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    STRESS REDUCTION FOR LEAD FRAME DURING PLASTIC SEALING
    1.
    发明专利
    STRESS REDUCTION FOR LEAD FRAME DURING PLASTIC SEALING 失效

    公开(公告)号：JP2001284516A

    公开(公告)日：2001-10-12

    申请号：JP2001073168

    申请日：2001-03-14

    Applicant: MICROCHIP TECH INC

    Inventor： FERNANDEZ JOSEPH ,  TERMER DAN ,  RICHARDSON DAVID ALAN

    IPC: H01L23/50 ,  H01L21/52 ,  H01L23/495

    Abstract: PROBLEM TO BE SOLVED: To obtain a lead frame equipping structure in which a contact region between the lead frame mounting structure and an integrated circuit die and to obtain a designing method in which a stress generated by thermal expansion can be dispersed to a bigger region than the die between points with which the lead frame is contacted. SOLUTION: This method in which an integrated circuit die is mounted in a mounting structure contains a step of forming the mounting structure having a die pad and a spreader at least, a step of mounting a contact part on the die pad of the mounting structure and the one spreader at least and a step of the one spreader at least existing between the die pad and the integrated circuit die.

    COMBINED INDUCTION COIL IN SINGLE LEAD FRAME PACKAGE, INTEGRATED CIRCUIT SEMICONDUCTOR CHIP, AND COMBINING METHOD
    2.
    发明专利
    COMBINED INDUCTION COIL IN SINGLE LEAD FRAME PACKAGE, INTEGRATED CIRCUIT SEMICONDUCTOR CHIP, AND COMBINING METHOD 失效

    公开(公告)号：JP2000124388A

    公开(公告)日：2000-04-28

    申请号：JP33880099

    申请日：1999-11-29

    Applicant: MICROCHIP TECH INC

    Inventor： FUREY LEE ,  FERNANDEZ JOSEPH

    IPC: H01L23/12 ,  G06K19/077 ,  H01L23/495 ,  H01L23/50 ,  H01L25/00

    Abstract: PROBLEM TO BE SOLVED: To function an induction coil as an antenna of a chip by a method wherein a lead frame having a coil structure and an integrated circuit semiconductor chip are combined within a single lead frame package, and the chip is electrically connected to a part of the coil structure of the lead frame. SOLUTION: A package 10 contains a plastic sealing envelope 12, and a lead frame structure 14 of an induction coil shape/structure is housed in the plastic sealing envelope 12. Two terminal pads 26, 28 of an integrated circuit semiconductor chip 24 are connected to an outside end part 30 and an inside end part 32 of an induction coil 14 via conductive wire bonds 34, 36. When the chip 24 is a transmitter type integrated circuit semiconductor chip, generated electric signals are transmitted to the induction coil 14 functioning as a transmission antenna. Furthermore, when the chip 24 is a receiver type integrated circuit semiconductor chip, electric signals are received by the induction coil 14 functioning as a reception antenna.

    INTEGRATED-CIRCUIT SEMICONDUCTOR CHIP AND SINGLE-SIDED PACKAGE CONTAINING INDUCTIVE COIL AND MANUFACTURE THEREOF
    3.
    发明专利
    INTEGRATED-CIRCUIT SEMICONDUCTOR CHIP AND SINGLE-SIDED PACKAGE CONTAINING INDUCTIVE COIL AND MANUFACTURE THEREOF 失效

    公开(公告)号：JPH11177027A

    公开(公告)日：1999-07-02

    申请号：JP26053198

    申请日：1998-09-14

    Applicant: MICROCHIP TECH INC

    Inventor： FERNANDEZ JOSEPH ,  FUREY LEE

    IPC: H01L21/822 ,  G06K19/077 ,  H01L23/64 ,  H01L27/04

    Abstract: PROBLEM TO BE SOLVED: To obtain a substrate having excellent deposition and adhesive characteristics of a gold-flash evaporated layer forming an inductive coil by installing the single substrate, the inductive coil placed on one surface of the single substrate and at least one terminal pad electrically connected to at least a part of the inductive coil in a single-sided package. SOLUTION: A gold flash layer having gold in thickness of 7 μ inch is evaporated through a mask, and the coil 10 is formed onto the top face of the substrate 12. The substrate 12 is formed of an epoxy glass plate type material known as an FR4 epoxy glass plate. The chip 14 is mounted on the inside of the inductive coil 10 as the same side as the inductive coil 10 of the substrate 12, and a wire-bonding electrical- connection wiring 18 is formed to sections up to an inductive spot 22 on the substrate 12 from the end section 20 of the outer circumferential turn of the inductive coil 10 and further sections up to the terminal pad 24 of the chip 14 by using a wire bonding technique. Another inductive wire bonding 26 is mounted for connecting the end section 28 of the inner circumferential turn of the inductive coil 10 to the terminal pad 30 of the chip 14.

    INDUCTION COIL AND INTEGRATED CIRCUIT SEMICONDUCTOR CHIP COMBINED IN SINGLE LEAD FRAME PACKAGE AND METHOD FOR COMBINING THE SAME
    4.
    发明专利
    INDUCTION COIL AND INTEGRATED CIRCUIT SEMICONDUCTOR CHIP COMBINED IN SINGLE LEAD FRAME PACKAGE AND METHOD FOR COMBINING THE SAME 失效

    公开(公告)号：JPH11154727A

    公开(公告)日：1999-06-08

    申请号：JP26214998

    申请日：1998-09-16

    Applicant: MICROCHIP TECH INC

    Inventor： FUREY LEE ,  FERNANDEZ JOSEPH

    IPC: H01L23/12 ,  G06K19/077 ,  H01L23/495 ,  H01L23/50 ,  H01L25/00

    Abstract: PROBLEM TO BE SOLVED: To bond an integrated circuit semiconductor chip and a passive element to a single lead frame package, by combining a lead frame arranged in a horizontal plane with the integrated circuit semiconductor chip having terminal pads electrically connected to the coil structure portion of the lead frame. SOLUTION: A package 10 includes a plastic sealing envelope 12 receiving a lead frame structure 14 shaped like an induction coil. The lead frame structure 14 has three tie members 16, for example, which are cut off from the neighboring tie member of a coil-shaped lead frame having the same structure. The tie bar 16 has a function of holding a die paddle in the same plane as a coil 14. Two terminal pads 26, 28 of an integrated circuit semiconductor chip 24 are connected to an outer end portion 30 and an inner end portion 32 of the induction coil 14 by conductive wire bondings 34, 36, respectively.

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