公开(公告)号：DE3781360T2

公开(公告)日：1993-02-25

申请号：DE3781360

申请日：1987-03-26

Applicant: MITSUI TOATSU CHEMICALS

Inventor： MORITA MORITSUGU ,  MIYAZAKI KAZUO

IPC: B32B15/08 ,  B29C53/18 ,  B65H23/32 ,  B65H23/34 ,  H05K1/00 ,  B32B35/00

Abstract: Correcting curl and improving dimensional stability of flexible metal foil laminated plate with an aromatic polyimide thin film bonded directly, without adhesive, to a long metal foil in which the plate is passed under tension. Correction comprises (A) bending the plate over a 1st bar (2) disposed at 30-60 deg. w.r.t the plate width with the metal foil downwards, then (B) over a 1st roller (3) generally parallel to the 2nd bar with the polyimide film downwards, (c) over a 2nd bar (4) disposed at 60-120 deg. w.r.t the 1st bar with the metal foil downwards, and (D) over a 2nd roller (5) generally parallel to the 2nd bar with the polyimide film downwards, and then winding it. The order of stages 1-4 may be altered.

公开(公告)号：DE3684307D1

公开(公告)日：1992-04-16

申请号：DE3684307

申请日：1986-10-31

Applicant: MITSUI TOATSU CHEMICALS

Inventor： MORITA MORITSUGU ,  MIYAZAKI KAZUO ,  YAMAGUCHI AKIHIRO ,  OHTA MASAHIRO ,  TAMAI SHOJI ,  NISHIHARA KUNIO

IPC: B32B15/00 ,  B32B15/08 ,  C08G69/26 ,  C08G73/10 ,  H01B3/30 ,  H05K1/03 ,  H05K3/38

Abstract: A polyimide film obtained by using as starting materials a symmetric aromatic m-substituted primary diamine and a symmetric aromatic P-substituted primary diamine in a given proportion. This film has excellent heat resistance, electric properties, and flexibility. In providing this film on a substrate, a precursor of the polyimide, i.e. a polyamic acid, is applied to the substrate without using any adhesives, and a reaction is allowed to proceed to form a polyimide to thereby provide the polyimide film on the substrate with good adhesiveness. The resulting flexible printed circuit board has the above-described excellent properties.

公开(公告)号：DE3853419T2

公开(公告)日：1995-11-16

申请号：DE3853419

申请日：1988-09-22

Applicant: MITSUI TOATSU CHEMICALS

Inventor： MORITA MORITSUGU ,  SATO TAKUSHI ,  YAMANAKA SHUSUKE ,  YOSHIDA SHUNJI ,  TANABE KENJI ,  NAITO MITSUYUKI ,  SHISHIDO SHIGEYUKI

IPC: B32B15/08 ,  B32B43/00 ,  H05K1/00 ,  H05K3/06 ,  B21D1/05 ,  B32B31/16 ,  H05K3/22

Abstract: A flexible metal-plastic laminate is freed from drawbacks encountere din a conventional laminate i.e. the inconvenience that, even then the metal and plastis layer constituting the laminate can be sepd. from each other. The length of the metal layer is made larger than that of the plastic layer by subjecting the metal layer in the laminate to compressive plastic deformation continuously. The obtd. laminate has a reduced dimensional difference between the metal and plastic layers and a high processability.

公开(公告)号：SG47438A1

公开(公告)日：1998-04-17

申请号：SG1996001402

申请日：1993-12-03

Applicant: MITSUI TOATSU CHEMICALS

Inventor： MORITA MORITSUGU ,  TAGAWA KIMITERU ,  ABE KENJI ,  MINETA NAOSHI ,  KUBO TAKAYUKI ,  KIBA SHIGEO ,  OHKAWADO ETSUO ,  TANABE KENJI

IPC: C08G73/10 ,  C09J7/00 ,  C09J9/02 ,  C09J179/08 ,  H01B3/30 ,  H01L23/495 ,  H01L21/60

Abstract: An insulating adhesive tape comprises a base supporting film and an adhesive layer formed on at least one surface thereof, said adhesive layer being formed of a thermoplastic polymer comprising a thermoplastic polyimide. The thermoplastic polymer has a glass transition temperature ranging from 180 DEG C to 280 DEG C and an elastic modulus ranging from 10 dyne/cm to 10 dyne/cm at 25 DEG C, said modulus including a value ranging from 10 dyne/cm to 10 dyne/cm at a temperature between 250 DEG C and 300 DEG C.

