公开(公告)号：WO1997036325A1

公开(公告)日：1997-10-02

申请号：PCT/US1997004827

申请日：1997-03-24

Applicant: MICROMODULE SYSTEMS

Inventor： MICROMODULE SYSTEMS ,  McGRAW, Mark, T. ,  GRISWOLD, Bradley, L. ,  HO, Chung, Wen ,  MIN, Byong-Youl ,  GROVE, Michael, I. ,  ROBINETTE, William, C.

IPC: H01L23/34

CPC classification number: H01L23/5389 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/5387 ,  H01L24/48 ,  H01L25/0652 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A thin MCM packaging structure (10) and technique is provided in which a thin film decal interconnect circuit (16) is fabricated on a thin aluminum wafer (22). The thin film decal interconnect (16) employs AU metallurgy for bonding and comprises a bond pad/ground plane layer, topside pads, and one or more routing layers. The top routing layer also acts as the pad layer along the edge of the interconnect structure (16). The underside of the decal interconnect structure (16) is provided with metal pads for attachment to conventional aluminum or gold I/O pads on one surface of the integrated circuit die (12). A thermosonic bonding system is used to bond the die pads (66) to the pads. The aluminum wafer is selectively removed forming one or more cavities (18, 20) to hold one or more die (12, 14) to be mounted on the MCM structure (10). The dies (12, 14) are oriented with their pads (66, 70) in contact with contact pads on the thin film decal interconnect (16) to which they are bonded and cavities (18, 20) are filled with a liquid encapsulant (26) and cured. A lead frame has inner bond leads electrically bonded to bonding pads (122) of the thin film multilayer interconnect circuit disposed about periphery thereof and a multilayer laminate board is mechanically bonded over the thin film multilayer interconnect circuit (16) and over the inner bond leads of the lead frame (120) and has a first layer (124) including conductive pads (130) extending outward from about an inner periphery thereof, and a second layer including apertures (136) aligned with outwardly extending portions of the conductive pads (130).

Abstract translation: 提供了一种薄MCM封装结构（10）和技术，其中在薄铝晶片（22）上制造薄膜贴片互连电路（16）。 薄膜贴片互连（16）采用AU冶金结合，并包括接合焊盘/接地平面层，顶层焊盘和一个或多个布线层。 顶部路由层还沿着互连结构（16）的边缘充当焊盘层。 贴花互连结构（16）的下侧设置有用于附接到集成电路管芯（12）的一个表面上的常规铝或金I / O焊盘的金属焊盘。 使用热超声键合系统将芯片焊盘（66）连接到焊盘。 铝晶片被选择性地移除，形成一个或多个空腔（18,20）以保持要安装在MCM结构（10）上的一个或多个管芯（12,14）。 模具（12,14）被定向成使它们的垫片（66,70）与它们所接合的薄膜贴片互连（16）上的接触焊盘接触，并且空腔（18,20）填充有液体密封剂 26）并固化。 引线框架具有电连接到设置在其周围的薄膜多层互连电路的接合焊盘（122）的内部接合引线，并且多层层压板机械地接合在薄膜多层互连电路（16）上并且在内部接合引线 ，并且具有包括从其内周向外延伸的导电焊盘（130）的第一层（124），以及包括与所述导电焊盘（130）的向外延伸部分对准的孔（136）的第二层 ）。