公开(公告)号：JPH09123343A

公开(公告)日：1997-05-13

申请号：JP28546895

申请日：1995-11-02

Applicant: MITSUI TOATSU CHEMICALS

Inventor： MIYASHITA TAKEHIRO ,  IWAMORI AKIRA ,  GOTOU MASAMI ,  FUKUDA SHIN ,  FUKUDA NOBUHIRO

IPC: B32B15/08 ,  B32B15/088 ,  C23C14/20 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To make it possible to use a laminate having peeling strength of a metal thin film and a polymer film of 1kg/cm or more even after heat treatment at 180 deg.C for 72 hours at the atmosphere which has been difficult to be formed as a circuit board having excellent high-temperature durability corresponding to microprocessing of electric and electronic and semiconductor industries. SOLUTION: This laminate comprises a first metal layer formed at least on one surface of a polymer film by a sputtering method and a second metal layer formed after the first layer, wherein the initial peeling strength of the metal thin film and polymer film is 1kg/cm or more and the peeling strength of 1kg/cm or more is provided even after heating test at 180 deg.C for 72 hours in the atmosphere.

公开(公告)号：JPH08330693A

公开(公告)日：1996-12-13

申请号：JP13771295

申请日：1995-06-05

Applicant: MITSUI TOATSU CHEMICALS

Inventor： IWAMORI AKIRA ,  MIYASHITA TAKEHIRO ,  GOTOU MASAMI ,  FUKUDA SHIN ,  FUKUDA NOBUHIRO

IPC: H05K1/09 ,  C23C14/06 ,  C23C14/20 ,  H05K3/38

Abstract: PURPOSE: To prevent drop of adhesive strength of a flexible circuit board having high heat resistance by forming a cobalt layer into a specified thickness in a sputtering manner, as a metal intermediate layer of a copper polyimide film which consists of a copper or copper alloy layer, the metal intermediate layer, and a polyimide film, in this order. CONSTITUTION: Relating to a heat resistant flexible circuit substrate, a polyimide film 1, a metal cobalt intermediate layer 2 on the principal surface of the polyimide film 1, a copper thin film layer 3 on it, and a copper film 4 for circuit on it, are formed in this order. here, the cobalt layer acting as the metal intermediate layer 2 is formed, in a sputtering manner, into such a thickness as to suppress drop of adhesive strength between the metal layer and polyimide layer to within 5% even when the cobalt layer is heated at 150 deg.C for 24 hours. That is, after the polyimide film 1 in surface-treated by plasma, the cobalt layer acting as the metal intermediate layer 2 is formed into the thickness 50-500nm in the sputtering manner, and then on it, the copper or copper alloy layer 3 is formed.

公开(公告)号：JPH09277422A

公开(公告)日：1997-10-28

申请号：JP9416396

申请日：1996-04-16

Applicant: MITSUI TOATSU CHEMICALS

Inventor： GOTOU MASAMI ,  OKAMURA TOMOYUKI ,  YAMAZAKI FUMIHARU ,  KAWAMOTO SATOSHI ,  FUKUDA SHIN ,  FUKUDA NOBUHIRO

IPC: G02B5/08 ,  B32B7/02 ,  B32B9/00 ,  B32B15/04

Abstract: PROBLEM TO BE SOLVED: To enhance stability in high temp. and high humidity environment and to keep high reflectivity over a long period of time of a specific time or more by forming a reflector consisting of a transparent polymeric film, an oxide layer of indium and tin and a silver membrane layer and having a reflecting surface on the side of the transparent polymeric film. SOLUTION: A reflector consisting of a transparent polymeric film 10, an oxide layer 20 mainly consisting of indium and tin and a silver membrane layer 30 and having a reflecting surface on the side of the transparent polymeric film 10 is formed. Therefore, a reflecting plate stable even in high temp. and high humidity environment can be obtained. By using this reflecting plate, a reflecting member having wet heat resistance having reflectivity of 90% or more even after exposed to environment of temp. of 80 deg.C and relative humidity of 90% for 500hr can be produced.

