公开(公告)号：JP2001284516A

公开(公告)日：2001-10-12

申请号：JP2001073168

申请日：2001-03-14

Applicant: MICROCHIP TECH INC

Inventor： FERNANDEZ JOSEPH ,  TERMER DAN ,  RICHARDSON DAVID ALAN

IPC: H01L23/50 ,  H01L21/52 ,  H01L23/495

Abstract: PROBLEM TO BE SOLVED: To obtain a lead frame equipping structure in which a contact region between the lead frame mounting structure and an integrated circuit die and to obtain a designing method in which a stress generated by thermal expansion can be dispersed to a bigger region than the die between points with which the lead frame is contacted. SOLUTION: This method in which an integrated circuit die is mounted in a mounting structure contains a step of forming the mounting structure having a die pad and a spreader at least, a step of mounting a contact part on the die pad of the mounting structure and the one spreader at least and a step of the one spreader at least existing between the die pad and the integrated circuit die.