公开(公告)号：US20200224028A1

公开(公告)日：2020-07-16

申请号：US16648325

申请日：2018-09-28

Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION

Inventor： Ryusuke YAMADA ,  Yuki HIWATASHI

IPC: C08L77/06 ,  C08G69/26 ,  B32B15/088 ,  B32B15/09 ,  B32B15/20 ,  H01Q1/38 ,  C08L67/06

Abstract: Provided is a thermoplastic resin composition capable of yielding a resin molding well suppressed from warping after heating, while successfully maintaining high mechanical strength, and such resin molding. Provided is a thermoplastic resin composition containing LDS and capable of yielding a resin molding on which a plating layer can be formed, and, well suppressed from warping after heating while successfully maintaining high mechanical strength, such resin molding, and methods for manufacturing a plated resin molding and a portable electronic device part. The thermoplastic resin composition containing 10 to 100 parts by mass of a reinforcing filler, per 100 parts by mass of a crystalline thermoplastic resin, the reinforcing filler containing a reinforcing fiber and a glass flake having a thickness of 0.1 to 2 μm, with reinforcing fiber/glass flake, which is mass ratio of the reinforcing fiber and the glass flake, adjusted to 0.1 to 1.

公开(公告)号：US20180298190A1

公开(公告)日：2018-10-18

申请号：US15766221

申请日：2016-10-05

Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION

Inventor： Ryusuke YAMADA ,  Takahiro TAKANO

IPC: C08L77/06

Abstract: Provided is a resin molding that uses a resin composition capable of achieving high platability, while being imparted flame retardant by the halogen-containing flame retarder, a method for manufacturing a plated resin molding, and a method for manufacturing an antenna-equipped portable electronic device part. The resin composition comprises 100 parts by weight of a thermoplastic resin; 5 to 100 parts by weight of a halogen-containing flame retarder; and, 1 to 30 parts by weight of a laser direct structuring additive, wherein the laser direct structuring additive contains antimony, and; a content of an antimony-containing flame retarder auxiliary is 0.5 parts by weight or less per 100 parts by weight of the thermoplastic resin.

公开(公告)号：US20170137660A1

公开(公告)日：2017-05-18

申请号：US15321895

申请日：2015-06-26

Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION

Inventor： Masahide SUGIYAMA ,  Ryusuke YAMADA ,  Tatsuya KIKUCHI ,  Yasushi YAMANAKA

IPC: C09D131/04 ,  C23C18/16 ,  C23C18/20 ,  C09D177/00 ,  C09D7/12

Abstract: Making formation of a plated layer on a surface of a resin molded article possible, without adding the LDS additive to the thermoplastic resin composition. Provided is a composition for forming a laser direct structuring layer, the composition comprising a water-compatible organic substance, water, and a laser direct structuring additive. Further provided is a kit having the composition for forming a laser direct structuring layer and a method for manufacturing a resin molded article with a plated layer, which uses the composition for forming a laser direct structuring layer.

公开(公告)号：US20160108234A1

公开(公告)日：2016-04-21

申请号：US14895178

申请日：2014-06-25

Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION

Inventor： Tatsuya KIKUCHI ,  Ryusuke YAMADA ,  Yasushi YAMANAKA

IPC: C08L69/00 ,  C08K3/22 ,  C08L67/02 ,  H04M1/02 ,  C08K3/34 ,  H01B1/02 ,  C23C18/20 ,  C08K3/10 ,  C08K7/14

CPC classification number: C08L69/00 ,  B32B15/08 ,  B32B2457/00 ,  C08K3/08 ,  C08K3/10 ,  C08K3/22 ,  C08K3/34 ,  C08K3/346 ,  C08K3/40 ,  C08K7/14 ,  C08K9/06 ,  C08K9/08 ,  C08K2003/0812 ,  C08K2003/0893 ,  C08K2003/2241 ,  C08K2003/2296 ,  C08K2201/014 ,  C08L25/00 ,  C08L53/02 ,  C08L67/02 ,  C08L77/06 ,  C08L101/00 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/06 ,  C09D177/06 ,  C23C18/1237 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/204 ,  C23C18/38 ,  H01B1/02 ,  H04M1/0202

Abstract: Provided is a resin composition having higher platability. The resin composition contains at least two kinds of metals and also containing a conductive oxide having a resistivity of 5×103 Ω·cm or less.