公开(公告)号：JPH08330695A

公开(公告)日：1996-12-13

申请号：JP13771495

申请日：1995-06-05

Applicant: MITSUI TOATSU CHEMICALS

Inventor： IWAMORI AKIRA ,  MIYASHITA TAKEHIRO ,  GOTOU MASAMI ,  FUKUDA SHIN ,  FUKUDA NOBUHIRO

IPC: H05K1/09 ,  C23C14/06 ,  C23C14/20 ,  H05K3/38

Abstract: PURPOSE: To prevent drop of adhesive strength of a flexible circuit board having high heat resistance by forming a molybdenum layer into a specified thickness in a sputtering manner, as a metal intermediate layer of a copper polyimide film which consists of a copper or copper alloy layer, the metal intermediate layer, and a polyimide film, in this order. CONSTITUTION: Relating to a heat resistant flexible circuit substrate, a polyimide film 1, a metal molybdenum intermediate layer 2 an the principal surface of the polyimide film 1, a copper thin film layer 3 on it, and a copper film 4 for circuit on it, are formed in this order. Here, the molybdenum layer acting as the metal intermediate layer 2 is formed, in sputtering manner, into such a thickness as to suppress drop of adhesive strength between the metal layer and palyimide layer to within 5% even when the molybdenum layer is heated at 150 deg.C for 24 hours. That is, after surface treatment is performed on the polyimide film 1 by plasma, the molybdenum layer acting as the metal intermediate layer 2 is formed into the thickness 10-500nm in the sputtering manner, and then on it, the copper or copper alloy layer 3 is formed.

公开(公告)号：JPH09174752A

公开(公告)日：1997-07-08

申请号：JP33485295

申请日：1995-12-22

Applicant: MITSUI TOATSU CHEMICALS

Inventor： GOTOU MASAMI ,  KAWAMOTO SATOSHI ,  FUKUDA SHIN ,  FUKUDA NOBUHIRO

IPC: G02B5/08 ,  B32B15/08 ,  G02B5/26

Abstract: PROBLEM TO BE SOLVED: To improve the stability of a reflecting plate in a high temperature environment using silver by using the reflecting plate. SOLUTION: This reflecting plate comprises a transparent polymer film 10, at least one metal layer 20 selected from titanium, tungsten and copper, a silver thin film layer 30, an adhesive layer 40 and a support 50, wherein the reflectivity measured from the polymer film side even after heating at 150 deg.C for 500 hours in the atmosphere is 90% or more.

公开(公告)号：JPH08330694A

公开(公告)日：1996-12-13

申请号：JP13771395

申请日：1995-06-05

Applicant: MITSUI TOATSU CHEMICALS

Inventor： IWAMORI AKIRA ,  MIYASHITA TAKEHIRO ,  GOTOU MASAMI ,  FUKUDA SHIN ,  FUKUDA NOBUHIRO

IPC: H05K1/09 ,  C23C14/06 ,  C23C14/20 ,  H05K3/38

Abstract: PURPOSE: To prevent drop of adhesive strength of a flexible circuit board having high heat resistance by forming a titanium layer into a specified thickness in a sputtering manner, as a metal intermediate layer of a copper polyimide film which consists of a copper or copper allay layer, the metal intermediate layer, and a polyimide film, in this order. CONSTITUTION: Relating to a heat resistant flexible circuit substrate, a polyimide film 1, a metal titanium intermediate layer 2 on the principal surface of the palyimide film 1, a copper thin film layer 3 on it, and a copper film 4 for circuit an it, are formed in this order. Here, the titanium layer acting as the metal intermediate layer 2 is formed, in sputtering manner, into such a thickness as to suppress drop of adhesive strength between the metal layer and polyimide layer to within 5% even when the titanium layer is heated at 150 deg.C for 24 hours. That is, after the polyimide film 1 is surface-treated by plasma, the titanium layer acting as the metal intermediate layer 2 is formed into the thickness 5-50nm in the spattering manner, and then on it, the copper or copper alloy layer 3 is forced.

