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公开(公告)号：FR2841995A1
公开(公告)日：2004-01-09
申请号：FR0208373
申请日：2002-07-04
Applicant: MEMSCAP
Inventor： DEHAN CHRISTOPHE , KATILA PEKKA , HELIN PHILIPPE
Abstract: The variable optical attenuator (1) comprises a microelectromechanical structure implemented on a substrate (2), including at least one shutter (31,33,34) whose position can be varied by an actuator with a mobile part (10) combined with the shutters in the form of beams with notches so that the shutter (31) interacts with a light beam (6) propagating from an input optical fibre (3) towards an output optical fibre (4). The mobile part (10) of the actuator can be displaced rotationally around an axis (11) perpendicular to the plane of the substrate, and the axis (11) is also an axis of rotational symmetry of the mobile part. The shutters are laid out in the thickness of the mobile part so to interact with the light beam (6) which propagates substantially in parallel with the rotational axis of the mobile part. The mobile part (10) of the actuator comprises several, in particular 3, zones (27) which cooperate with complementary zones (28) stationary with respect to the substrate, and the zones are distributed in angle around the rotational axis (11). In particular, the zones (27) are of electrostatic combs matching complementary combs of the stationary zones (28). The mobile part (10) is linked to a fixed central platform (24) situated at the center of gravity of the mobile part, and an application of a polarization voltage to the pairs of combs (27,28) causes a rotational motion including slight bending of beams (23) so that the shutter (31) intercepts the light beam (6) at the level of angular notch section. The middle beams (23) joined to the central platform (24) also serve to return the mobile part to its stationary position. The attenuator (claimed) functions by transmission, or by reflection when the shutter (31) comprises a reflecting part.
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公开(公告)号：FR2838422A1
公开(公告)日：2003-10-17
申请号：FR0204519
申请日：2002-04-11
Applicant: MEMSCAP
Inventor： DEHAN CHRISTOPHE
Abstract: The method comprises the steps of preparing the wafers of a substrate, the steps of transforming the wafers of the substrate allowing to define the micro-electro-mechanical structures within the same substrate, and the later steps of processing the wafers or the fractions of wafers of the substrate including the micro-electro-mechanical structures. At the start of the steps of transforming the wafers or the fractions of wafers of the substrate, and also eventual supplementary elements susceptible to come in contact with the wafers or the fractions of wafers of the substrate, are placed on support organs; and the support organs are placed in containers for transport and storage ensuring a protection with respect to particulate contamination and electrostatic discharges. The containers for transport and storage are of type closed case. The storage containers are of type Front Opening Universal Pod (FOUP), which can ensure the transport of the wafers of the substrate of 300 mm, and also of type Standard Mechanical InterFace (SMIF) cases for the wafers of size 150-200 mm. The dimensions of the support organs are analogous to those of the wafers of the substrate which can be stored in the containers for transport and storage. The substrate is for example of semiconductor material, glass, quartz, or other material.
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