公开(公告)号：JPH09150478A

公开(公告)日：1997-06-10

申请号：JP31072895

申请日：1995-11-29

Applicant: MITSUI TOATSU CHEMICALS

Inventor： KAWAMOTO SATOSHI ,  FUKUDA SHIN ,  GOTOU YUMI ,  FUKUDA NOBUHIRO

IPC: B32B15/08 ,  B32B27/00

Abstract: PROBLEM TO BE SOLVED: To maintain a specific reflectance even though a reflecting body is allowed to stand continuously under high temperature environment by improving stability in the high temperature environment by a method wherein a side to a polymeric film composed of at least a transparent polymeric film and a silver thin film layer is made a reflecting surface. SOLUTION: A reflecting body is composed of at least one metal layer 20 selected from titanium, tungsten, or copper on a transparent polymeric film 10, and a silver thin film layer 30 on the metal layer 20. The metal layer 20 is between the transparent polymeric film 10 and the silver thin film layer 30. Such the reflecting body can improve stability of the silver thin film under the high temperature environment. Thereby, even after the reflecting body is heated in the air at 150 deg.C temperature for 500h, a reflectance of at least 90% can be obtained.

公开(公告)号：JPH09150482A

公开(公告)日：1997-06-10

申请号：JP13551296

申请日：1996-05-29

Applicant: MITSUI TOATSU CHEMICALS

Inventor： KAWAMOTO SATOSHI ,  GOTOU YUMI ,  FUKUDA SHIN ,  FUKUDA NOBUHIRO

IPC: G02B5/08 ,  B32B7/02 ,  B32B7/12 ,  B32B15/01 ,  B32B15/08 ,  B32B15/09 ,  B32B27/00 ,  B32B27/20 ,  B32B33/00 ,  C08J7/00

Abstract: PROBLEM TO BE SOLVED: To maintain a reflectivity of a pseudo-solar ray of a specific irradiation intensity excepting a wavelength of a specific numerical value or under at a specific % or over by preventing discoloration of a reflecting body due to deterioration by light and heat by a method wherein one side of a transparent polymeric film is surface treated by a plasma containing a metal, and a silver thin film layer is further formed on the surface treated side. SOLUTION: A transparent polymeric film 10 and a surface treated side 20 by a plasma containing a metal transmit almost an incident light 90 from the transparent polymeric film 10 side. The light 90 reaches a silver thin film layer 30, and is reflected thereon. The surface treated side 20 and the transparent polymeric film 10 transmit the light and the light returns again into an original medium. A thickness of the silver thin film layer is best at about 100nm-200nm. When that is too thin and the film thickness of silver is insufficient, a transmitted light exists to decreas its reflectivity. Therefore, though the reflecting body is irradiated with a pseudo solar ray of 500mW/cm irradiation intensity after cutting ultraviolet with a UV cutting filter of 390nm transmission limit wavelength for 300h, its reflectivity is maintained at 90% or over.

公开(公告)号：JPH0955575A

公开(公告)日：1997-02-25

申请号：JP20445795

申请日：1995-08-10

Applicant: MITSUI TOATSU CHEMICALS

Inventor： MIYASHITA TAKEHIRO ,  IWAMORI AKIRA ,  GOTOU YUMI ,  FUKUDA SHIN ,  FUKUDA NOBUHIRO

IPC: H05K1/09 ,  B32B15/08 ,  H05K3/14 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To provide a laminate being employed in a flexible circuit board and excellent in high temperature resistance required for michromachininq in electric, electronic and semiconductor industries in which the adhesion of copper to a metal or alloy for imparting the heat resistance is enhanced along with the high temperature resistance of adhesion between a thin metal film and a polymer basic material. SOLUTION: A polymer film 1 is provided, on at least one side, with a first metal layer 2 of cobalt, molybdenum, titanium, nickel or an alloy containing at least two kinds of these metals, a second metal layer 3 of an alloy of copper and cobalt, molybdenum, titanium, or nickel or an alloy of copper and at least two kinds of these metals, and a third metal layer 4 of copper, wherein the third metal layer is interposed between the first and second metal layers in order to enhance the adhesion.

公开(公告)号：JPH08340162A

公开(公告)日：1996-12-24

申请号：JP14716495

申请日：1995-06-14

Applicant: MITSUI TOATSU CHEMICALS

Inventor： IWAMORI AKIRA ,  MIYASHITA TAKEHIRO ,  GOTOU YUMI ,  FUKUDA SHIN ,  FUKUDA NOBUHIRO

IPC: H05K1/03 ,  B32B15/08 ,  C23C14/06 ,  C23C14/20 ,  H05K1/09 ,  H05K3/38

Abstract: PURPOSE: To obtain a flexible circuit board material, which is relaxed significantly not only the deterioration of the characteristics in a high-temperature test but also the deterioration of the performance in a secondary processing, by a method wherein an inorganic cobalt compound layer is formed on one surface or both surfaces of a plastic film and a copper layer is formed thereon. CONSTITUTION: An inorganic cobalt compound layer 2 is formed on one surface or both surfaces of a plastic film 2 and a copper layer 3 is formed on the layer 2. For example, after the surfaces of a polyimide film 1 of a film thickness of 50.0μm are treated with oxygen glow discharge, a tetracobalt triphosphide layer 2 of a thickness of 500nm is formed on one surface of the film 1 by an RF magnetron sputtering method using argon gas. After that, a copper thin film layer 3 of a thickness of 250nm is immediately formed by a DC magnetron sputtering method using argon gas. Then, the thickness of a copper layer 4 for circuit is formed in 20μm by applying a copper electrolytic plating on the film 3.