公开(公告)号：JPH09262927A

公开(公告)日：1997-10-07

申请号：JP7419496

申请日：1996-03-28

Applicant: MITSUI TOATSU CHEMICALS

Inventor： GOTOU MASAMI ,  OKAMURA TOMOYUKI ,  YAMAZAKI FUMIHARU ,  KAWAMOTO SATOSHI ,  FUKUDA SHIN ,  FUKUDA NOBUHIRO

IPC: B32B7/02 ,  B32B7/10 ,  B32B9/00 ,  B32B15/04 ,  B32B15/08 ,  B32B27/00 ,  C23C14/08 ,  G02B5/08 ,  G02B5/26

Abstract: PROBLEM TO BE SOLVED: To remarkably improve the heat resistance of a reflecting body with the use of silver by using an amorphous oxide layer which is formed by a spattering method in a high oxygen concentration atmosphere and composed mainly of indium and tin between a transparent polymer film and a silver thin film layer. SOLUTION: A reflecting body is formed by a method in which an oxide (ITO) layer 20 which is made mainly from indium and tin, a silver thin film layer 30, an adhesive layer 40, and a support 50 are laminated on a transparent polymer film 10. With regard to the polymer film 10, films of poly(ether sulphone), poly(ether ether ketone), polyimide, polycarbonate, and polyarylate which are transparent and can stand continuous service at not less than 150 deg.C. are used. As for the ITO film 20, in a spattering method, the partial pressure ratio of argon/oxygen which are spattering gas is adjusted so that oxygen is made greater than an argon/oxygen partial pressure ratio where specific resistance is made minimum, and it is preferable that the ITO film of at least 1×10 Ω.cm specific resistance is formed.

公开(公告)号：JPH085806A

公开(公告)日：1996-01-12

申请号：JP13477694

申请日：1994-06-17

Applicant: MITSUI TOATSU CHEMICALS

Inventor： FUKUDA SHIN ,  KAWAMOTO SATOSHI ,  GOTOU MASAMI ,  FUKUDA NOBUHIRO

IPC: G02B5/08 ,  B32B7/02 ,  B32B7/12 ,  B32B15/08 ,  G02F1/1335 ,  G02F1/13357

Abstract: PURPOSE:To provide a reflection plate having remarkbly improved light resis tance and to provide a backlight lampareflector having-extremely high reliability for a liquid crystal display. CONSTITUTION:This reflection plate consists of a transparent polymer film 10 (A), alloy thin film layer 20 (B) of 70-300nm film thickness essentially comprising silver, adhesive layer 30 (C), and molded body 40 (D) successively formed in the order of (A)(B)(C)(D). The alloy thin film layer 20 essentially comprising silver consists of silver-gold alloy, silver-platinum alloy, or silver-palladium alloy layer. The transparent polymer film 10 is polyethylene terephthalate, aluminum plate or the like. The backlight lamp reflector for a liquid crystal display uses this reflection plate.

公开(公告)号：JPH09274181A

公开(公告)日：1997-10-21

申请号：JP8249796

申请日：1996-04-04

Applicant: MITSUI TOATSU CHEMICALS

Inventor： GOTOU MASAMI ,  KAWAMOTO SATOSHI ,  FUKUDA SHIN

IPC: G02F1/1335 ,  B32B15/08 ,  B32B27/00 ,  B32B27/20 ,  G09F9/00

Abstract: PROBLEM TO BE SOLVED: To obtain a reflection member having absorption in a visible ray region and high reflectance by forming a metal thin film layer as a reflection layer on a transparent polymer film containing a dye. SOLUTION: This reflection member consists of a polymer film 30 which substantially absorbs visible rays of specified wavelengths and a reflection layer 40. Namely, in the structure comprising at least a polymer film 30 which substantially absorbs visible rays of specified wavelengths and a reflection layer 40, the polymer film side is used as a reflecting plane. The polymer film (color film) which substantially absorbs visible rays of specified wavelengths is not limited as far as it has absorption in a part of the visible ray region (800nm to 400nm) and has >=60% max. transmittance for rays in the visible ray region. The film is colored by absorption in a part of the visible ray region. The resin material, kind of the dye to be compounded, position of the absorption band, namely, the color, and the content of the dye depend on the purpose or conditions of use.

公开(公告)号：JPH09201900A

公开(公告)日：1997-08-05

申请号：JP9661996

申请日：1996-04-18

Applicant: MITSUI TOATSU CHEMICALS

Inventor： MIYASHITA TAKEHIRO ,  IWAMORI AKIRA ,  GOTOU MASAMI ,  FUKUDA SHIN ,  FUKUDA NOBUHIRO

IPC: B32B15/08 ,  B32B15/088 ,  C23C14/20 ,  H01L21/203 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To prevent the peeling of a metal thin film and a polymer base material by forming an amorphous layer on at least one surface of the polymer base material, and forming a metal layer on the amorphous layer. SOLUTION: After an amorphous layer 2 is formed on a polymer of a base material 1, a copper layer of a metal layer 3 is formed. The layer 2 is formed as a film of oxide containing indium and tin as main bodies and preferably having a specific resistance of 1×10 Ωcm or more by a sputtering method in a high oxygen concentration atmosphere. As the used polymer base material 1, polyimide is preferable, and to raise the adhesive properties of the surface and the layer 2, it is preferable to use plasma treatment. Thus, the heat resistance for holding the adhesive properties of the layer 3 and the material 1 can be obtained.