substrate with the cavities on the inside such that the first cavity is above the first sensor and the second cavity is above the second sensor.
-
公开(公告)号：US09239267B2
公开(公告)日：2016-01-19
申请号：US14744410
申请日：2015-06-19
Applicant: MELEXIS TECHNOLOGIES NV
Inventor： Viktor Kassovski , Luc Buydens , Sam Maddalena
Abstract: An infrared sensor for temperature sensing comprises a cap covering a substrate; an IR-radiation filtering window in the cap transparent to IR radiation; a first sensing element comprising a set of N thermocouples on the substrate covered by the cap, whose hot junctions may receive radiation; a second sensing element comprising a set of N thermocouples on the substrate covered by the cap whose hot junctions may not receive radiation; first connection modules for connecting a number N1 of thermocouples of the first sensing element, second connection modules for connecting a number N2 of thermocouples of the second sensing; connecting means for connecting an output of the first connection modules of the first sensing element with an output of the second connection modules of the second sensing element, and an output of the combined outputs of the sensing elements.
-
-
-
-
-
-
Search Results
7
records
(took 0.024 seconds)
