COMPOSITION FOR CURABLE RESIN
    1.
    发明专利

    公开(公告)号:JPS5692948A

    公开(公告)日:1981-07-28

    申请号:JP16924979

    申请日:1979-12-27

    Abstract: PURPOSE:The titled composition, suitable for various binders, having improved heat resistance, particularly heat distortion temperature and thermal decomposition starting temperature, and obtained by removing a solvent from a solution of a mixture of novolak phenolic resin with hexamethylenetetramine. CONSTITUTION:100pts.wt. mixture of 100pts.wt. novolak phenolic resin with 5-30pts.wt. hexamethylenetetramine is dissolved in 30-100pts.wt. solvent of methanol or its mixture with an alcohol-soluble solvent. The solvent is then removed from the resultant solution.

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