公开(公告)号：MY165721A

公开(公告)日：2018-04-20

申请号：MYPI2013702270

申请日：2013-11-26

Applicant: MIMOS BERHAD

Inventor： LEE WAI YEE ,  DANIEL BIEN CHIA SHENG ,  KHAIRUL ANUAR BIN ABD WAHID ,  AMIRUL BIN ABD RASHID

IPC: B81C1/00

Abstract: A method of forming nanomaterials (10) on packaged sensor device platform, the method comprising the steps of fabricating (11) a sensor device platform on full scale wafer to form a fully packaged sensor device platform for nanomaterials forming process (10) which comprises the steps of protecting the wire bond with epoxy while leaving the sensing area exposed for receiving coating of catalyst precursor for the nanomaterial growth, nucleating (16) the coated catalyst precursor at low temperature for forming an active nanoparticle, and providing the active nanoparticle nucleation with nutrient solution for turning them into solid and forming nanostructures for integration of readout circuit for sensing. Most illustrative diagram: Figure 3