公开(公告)号：MY167930A

公开(公告)日：2018-10-04

申请号：MYPI2014701169

申请日：2014-05-07

Applicant: MIMOS BERHAD

Inventor： LEE HING WAH ,  DANIEL BIEN CHIA SHENG ,  KHAIRUL ANUAR BIN ABD WAHID ,  KHAIROM NIZAM BIN ATAN @ MOHAM ,  ANIFAH BINTI ZAKARIA

IPC: H01L21/027

Abstract: The present invention provides an etch-free method for conductive electrode formation. The method comprises depositing an insulating layer (104) on a substrate (102), spin coating a first polymer layer (106) on the substrate (102), patterning the first polymer layer (106) by photo-lithography and depositing a conductive metal layer by physical deposition to form a top metallic layer (108) and a bottom metallic layer (110).