公开(公告)号：WO1996007924A1

公开(公告)日：1996-03-14

申请号：PCT/US1995011273

申请日：1995-09-08

Applicant: MICROMODULE SYSTEMS

Inventor： MICROMODULE SYSTEMS ,  LIU, Ken, Kuang-Fu ,  MIN, Byoung-Youl ,  MOTI, Robert, John ,  HUSAIN, Syed, A.

IPC: G01R31/02

CPC classification number: G01R1/0735

Abstract: First and second bumps (9) electrically connected at first and second positions (62, 63) along a conductive run (52) borne by a flexible substrate (10) are respectively oriented for contact with a pad (8) of a die (2) under test and a pad (20) of a tester structure (1). Second (66, 98) and third (68, 100) conductive regions are electrically connected respectively to the power (Vcc) and ground (Vss) terminals of a power source and an electrical device. The second and third regions are spaced from a first conductive region (68, 91) to filter high-frequency noise components from power and ground potentials provided by the power source.

Abstract translation: 沿着由柔性基板（10）承载的导电线（52）在第一和第二位置（62,63）处电连接的第一和第二凸块（9）分别被定向成与模具（2）的焊盘（8）接触 ）和测试器结构（1）的垫（20）。 第二（66,98）和第三（68,100）导电区域分别电连接到电源和电气设备的功率（Vcc）和接地（Vss）端子。 第二和第三区域与第一导电区域（68,91）间隔开以从由电源提供的功率和接地电位滤除高频噪声分量。

公开(公告)号：WO1996007921A1

公开(公告)日：1996-03-14

申请号：PCT/US1995011275

申请日：1995-09-08

Applicant: MICROMODULE SYSTEMS ,  TOKYO ELECTRON LIMITED

Inventor： MICROMODULE SYSTEMS ,  TOKYO ELECTRON LIMITED ,  LIU, Ken, Kuang-Fu ,  MIN, Byoung-Youl ,  SATO, Kunio ,  SATO, Takashi

IPC: G01R01/073

CPC classification number: G01R1/0735

Abstract: First (46) and second (62, 63) bumps electrically connected at first and second positions along a conductive run (52) borne by a flexible substrate (10) are respectively oriented for contact with a pad (8) of a die under test (2) and a pad (88, 89) of a tester. A probe frame (32) is bonded to the substrate between connector frames (34) bonded at opposite ends of the substrate (10). Alternatively, a pair of bumps (46, and 62, 63) exposed on the same surface of a flexible substrate (10) are electrically connected at different positions along on conductive run (52). One of the bumps (46) is oriented for contact with a pad (8) of a die under test (2), and the other (62, 63) is in contact with a pad (88, 89) on a surface of a printed circuit board (5) directed away from the die (2). The pad (88, 89) of the printed circuit board (5) is provided for electrical connection to a tester.

Abstract translation: 在沿着由柔性基板（10）承载的导电行程（52）的第一和第二位置电连接的第一（46）和第二（62,63）凸块分别被定向成与被测试的模具的焊盘（8）接触 （2）和测试器的垫（88,89）。 在基板（10）的相对端处接合的连接器框架（34）之间将探针框架（32）接合到基板。 或者，暴露在柔性基板（10）的相同表面上的一对凸块（46,62,63）沿着导电行程（52）在不同位置电连接。 凸块（46）中的一个被定向成与被测试模具（2）的焊盘（8）接触，另一个（62,63）与焊盘（88,89）接触， 印刷电路板（5）远离模具（2）。 印刷电路板（5）的焊盘（88,89）被设置用于与测试仪电连接。

公开(公告)号：EP0779989A1

公开(公告)日：1997-06-25

申请号：EP95931069.0

申请日：1995-09-08

Applicant: MICROMODULE SYSTEMS, INC.

Inventor： LIU, Ken, Kuang-Fu ,  MIN, Byoung-Youl ,  MOTI, Robert, John ,  HUSAIN, Syed, A.

IPC: G01R1 ,  H01L21

CPC classification number: G01R1/0735

Abstract: First and second bumps (9) electrically connected at first and second positions (62, 63) along a conductive run (52) borne by a flexible substrate (10) are respectively oriented for contact with a pad (8) of a die (2) under test and a pad (20) of a tester structure (1). Second (66, 98) and third (68, 100) conductive regions are electrically connected respectively to the power (Vcc) and ground (Vss) terminals of a power source and an electrical device. The second and third regions are spaced from a first conductive region (68, 91) to filter high-frequency noise components from power and ground potentials provided by the power source.

公开(公告)号：EP0779987A1

公开(公告)日：1997-06-25

申请号：EP95931721.0

申请日：1995-09-08

Applicant: MICROMODULE SYSTEMS, INC. ,  TOKYO ELECTRON LIMITED

Inventor： LIU, Ken, Kuang-Fu ,  MIN, Byoung-Youl ,  SATO, Kunio ,  SATO, Takashi

IPC: G01R1 ,  H01L21

CPC classification number: G01R1/0735

Abstract: First (46) and second (62, 63) bumps electrically connected at first and second positions along a conductive run (52) borne by a flexible substrate (10) are respectively oriented for contact with a pad (8) of a die under test (2) and a pad (88, 89) of a tester. A probe frame (32) is bonded to the substrate between connector frames (34) bonded at opposite ends of the substrate (10). Alternatively, a pair of bumps (46, and 62, 63) exposed on the same surface of a flexible substrate (10) are electrically connected at different positions along on conductive run (52). One of the bumps (46) is oriented for contact with a pad (8) of a die under test (2), and the other (62, 63) is in contact with a pad (88, 89) on a surface of a printed circuit board (5) directed away from the die (2). The pad (88, 89) of the printed circuit board (5) is provided for electrical connection to a tester.

Abstract translation: 沿着由柔性基板（10）承载的导电路径（52）在第一位置和第二位置处电连接的第一（46）和第二（62,63）凸块分别定向用于与被测试芯片的焊盘（8） （2）和测试器的衬垫（88,89）。 探针框架（32）在基底（10）的相对端处结合的连接器框架（34）之间结合到基底。 或者，暴露在柔性衬底（10）的同一表面上的一对凸块（46和62,63）在导电线路（52）上沿不同位置电连接。 其中一个凸起（46）被定向用于与被测试的模具（2）的垫（8）接触，并且另一个（62,63）与一个表面上的垫（88,89）接触 印制电路板（5）远离模具（2）。 印刷电路板（5）的垫（88,89）被提供用于电连接到测试器。