公开(公告)号：US20140246801A1

公开(公告)日：2014-09-04

申请号：US13782752

申请日：2013-03-01

Applicant: MICRONIT MICROFLUIDICS B.V.

Inventor： Marinus Bernardus OLDE RIEKERINK ,  Wilfred BUESINK ,  Arenda Hendrika Jacoba KOELEWIJN-HUBERS ,  Marko Theodoor BLOM ,  Ronny VAN 'T OEVER

IPC: B29C63/00

CPC classification number: B01L3/502707 ,  B01J2219/00286 ,  B01J2219/00585 ,  B01J2219/00637 ,  B01L9/527 ,  B01L2300/0816 ,  B01L2300/0883 ,  B01L2300/16 ,  B29C69/005 ,  B29C70/545 ,  B29C2793/0009 ,  B29C2793/0027 ,  B29C2793/0063 ,  B81B2201/058 ,  B81C1/00206 ,  Y10T137/8593 ,  Y10T156/1052

Abstract: The invention relates to a method for manufacturing microfluidic chips having at least one capillary for through-flow of a fluid, comprising the steps of: (a) providing a starting material; (b) forming at least one shared capillary in the starting material, said shared capillary comprising an fluidic inlet and an fluidic outlet; (c) functionalizing the chips by supplying a functionalization fluid to the shared capillary; and (d) dividing the starting material into separate chips. The invention further relates to a device for functionalizing microfluidic chips having at least one capillary for through-flow of a fluid, said device comprising a material holder for holding a starting material in a fixed position during functionalization, said material holder comprising at least one inlet connector for connecting at least one shared capillary formed in the starting material to a functionalization fluid supply.The invention further relates to a microfluidic chip and a device for holding a microfluidic chip.

Abstract translation: 本发明涉及一种用于制造具有至少一个用于流体流通的毛细管的微流体芯片的方法，包括以下步骤：（a）提供起始材料; （b）在原料中形成至少一个共用毛细管，所述共用毛细管包括流体入口和流体出口; （c）通过向共用毛细管提供官能化流体来使芯片功能化; 和（d）将原料分成单独的碎片。 本发明还涉及一种用于对具有至少一个用于流体流通的毛细管进行功能化的微流体芯片的装置，所述装置包括用于在官能化期间将起始材料保持在固定位置的材料保持器，所述材料保持器包括至少一个入口 连接器，用于将形成在起始材料中的至少一个共用毛细管连接到功能化流体供应源。 本发明还涉及微流控芯片和用于保持微流控芯片的装置。

公开(公告)号：US20170045504A1

公开(公告)日：2017-02-16

申请号：US15233427

申请日：2016-08-10

Applicant: Micronit Microfluidics B.V. ,  Janssen Pharmaceutica NV ,  NXP B.V.

Inventor： Marko Theodoor BLOM ,  Monica BRIVIO ,  Simone TANZI ,  Simon REUVEKAMP ,  Bieke VAN DORST ,  Lieven Jozef STUYVER ,  Elfried VAN DER SAR

IPC: G01N33/543 ,  B01L3/00

CPC classification number: G01N33/54313 ,  B01L3/502715 ,  B01L3/50273 ,  B01L3/502761 ,  B01L2200/0668 ,  B01L2300/0627 ,  B01L2300/0816 ,  B01L2300/0851 ,  B01L2300/0858 ,  B01L2400/0406 ,  B01L2400/086 ,  G01N33/54386

Abstract: The invention relates to a channel for trapping particles to be fed to the channel with a fluid. The invention further relates to a flow cell comprising such a channel. The invention also relates to an assembly comprising such a flow cell and a detection means. The invention also relates to a method for trapping particles in such a channel. And finally, the invention relates to a method for analyzing a sample using such an assembly.

Abstract translation: 本发明涉及一种用于捕获要用流体供给到通道的颗粒的通道。 本发明还涉及包括这种通道的流动池。 本发明还涉及一种包括这种流动池和检测装置的组件。 本发明还涉及在这种通道中捕获颗粒的方法。 最后，本发明涉及使用这种组件分析样品的方法。

公开(公告)号：US20170183223A1

公开(公告)日：2017-06-29

申请号：US15402966

申请日：2017-01-10

Applicant: Micronit Microfluidics B.V.

Inventor： Ronny VAN 'T OEVER ,  Marko Theodoor BLOM ,  Jeroen HANEVELD ,  Johannes OONK ,  Marinus Bernardus OLDE RIEKERINK ,  Peter TIJSSEN ,  Hendrik Jan Hildebrand TIGELAAR ,  Jean-Noël FEHR ,  Jean-Christophe ROULET ,  Amitava GUPTA

IPC: B81C1/00 ,  C23F1/02

CPC classification number: B81C1/00269 ,  B81B2201/058 ,  B81C3/001 ,  B81C2201/0132 ,  B81C2203/0118 ,  B81C2203/019 ,  C23F1/02 ,  H01L21/50 ,  H01L23/10 ,  H01L2924/0002 ,  Y10T428/239 ,  H01L2924/00

Abstract: The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.