1.
    发明专利
    未知

    公开(公告)号:AT110086T

    公开(公告)日:1994-09-15

    申请号:AT88305099

    申请日:1988-06-03

    Abstract: Aromatic polyamide having good high-temperature resistance and processing ability is obtained when the ratio of storage modulus at the glass transition temperature (Tg) DEG C to the storage modulus of a temperature of (Tg+100) DEG C is less than 3. The aromatic polyamide has a recurring unit [ -HN -Ar1 - NHCO - Ar2 - CO- ] wherein Ar1 is a divalent phenylene group represented by and Ar2 is a divalent phenylene group represented by where R is hydrogen or a methyl radical. r

    3.
    发明专利
    未知

    公开(公告)号:DE69209172D1

    公开(公告)日:1996-04-25

    申请号:DE69209172

    申请日:1992-01-20

    Abstract: A polyimide resin composition for molding, which comprises a polyimide resin and an aromatic bisimide compound and has a melt flowability and an excellent processability in addition to the heat resistance inherent in polyamide; a carbon fiber-reinforced polyimide resin composition which comprises a polyimide resin and carbon fibers coated with an aromatic bisimide compound and has excellent mechanical strengths; and novel bisimide compounds represented by general formula (I), which are very useful as the aromatic bisimide compounds in the above resin compositions, wherein X represents a direct bond, C1 to C10 divalent hydrocarbyl, hexafluoroisopropylidene, carbonyl, thio or sulfonyl; Y1 to Y4 represent each independently hydrogen, lower alkyl, lower alkoxy, chlorine or bromine; and R represents a divalent group selected from the group consisting of monocyclic aromatic groups, fused polycyclic aromatic groups, and nonfused polycyclic aromatic groups wherein aromatic groups are linked together directly or through cross-linking member(s).

    8.
    发明专利
    未知

    公开(公告)号:DE3851097T2

    公开(公告)日:1995-04-13

    申请号:DE3851097

    申请日:1988-06-03

    Abstract: Aromatic polyamide having good high-temperature resistance and processing ability is obtained when the ratio of storage modulus at the glass transition temperature (Tg) DEG C to the storage modulus of a temperature of (Tg+100) DEG C is less than 3. The aromatic polyamide has a recurring unit [ -HN -Ar1 - NHCO - Ar2 - CO- ] wherein Ar1 is a divalent phenylene group represented by and Ar2 is a divalent phenylene group represented by where R is hydrogen or a methyl radical. r

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