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    1.
    发明专利
    未知

    公开(公告)号：FR2791470A1

    公开(公告)日：2000-09-29

    申请号：FR9903762

    申请日：1999-03-23

    Applicant: MEMSCAP

    Inventor： BASTERES LAURENT ,  MHANI AHMED ,  VALENTIN FRANCOIS ,  KARAM JEAN MICHEL

    IPC: H01F17/00 ,  H01L21/02 ,  H01L23/522 ,  H01L27/04 ,  H01L21/822 ,  H01L21/30 ,  H01L49/00 ,  H01F5/00

    Abstract: An IC (1), with a thick copper induction winding (20) located above a passivation layer (6) and having depending ends (12) connected to contact pads (5), is new. A new monolithic IC (1) has metallic contact pads (5), extending from flush with the upper surface (6) of a passivation layer (4) to an underlying semiconductor substrate layer (2), and an induction coil winding (20) which is located in a plane parallel to the passivation layer upper surface (6) and which consists of copper turns (21, 22, 23, 27, 28) of greater than 10 microns thickness, the winding ends (12) extending below the winding plane for connection to the contact pads (5). An Independent claim is also included for manufacturing a monolithic IC incorporating an inductive component by: (a) depositing a polyimide or benzocyclobutene layer on a semiconductor substrate (2) which is covered with a passivation layer (4) and which has metallic contact pads (5) extending from the passivation layer upper surface (6) to the substrate (2); (b) depositing a silica layer (16) on the polyimide or benzocyclobutene layer; (c) forming openings in the silica and polyimide or benzocyclobutene layers down to the contact pads (5); (d) applying a metal growth layer and a photosensitive resin layer on the structure; (e) exposing and developing the resin to form the lower face of the inductive component; (f) electrodepositing a copper layer on the exposed zones of the metal growth layer to form the inductive component strip; and (g) removing residues of the resin and the metal growth layer.

    2.
    发明专利
    未知

    公开(公告)号：FR2791470B1

    公开(公告)日：2001-06-01

    申请号：FR9903762

    申请日：1999-03-23

    Applicant: MEMSCAP

    Inventor： BASTERES LAURENT ,  MHANI AHMED ,  VALENTIN FRANCOIS ,  KARAM JEAN MICHEL

    IPC: H01F17/00 ,  H01L21/02 ,  H01L23/522 ,  H01L27/04 ,  H01L21/822 ,  H01L21/30 ,  H01L49/00 ,  H01F5/00

    Abstract: An IC (1), with a thick copper induction winding (20) located above a passivation layer (6) and having depending ends (12) connected to contact pads (5), is new. A new monolithic IC (1) has metallic contact pads (5), extending from flush with the upper surface (6) of a passivation layer (4) to an underlying semiconductor substrate layer (2), and an induction coil winding (20) which is located in a plane parallel to the passivation layer upper surface (6) and which consists of copper turns (21, 22, 23, 27, 28) of greater than 10 microns thickness, the winding ends (12) extending below the winding plane for connection to the contact pads (5). An Independent claim is also included for manufacturing a monolithic IC incorporating an inductive component by: (a) depositing a polyimide or benzocyclobutene layer on a semiconductor substrate (2) which is covered with a passivation layer (4) and which has metallic contact pads (5) extending from the passivation layer upper surface (6) to the substrate (2); (b) depositing a silica layer (16) on the polyimide or benzocyclobutene layer; (c) forming openings in the silica and polyimide or benzocyclobutene layers down to the contact pads (5); (d) applying a metal growth layer and a photosensitive resin layer on the structure; (e) exposing and developing the resin to form the lower face of the inductive component; (f) electrodepositing a copper layer on the exposed zones of the metal growth layer to form the inductive component strip; and (g) removing residues of the resin and the metal growth layer.

    4.
    发明专利
    未知

    公开(公告)号：FR2790328B1

    公开(公告)日：2001-04-20

    申请号：FR9902658

    申请日：1999-02-26

    Applicant: MEMSCAP

    Inventor： BARTERES LAURENT ,  MHANI AHMED ,  VALENTIN FRANCOIS ,  KARAM JEAN MICHEL

    IPC: H01F27/28 ,  H01F17/00 ,  H01L21/822 ,  H01L23/64 ,  H01L27/04 ,  H01F21/00

    Abstract: An inductive component (1) comprises a quartz substrate (2) and a planar inductor coil of copper strip (3) of specified thickness. A novel inductive component (1) comprises a quartz substrate layer (2) and a planar inductor formed of a spirally wound copper strip (3) of greater than 10 mu m thickness. Independent claims are also included for the following: (i) an integrated transformer comprising a quartz substrate (2) and two planar inductor coils which are wound within one another and which are formed of copper strip (3) of greater than 10 mu m thickness; and (ii) an IC associated with the above inductive component or integrated transformer mounted by means of conductive spacer elements which provide electrical connections between IC connection pads and connection terminals of the inductive component or integrated transformer, the inductive component or integrated transformer being oriented with respect to the IC such that its face including the inductors faces the IC. Preferred Features: The strip is about 30 mu m thick. A polyimide layer is provided between the inductor (3) and the substrate (2) and within the strip segment (8) connecting the coil center (9) to the strip end (10) forming a connection terminal. The strip is coated with a gold layer on its surfaces other than those in contact with the substrate or the polyimide layer and the spaces between the facing surfaces of adjacent windings is free from any material. The strip forms a circular spiral or two parallel series-connected spirals, the spiral nearest the substrate being embedded in a polyimide layer which is covered with a silica barrier layer. Spacer elements, of height close to the strip thickness, are mounted on the connection terminal-forming ends of the strip and have a cylindrical shape with a diameter of about three times their height.

    9.
    发明专利
    未知

    公开(公告)号：FR2790328A1

    公开(公告)日：2000-09-01

    申请号：FR9902658

    申请日：1999-02-26

    Applicant: MEMSCAP

    Inventor： BARTERES LAURENT ,  MHANI AHMED ,  VALENTIN FRANCOIS ,  KARAM JEAN MICHEL

    IPC: H01F27/28 ,  H01F17/00 ,  H01L21/822 ,  H01L23/64 ,  H01L27/04 ,  H01F21/00

    Abstract: An inductive component (1) comprises a quartz substrate (2) and a planar inductor coil of copper strip (3) of specified thickness. A novel inductive component (1) comprises a quartz substrate layer (2) and a planar inductor formed of a spirally wound copper strip (3) of greater than 10 mu m thickness. Independent claims are also included for the following: (i) an integrated transformer comprising a quartz substrate (2) and two planar inductor coils which are wound within one another and which are formed of copper strip (3) of greater than 10 mu m thickness; and (ii) an IC associated with the above inductive component or integrated transformer mounted by means of conductive spacer elements which provide electrical connections between IC connection pads and connection terminals of the inductive component or integrated transformer, the inductive component or integrated transformer being oriented with respect to the IC such that its face including the inductors faces the IC. Preferred Features: The strip is about 30 mu m thick. A polyimide layer is provided between the inductor (3) and the substrate (2) and within the strip segment (8) connecting the coil center (9) to the strip end (10) forming a connection terminal. The strip is coated with a gold layer on its surfaces other than those in contact with the substrate or the polyimide layer and the spaces between the facing surfaces of adjacent windings is free from any material. The strip forms a circular spiral or two parallel series-connected spirals, the spiral nearest the substrate being embedded in a polyimide layer which is covered with a silica barrier layer. Spacer elements, of height close to the strip thickness, are mounted on the connection terminal-forming ends of the strip and have a cylindrical shape with a diameter of about three times their height.

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