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    Electrochemically fabricated structures having dielectric or active bases
    1.
    发明专利
    Electrochemically fabricated structures having dielectric or active bases 未知

    公开(公告)号：AU2003234398A8

    公开(公告)日：2003-11-11

    申请号：AU2003234398

    申请日：2003-05-07

    Applicant: MEMGEN CORP

    Inventor： COHEN ADAM L ,  SMALLEY DENNIS R ,  THOMPSON JEFFREY A ,  LOCKARD MICHAEL S

    IPC: B81C1/00 ,  C25D5/02 ,  C25D1/00

    Abstract: Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are form from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurs during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

    ELECTROCHEMICALLY FABRICATED STRUCTURES HAVING DIELECTRIC OR ACTIVE BASES AND METHODS OF AND APPARATUS FOR PRODUCING SUCH STRUCTURES
    5.
    发明专利
    ELECTROCHEMICALLY FABRICATED STRUCTURES HAVING DIELECTRIC OR ACTIVE BASES AND METHODS OF AND APPARATUS FOR PRODUCING SUCH STRUCTURES 未知

    公开(公告)号：AU2003234398A1

    公开(公告)日：2003-11-11

    申请号：AU2003234398

    申请日：2003-05-07

    Applicant: MEMGEN CORP

    Inventor： THOMPSON JEFFREY A ,  COHEN ADAM L ,  LOCKARD MICHAEL S ,  SMALLEY DENNIS R

    IPC: B81C1/00 ,  C25D5/02 ,  C25D1/00

    Abstract: Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are form from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurs during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

    Electrochemically fabricated hermetically sealed microstructures
    7.
    发明专利
    Electrochemically fabricated hermetically sealed microstructures 未知

    公开(公告)号：AU2003228973A8

    公开(公告)日：2003-11-11

    申请号：AU2003228973

    申请日：2003-05-07

    Applicant: MEMGEN CORP

    Inventor： LEE CHRISTOPHER J ,  SMALLEY DENNIS R ,  COHEN ADAM L ,  ARAT VACIT ,  LOCKARD MICHAEL S

    IPC: B81B3/00 ,  G01P15/08 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/18 ,  H01P11/00 ,  H05K3/46 ,  C25D1/00 ,  C25D1/02

    Abstract: In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.

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