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公开(公告)号：JPH0934108A
公开(公告)日：1997-02-07
申请号：JP17836195
申请日：1995-07-14
Applicant: MITSUI TOATSU CHEMICALS
Inventor： URAGAMI TATSUNOBU , TAKUMA HIROSUKE
Abstract: PROBLEM TO BE SOLVED: To obtain a resin compsn. capable of forming a high precision fine resist pattern excellent in sensitivity, resolution, etc., by using specified phenolic aralkyl resin as an alkali-soluble resin component. SOLUTION: This photosensitive resin compsn. contains a resin contg. 5-100wt.% phenolic aralkyl resin represented by the formula as an alkali-soluble resin component and a photoreactive component. In the formula, each of R1 and R2 is H, 1-9C alkyl, phenyl, halogen or hydroxyl, R1 and R2 may form a ring and (n) is an integer of 0-50. The photoreactive component has ability to control the alkali solubility of the alkali-soluble resin in an ordinary state and loses the ability when it is irradiated with light. Photolithography is made possible, thereby.
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公开(公告)号：JPH07216059A
公开(公告)日：1995-08-15
申请号：JP678794
申请日：1994-01-26
Applicant: MITSUI TOATSU CHEMICALS
Inventor： ISHIHARA HIROKO , URAGAMI TATSUNOBU , YAMAGUCHI KEISABURO , KATSUOKA HIROTOSHI , YAMAGUCHI TERUHIRO
Abstract: PURPOSE:To obtain an epoxy resin composition containing an epoxy resin and a specific curing agent, giving a cured material having excellent heat- resistance, oxidation resistance, moisture resistance, mechanical strength, adhesivity, etc., and useful as a sealing material for semiconductor devices. CONSTITUTION:This epoxy resin composition contains (A) an epoxy resin having >=2 epoxy groups in one molecule, e.g. an o-cresol novolak epoxy resin or a biphenyl-type epoxy resin and (B) a curing agent produced by melting and mixing a beta-naphthol aralkyl resin of formula I ((m) is 0-15) and a phenol aralkyl resin having a melt viscosity of 0.1-2 poise measured by an ICI melt viscometer at 0 deg.C and expressed by formula II (R is H or methyl; (n) is same as (m)) at a weight ratio (I:II) of 50:50 to 95:5.
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公开(公告)号：JPH07196568A
公开(公告)日：1995-08-01
申请号：JP32594
申请日：1994-01-06
Applicant: MITSUI TOATSU CHEMICALS
Inventor： YAMAGUCHI KEISABURO , URAGAMI TATSUNOBU , ISHIHARA HIROKO , YAMAGUCHI TERUHIRO
Abstract: PURPOSE:To obtain a bis(hydroxybenzyl)benzene compound useful e.g. as a curing agent for polyester, epoxy resin, etc., in high purity and yield by reacting a phenolic compound with an aralkyl compound in the presence of an acid catalyst, removing the acid catalyst from the product and distilling the product in vacuum. CONSTITUTION:This bis(hydroxybenzyl)benzene compound of formula III can be produced by reacting phenol or cresol with an aralkyl compound of formula I (X is a halogen, OH or a 1-4C alkoxy) (e.g. alpha,alpha-dichloroxylene) in the presence of an acid catalyst such as hydrochloric acid or formic acid to obtain a phenolic aralkyl resin composition of formula II (R is H or methyl; (n) is 0-50), removing or inactivating the acid catalyst in the composition and purifying the composition by vacuum distillation.
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公开(公告)号：JPH0797435A
公开(公告)日：1995-04-11
申请号：JP33198893
申请日：1993-12-27
Applicant: MITSUI TOATSU CHEMICALS
Inventor： YAMAGUCHI KEISABURO , URAGAMI TATSUNOBU , YAMAGUCHI TERUHIRO
IPC: C08G59/40 , C08G59/20 , C08G59/24 , C08G59/62 , C08K3/00 , C08L63/00 , C08L63/02 , H01L23/29 , H01L23/31
Abstract: PURPOSE:To provide the title composition improved in heat resistance, moisture resistance, adhesiveness and mechanical strengths by mixing an epoxy resin with a curing agent essentially consisting of a specified phenol/aralkyl resin. CONSTITUTION:1mol of phenol and/or cresol is reacted with 0.1-0.9mol of an aralkyl compound of formula I (wherein X is halogen, hydroxyl or 1-4C alkoxyl) at 80-200 deg.C for 1-15hr in the presence of an acid catalyst. The unreacted phenol and/or cresol is distilled off ' the reaction mixture, and the bisphenol component is distilled off the reaction mixture to obtain a phenol/aralkyl resin having a residual bisphenol component content of 10wt.% or below, a softening point of 30-120 deg.C and an average molecular weight of 550-5000. An epoxy resin having at least two epoxy groups in the molecule and comprising a biphenyl-derived epoxy resin of formula II (wherein R1 is H or methyl) is mixed with a curing agent comprising a phenol resin containing at least 15wt.% above phenol/aralkyl resin in an equivalent ratio of 0.5-1.5.
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公开(公告)号：JPH06192359A
公开(公告)日：1994-07-12
申请号：JP34484792
申请日：1992-12-24
Applicant: MITSUI TOATSU CHEMICALS
Inventor： URAGAMI TATSUNOBU , YAMAGUCHI KEISABURO , YAMAGUCHI TERUHIRO
Abstract: PURPOSE:To obtain the subject resin, excellent in heat and moisture resistance, preservation stability and mechanical performance and useful for molding, etc., by reacting a specific phenol-dicyclopentadiene resin with aldehydes in the presence of a basic catalyst. CONSTITUTION:The objective resin is obtained by reacting phenol- dicyclopentadiene resin expressed by the formula [(n) is 0-10] with aldehydes such as formalin in the presence of a basic catalyst such as sodium hydroxide.