Abstract translation: 提供具有更高的镀覆性的树脂组合物。 树脂组合物含有至少两种金属，并且还含有电阻率为5×10 3Ω·cm·cm以下的导电氧化物。

公开(公告)号：US20210032461A1

公开(公告)日：2021-02-04

申请号：US16975323

申请日：2019-02-25

Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION

Inventor： Ryusuke YAMADA ,  Tatsuya KIKUCHI ,  Yuki HIWATASHI

IPC: C08L69/00 ,  C08G59/50 ,  C08K3/04 ,  C08K7/14 ,  C08L67/03 ,  C08L77/00 ,  C08K3/22 ,  C23C18/20

Abstract: A thermoplastic resin composition contains 10 to 90% by mass of (A) thermoplastic resin; 1 to 20% by mass of (B) laser direct structuring additive; and 0.3 to 7.0% by mass of (D) graphite, a total of the ingredient (A), the ingredient (B) and the ingredient (D) being always kept at 100% by mass or below, and a ratio by mass given by ingredient (B)/ingredient (D) being 1.0 to 20.

公开(公告)号：US20160215124A1

公开(公告)日：2016-07-28

申请号：US14916283

申请日：2014-09-03

Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION

Inventor： Takahiro TAKANO ,  Ryusuke YAMADA ,  Shinichi AYUBA

IPC: C08K13/04 ,  C09K5/14 ,  C23C22/82 ,  C08K13/06

CPC classification number: C08K13/04 ,  C08K3/22 ,  C08K3/24 ,  C08K3/28 ,  C08K3/38 ,  C08K7/14 ,  C08K13/06 ,  C08K2003/282 ,  C08K2003/385 ,  C08L77/06 ,  C09K5/14 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/204 ,  C23C22/82 ,  H05K1/0346 ,  H05K1/0373 ,  H05K3/185 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/107

Abstract: Provided is a thermoplastic resin composition capable of producing a resin molded article having high resistance to soldering heat, good platability (appearance of plating layer), high thermal conductivity and high volume resistivity. The thermoplastic resin composition includes, per (A) 100 parts by weight of crystallizable thermoplastic resin showing a melting point of 250° C. or higher when measured by differential scanning colorimetry (DSC) at a temperature elevation rate of 10° C./min; (B) 40 to 150 parts by weight of insulating thermal conductive filler showing a thermal conductivity of 10 w/m·K or larger; (C) 3 to 20 parts by weight of laser direct structuring additive; and (D) 10 to 130 parts by weight of titanium oxide; wherein a total content of the (B) insulating thermal conductive filler, the (C) laser direct structuring additive and the (D) titanium oxide is 40 to 65% by weight of the resin composition.

Abstract translation: 提供一种热塑性树脂组合物，其能够制造具有高耐焊接性，良好的镀覆性（镀层外观），高导热性和高体积电阻率的树脂模塑制品。 当通过差示扫描比色法（DSC）以10℃/ min的升温速度测量时，热塑性树脂组合物包含（A）100重量份可结晶热塑性树脂，其显示出250℃或更高的熔点 ; （B）40〜150重量份的导热率为10w / m·K以上的绝热导热填料; （C）3〜20重量份的激光直接结构添加剂; 和（D）10至130重量份的氧化钛; 其中（B）绝缘导热填料，（C）激光直接结构添加剂和（D）氧化钛的总含量为树脂组合物的40〜65重量％。

