公开(公告)号：WO03050852A2

公开(公告)日：2003-06-19

申请号：PCT/US0239146

申请日：2002-12-06

Applicant: MEMGEN CORP ,  BANG CHRISTOPHER A ,  COHEN ADAM L ,  LOCKARD MICHAEL S ,  EVANS JOHN D

Inventor： BANG CHRISTOPHER A ,  COHEN ADAM L ,  LOCKARD MICHAEL S ,  EVANS JOHN D

IPC: B81B3/00 ,  B81C1/00 ,  G01P15/08 ,  G01P15/125 ,  H01P3/06 ,  H01P5/18 ,  H01P11/00 ,  H01L21/00

CPC classification number: H01P11/005 ,  B81B7/02 ,  B81B2201/042 ,  G01P15/0802 ,  G01P15/125 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00

Abstract: Various embodiments of the invention are directed to various microdevices including sensors, actuators, valves, scanning mirrors, accelerometers, switches, and the like. In some embodiments the devices are formed via electrochemical fabrication (EFAB TM )

Abstract translation: 本发明的各种实施例涉及包括传感器，致动器，阀，扫描反射镜，加速度计，开关等的各种微型装置。 在一些实施例中，通过电化学制造（EFAB TM TM）形成器件，

公开(公告)号：WO03095708A2

公开(公告)日：2003-11-20

申请号：PCT/US0314662

申请日：2003-05-07

Applicant: MEMGEN CORP

Inventor： BANG CHRISTOPHER A

IPC: B81B3/00 ,  B81C1/00 ,  C25D1/10 ,  C25D5/02 ,  G01P15/08 ,  G01P15/125 ,  C25D1/00

CPC classification number: G01P15/0802 ,  B33Y10/00 ,  B81B2201/042 ,  B81C99/0085 ,  B81C2201/0107 ,  B81C2201/0109 ,  B81C2201/0197 ,  G01P15/125

Abstract: Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFAB formation process), and typically contain features having resolutions within the 1 to 100 µm range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and iohardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.

Abstract translation: 提供了模制结构，制造模制结构的方法和设备。 用于模具的表面特征的至少一部分由多层电化学制造的结构（例如通过EFAB TM形成工艺制造）形成，并且通常包含具有在1至100μm范围内的分辨率的特征。 根据需要，将层状结构与其它模具部件组合，并将模塑材料注入模具中并进行硬化。 层压结构与任何其它模具部件一起被除去（例如通过蚀刻）以产生模塑制品。 在一些实施例中，分层结构的部分保留在模制品中，并且在其它实施例中，在部分或完全去除层状结构之后添加另外的模制材料。

公开(公告)号：AU2002360464A1

公开(公告)日：2003-06-17

申请号：AU2002360464

申请日：2002-12-03

Applicant: MEMGEN CORP

Inventor： BANG CHRISTOPHER A ,  COHEN ADAM L ,  LOCKARD MICHAEL S ,  SMALLEY DENNIS R ,  GROSSER MORTON ,  BROWN ELLIOTT R ,  EVANS JOHN D

IPC: B81B3/00 ,  G01P15/08 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/18 ,  H01P11/00 ,  H05K3/46 ,  H05K3/00

公开(公告)号：AU2002351289A1

公开(公告)日：2003-06-23

申请号：AU2002351289

申请日：2002-12-06

Applicant: MEMGEN CORP

Inventor： EVANS JOHN D ,  BANG CHRISTOPHER A ,  COHEN ADAM L ,  LOCKARD MICHAEL S

IPC: B81B3/00 ,  B81C1/00 ,  G01P15/08 ,  G01P15/125 ,  H01P3/06 ,  H01P5/18 ,  H01P11/00 ,  H01L21/00

公开(公告)号：AU2002360464A8

公开(公告)日：2003-06-17

申请号：AU2002360464

申请日：2002-12-03

Applicant: MEMGEN CORP

Inventor： COHEN ADAM L ,  SMALLEY DENNIS R ,  EVANS JOHN D ,  BANG CHRISTOPHER A ,  LOCKARD MICHAEL S ,  GROSSER MORTON ,  BROWN ELLIOTT R

IPC: B81B3/00 ,  G01P15/08 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/18 ,  H01P11/00 ,  H05K3/46

公开(公告)号：AU2003280468A1

公开(公告)日：2004-01-19

申请号：AU2003280468

申请日：2003-06-27

Applicant: MEMGEN CORP

Inventor： LOCKARD MICHAEL S ,  SMALLEY DENNIS R ,  GROSSER MORTON ,  BROWN ELLIOTT R ,  EVANS JOHN D ,  BANG CHRISTOPHER A ,  COHEN ADAM L

IPC: H01F41/04 ,  B81B3/00 ,  H01F17/00 ,  H01P1/12 ,  H01P1/18 ,  H01P1/202 ,  H01P3/06 ,  H01P5/08 ,  H01P5/16 ,  H01P5/18 ,  H01P5/22 ,  H01P11/00 ,  H01Q11/10

公开(公告)号：AU2003228975A8

公开(公告)日：2003-11-11

申请号：AU2003228975

申请日：2003-05-07

Applicant: MEMGEN CORP

Inventor： BANG CHRISTOPHER A

IPC: B81B3/00 ,  B81C1/00 ,  C25D1/10 ,  C25D5/02 ,  G01P15/08 ,  G01P15/125 ,  C25D1/00

Abstract: Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFAB™ formation process), and typically contain features having resolutions within the 1 to 100 μm range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.

公开(公告)号：AU2003228975A1

公开(公告)日：2003-11-11

申请号：AU2003228975

申请日：2003-05-07

Applicant: MEMGEN CORP

Inventor： BANG CHRISTOPHER A

IPC: B81B3/00 ,  B81C1/00 ,  C25D1/10 ,  C25D5/02 ,  G01P15/08 ,  G01P15/125 ,  C25D1/00

Abstract: Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFAB™ formation process), and typically contain features having resolutions within the 1 to 100 μm range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.