公开(公告)号：DE3853419D1

公开(公告)日：1995-04-27

申请号：DE3853419

申请日：1988-09-22

Applicant: MITSUI TOATSU CHEMICALS

Inventor： MORITA MORITSUGU ,  SATO TAKUSHI ,  YAMANAKA SHUSUKE ,  YOSHIDA SHUNJI ,  TANABE KENJI ,  NAITO MITSUYUKI ,  SHISHIDO SHIGEYUKI

IPC: B32B15/08 ,  B32B43/00 ,  H05K1/00 ,  H05K3/06 ,  B21D1/05 ,  B32B31/16 ,  H05K3/22

Abstract: A flexible metal-plastic laminate is freed from drawbacks encountere din a conventional laminate i.e. the inconvenience that, even then the metal and plastis layer constituting the laminate can be sepd. from each other. The length of the metal layer is made larger than that of the plastic layer by subjecting the metal layer in the laminate to compressive plastic deformation continuously. The obtd. laminate has a reduced dimensional difference between the metal and plastic layers and a high processability.

公开(公告)号：DE3781360D1

公开(公告)日：1992-10-01

申请号：DE3781360

申请日：1987-03-26

Applicant: MITSUI TOATSU CHEMICALS

Inventor： MORITA MORITSUGU ,  MIYAZAKI KAZUO

IPC: B32B15/08 ,  B29C53/18 ,  B65H23/32 ,  B65H23/34 ,  H05K1/00 ,  B32B35/00

Abstract: Correcting curl and improving dimensional stability of flexible metal foil laminated plate with an aromatic polyimide thin film bonded directly, without adhesive, to a long metal foil in which the plate is passed under tension. Correction comprises (A) bending the plate over a 1st bar (2) disposed at 30-60 deg. w.r.t the plate width with the metal foil downwards, then (B) over a 1st roller (3) generally parallel to the 2nd bar with the polyimide film downwards, (c) over a 2nd bar (4) disposed at 60-120 deg. w.r.t the 1st bar with the metal foil downwards, and (D) over a 2nd roller (5) generally parallel to the 2nd bar with the polyimide film downwards, and then winding it. The order of stages 1-4 may be altered.

公开(公告)号：EP0264454A4

公开(公告)日：1989-08-30

申请号：EP87902150

申请日：1987-03-26

Applicant: MITSUI TOATSU CHEMICALS

Inventor： MORITA MORITSUGU ,  MIYAZAKI KAZUO

IPC: B32B15/08 ,  B29C53/18 ,  B65H23/32 ,  B65H23/34 ,  H05K1/00 ,  B32B35/00

CPC classification number: B32B15/08 ,  B32B27/281 ,  B32B38/0012 ,  B32B2037/0092 ,  B32B2307/734 ,  B32B2309/02 ,  B65H23/32 ,  B65H23/34 ,  B65H2301/33212 ,  H05K1/028 ,  H05K2201/0154 ,  H05K2203/0271 ,  Y10T29/49155

Abstract: A method for correcting curl of a laminated plate and improving as well dimensional stability thereof, by sliding a laminated plate of long flexible metal foil having a thin film of an aromatic polyimide formed on said foil in the longitudinal direction of said plate over the curved surfaces of four pieces of bars disposed at specified locations, while said plate is placed in a strained state.

公开(公告)号：EP0243507A4

公开(公告)日：1989-04-27

申请号：EP86906455

申请日：1986-10-31

Applicant: MITSUI TOATSU CHEMICALS

Inventor： MORITA MORITSUGU ,  MIYAZAKI KAZUO ,  YAMAGUCHI AKIHIRO ,  OHTA MASAHIRO ,  TAMAI SHOJI ,  NISHIHARA KUNIO

IPC: B32B15/00 ,  B32B15/08 ,  C08G69/26 ,  C08G73/10 ,  H01B3/30 ,  H05K1/03 ,  H05K3/38

CPC classification number: C08G73/1064 ,  C08G69/265 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1071 ,  H01B3/306 ,  H05K1/0346 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31721