公开(公告)号：ITMI20081505A1

公开(公告)日：2010-02-09

申请号：ITMI20081505

申请日：2008-08-08

Applicant: MILANO POLITECNICO ,  ST MICROELECTRONICS SRL

Inventor： CAMPARDO GIOVANNI ,  LOSAVIO ALDO ,  PULICI PAOLO ,  STOPPINO PIER PAOLO ,  VANALLI GIAN PIETRO

公开(公告)号：IT1391239B1

公开(公告)日：2011-12-01

申请号：ITMI20081505

申请日：2008-08-08

Applicant: MILANO POLITECNICO ,  ST MICROELECTRONICS SRL

Inventor： STOPPINO PIER PAOLO ,  VANALLI GIAN PIETRO ,  CAMPARDO GIOVANNI ,  LOSAVIO ALDO ,  PULICI PAOLO

公开(公告)号：ITMI20070098A1

公开(公告)日：2008-07-25

申请号：ITMI20070098

申请日：2007-01-24

Applicant: MILANO POLITECNICO ,  ST MICROELECTRONICS SRL

Inventor： BARTOLINI MICHELE ,  PULICI PAOLO ,  STOPPINO PIER PAOLO

公开(公告)号：DE602005020005D1

公开(公告)日：2010-04-29

申请号：DE602005020005

申请日：2005-09-09

Applicant: ST MICROELECTRONICS SRL

Inventor： RIPAMONTI GIANCARLO ,  PULICI PAOLO ,  VANALLI GIAN PIETRO ,  LESSIO TITO ,  STOPPINO PIER PAOLO

IPC: H01F17/00 ,  H01F41/04 ,  H01L21/02 ,  H01L23/64

Abstract: An inductive structure is described of the type comprising at least one winding (2) or at least one coil (5) and developed around a ferromagnetic core (3). Advantageously, the ferromagnetic core (3) is realised by means of a multilayer ferromagnetic structure and the inductive structure (1) is integrated in an electronic device (11). An inductor, a transformer, a sensor and a relay are also described being realised by means of the inductive structure (1) proposed, as well as a method for integrating it in a package of an electronic device (11).

公开(公告)号：ITMI20050607A1

公开(公告)日：2006-10-12

申请号：ITMI20050607

申请日：2005-04-11

Applicant: ST MICROELECTRONICS SRL

Inventor： CAMPARDO GIOVANNI ,  DOSSI ROBERTO ,  LOSAVIO ALDO ,  STOPPINO PIER PAOLO ,  VANALLI GIAN PIETRO