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Patent Agency Ranking
公开(公告)号：JPH06145306A
公开(公告)日：1994-05-24
申请号：JP30383992
申请日：1992-11-13
Applicant: MITSUI TOATSU CHEMICALS
Inventor： YAMAGUCHI KEISABURO , URAGAMI TATSUNOBU , YAMAGUCHI TERUHIRO
Abstract: PURPOSE:To provide the title composition excellent in workability and moldability and useful as a semiconductor sealing material or the like. CONSTITUTION:The composition contains a curing agent containing 5-50wt.% thiodiphenol of the formula wherein R1, R2 and R3 are each hydrogen, halogen, 1-12 C alkyl, aryl, aralkyl, cycloalkyl, alkoxyl or hydroxyl.
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公开(公告)号：JPH05301946A
公开(公告)日：1993-11-16
申请号：JP11033792
申请日：1992-04-28
Applicant: MITSUI TOATSU CHEMICALS
Inventor： URAGAMI TATSUNOBU , YAMAGUCHI KEISABURO , YAMAGUCHI TERUHIRO
Abstract: PURPOSE:To obtain the title composition having excellent balance between properties such as heat resistance, moisture resistance, mechanical strength, operability or the like by adding a naphthol aralkyl resin and a phenol aralkyl resin to a specific epoxy resin as curing agents. CONSTITUTION:The objective composition is obtained by mixing (A) an epoxy resin prepared by allowing a phenol-dicyclopentadiene resin of formula I (n is 0 to 10; R1 is H, 1 to 9 C alkyl) with an epichlorohydrin of formula II, with (B) a naphthol aralkyl resin of formula III (m is 0 to 100) and/or a phenol aralkyl resin of formula IV (q is m). The resin of formula I is obtained, for example, by reaction of dicyclopentadiene with an (alkyl) phenol. The resin of formula III is preferably obtained by reaction of an aralkyl halide or an aralkyl alcohol derivative of formula V (R2 is halogen or OH) with alpha-or beta-naphthol, while the resin of formula IV is recommendably obtained by reaction of a compound of formula V with a phenol.
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公开(公告)号：JPH05170875A
公开(公告)日：1993-07-09
申请号：JP34098591
申请日：1991-12-24
Applicant: MITSUI TOATSU CHEMICALS
Inventor： URAGAMI TATSUNOBU , YAMAGUCHI KEISABURO , YAMAGUCHI TERUHIRO
Abstract: PURPOSE:To obtain a composition excellent in heat resistance, moisture resistance, adhesiveness, mechanical properties and workability by incorporating specified curing agents into an epoxy resin made by reacting a naphtholaralkyl resin with epichlorohydrin. CONSTITUTION:An epoxy resin composition containing an epoxy resin and curing agents, wherein the epoxy resin is one obtained by reacting a naphtholaralkyl resin of formula I with epichlorohydrin of formula II and the curing agents are a naphtholaralkyl resin of formula I and a phenol- dichloropentadiene resin of formula III or a phenolaralkyl resin of formula IV. In the formulas, n is 0 to 100; r is 0 to 10; and R1 is H, 1-9C alkyl or phenyl.
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公开(公告)号：JPH0597977A
公开(公告)日：1993-04-20
申请号：JP26358691
申请日：1991-10-11
Applicant: MITSUI TOATSU CHEMICALS
Inventor： YAMAGUCHI KEISABURO , URAGAMI TATSUNOBU , YAMAGUCHI TERUHIRO
Abstract: PURPOSE:To obtain a naphthol resin having a specific structure and suitable for matrix resin for composite material or a material for sealing having excel lent balance of heat resistance and water resistance. CONSTITUTION:A naphthol resin expressed by the formula [(n) is 0-100]. The resin is obtained by reacting naphthols with a dicyclopentadiene in the presence of an acid catalyst. As the naphthol resin, a resin of the formula[(n) is 0-20] having 70-180 deg.C softening point is preferably used. As the naphthol, alpha-naphthol or beta-naphthol is used in an amount of 1.1-10mol based on 1mol dicyclopentadiene.
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公开(公告)号：JPH04178358A
公开(公告)日：1992-06-25
申请号：JP28418190
申请日：1990-10-24
Applicant: MITSUI TOATSU CHEMICALS
Inventor： YAMAGUCHI KEISABURO , URAGAMI TATSUNOBU , YAMAZAKI MIDORI , TAMAI MASAJI , TANABE YOSHIMITSU , YAMAGUCHI TERUHIRO , YAMATANI NORIMASA , OTA MASAHIRO
IPC: C07C201/12 , C07C205/38 , C07C213/02 , C07C217/90 , C07D207/44 , C07D207/452 , C08G73/12
Abstract: NEW MATERIAL:An aromatic diamine compound of formula I (R is H, CH3), and a bismaleimide compound of formula II. EXAMPLE:1,4-Bis[4-(4-aminophenoxy)-alpha,alpha-dimethyl-benzyl]benzene, and 1, 4- bis[4-(4-maleimidophenoxy)-alpha,alpha-dimethylbenzyl]benzene. USE:The compound of formula I is useful as a raw material for resins having excellent flexibility and moldability and as a curing agent, and the compound of formula II is useful as a raw material for heat-resistant resins having improved flexibility and water absorbing property. PREPARATION:A compound of formula III is reacted with nitrochlorobenzene or dinitrobenzene in the presence of a base in an aprotic solvent, and the prepared compound of formula IV is reduced to prepare the compound of formula I. The compound of formula I is subjected to a dehydrative condensation reaction with maleic anhydride to prepare the compound of formula II.
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