公开(公告)号：US20190077957A1

公开(公告)日：2019-03-14

申请号：US16084663

申请日：2017-03-06

Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION

Inventor： Ryusuke YAMADA ,  Takahiro TAKANO

IPC: C08L77/06 ,  C08L23/02 ,  C08K7/14 ,  C08K3/26

Abstract: Provided is a polyamide resin composition capable of yielding highly abrasion-resistant molded article, while keeping high mechanical strength, and, a molded article using the polyamide resin composition. The polyamide resin composition contains (A) polyamide resin, (B) polyolef in wax, and (C) at least one metal salt selected from alkali metal salt and alkali earth metal salt, and the (A) polyamide resin contains (a-1) semiaromatic polyamide resin.

公开(公告)号：US20160298242A1

公开(公告)日：2016-10-13

申请号：US15036875

申请日：2014-11-05

Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION

Inventor： Kei MORIMOTO ,  Masaki TAMURA ,  Takahiro TAKANO ,  Ryusuke YAMADA

IPC: C23C30/00 ,  B29C70/20 ,  B29C70/30 ,  B29C70/42

CPC classification number: C23C30/00 ,  B29C45/0055 ,  B29C45/14786 ,  B29C70/20 ,  B29C70/30 ,  B29C70/42 ,  B29C2045/0058 ,  B29K2077/00 ,  B29K2105/0005 ,  B29K2307/04 ,  B29K2309/08 ,  B29L2031/3456 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2307/54 ,  B32B2307/734 ,  B32B2457/00 ,  C08J5/042 ,  C08J5/043 ,  C08J2377/06 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/38

Abstract: Provided is a process for manufacturing a resin molded article, processes for manufacturing resin molded articles having high mechanical strength and low shielding properties that may be directly plated on their surfaces, a resin molded article having a plated layer obtained by the process. The process for manufacturing a resin molded article contains thermally molding a sheet containing a thermoplastic resin and a fiber together with a composition containing a thermoplastic resin belonging to a similar type to that of the thermoplastic resin of the sheet and a laser direct structuring additive.

Abstract translation: 本发明提供一种树脂成型体的制造方法，具有机械强度高，屏蔽性能低的树脂成型体的制造方法，其可以直接在其表面上镀覆，具有通过该方法得到的镀层的树脂成形体。 制造树脂成型体的方法包括将含有热塑性树脂和纤维的片材与含有与片材的热塑性树脂类似的热塑性树脂的组合物和激光直接结构化添加剂热成型。

公开(公告)号：US20160145419A1

公开(公告)日：2016-05-26

申请号：US14899230

申请日：2014-06-13

Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION

Inventor： Takahiro TAKANO ,  Ryusuke YAMADA

IPC: C08K7/06 ,  C08K3/04

Abstract: Provided is resin molded articles having large elastic modulus, and good appearance. A thermoplastic resin composition contains 80 to 120 parts by weight of a carbon fiber and 0.1 to 3.0 parts by weight of a black colorant, per 100 parts by weight of a (A) crystallizable thermoplastic resin which shows a semicrystallization time (ST (P)) of 20 to 500 seconds, wherein the semicrystallization time is measured by depolarization photometry, under conditions that a sample melting temperature is 20 to 40° C. higher than a melting point of the crystallizable thermoplastic resin, a sample melting time is 3 minutes, and an oil bath temperature for crystallization is 140° C.

Abstract translation: 提供具有大弹性模量和良好外观的树脂模塑制品。 热塑性树脂组合物含有80〜120重量份的碳纤维和0.1〜3.0重量份的黑色着色剂，相对于100重量份的显示半结晶时间（ST（P））的（A）可结晶热塑性树脂， ）为20〜500秒，其中，在样品熔融温度比可结晶热塑性树脂的熔点高20〜40℃的条件下，通过去极化测光法测定半结晶时间，样品熔解时间为3分钟， 用于结晶的油浴温度为140℃。