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公开(公告)号：GB2262743A
公开(公告)日：1993-06-30
申请号：GB9226903
申请日：1992-12-24
Applicant: MITSUI TOATSU CHEMICALS
Inventor： HATANAKA HIROFUMI , MACHIDA KOICHI , SUZUKI KAZUMI , FUKUDA TORU , NAKAYAMA ICHIROU , HOSHINO TATSUMI , YOKODE SEIJI , NISHIHARA KUNIO
Abstract: An electrically conductive copper paste comprising 100 parts by weight of a copper powder, 14-25 parts by weight in total of a modified hydroquinone resin and a liquid epoxy resin and 5-20 parts by weight of an inorganic filler. This paste has a further improved balance in properties when the amount of the liquid epoxy resin is 65-80 parts by weight per 100 parts by weight of the modified hydroquinone resin and the particle diameter of the inorganic filler is 0.1 mu m to 1.0 mu m. The electrically conductive copper paste has a low electrical resistance, is balanced in printability, adhesion, heat resistance during soldering, heat stability, humidity stability, etc., and is best suited for the purpose of electromagnetic shielding, etc.
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公开(公告)号：GB2262743B
公开(公告)日：1995-11-01
申请号：GB9226903
申请日：1992-12-24
Applicant: MITSUI TOATSU CHEMICALS
Inventor： HATANAKA HIROFUMI , MACHIDA KOICHI , SUZUKI KAZUMI , FUKUDA TORU , NAKAYAMA ICHIROU , HOSHINO TATSUMI , YOKODE SEIJI , NISHIHARA KUNIO
Abstract: An electrically conductive copper paste comprising 100 parts by weight of a copper powder, 14-25 parts by weight in total of a modified hydroquinone resin and a liquid epoxy resin and 5-20 parts by weight of an inorganic filler. This paste has a further improved balance in properties when the amount of the liquid epoxy resin is 65-80 parts by weight per 100 parts by weight of the modified hydroquinone resin and the particle diameter of the inorganic filler is 0.1 mu m to 1.0 mu m. The electrically conductive copper paste has a low electrical resistance, is balanced in printability, adhesion, heat resistance during soldering, heat stability, humidity stability, etc., and is best suited for the purpose of electromagnetic shielding, etc.
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公开(公告)号：JPH08176251A
公开(公告)日：1996-07-09
申请号：JP32041894
申请日：1994-12-22
Applicant: MITSUI TOATSU CHEMICALS
Inventor： KOGA NOBUSHI , YOKODE SEIJI , INOUE HIROSHI , SAKAI MASAMI
Abstract: PURPOSE: To produce an integral-skin polyurethane foam which cures in a short time without causing swelling on demolding by pouring a reaction mixture contg. an arom. polyisocyanate, a high-molecular isocyanate-reactive compd., and a specific blowing agent into a mold and allowing the mixture to foam to a specified density. CONSTITUTION: A reaction mixture is prepd. by mixing an arom. polyisocyanate, a high-molecular isocyanate-reactive compd., and a blowing agent comprising a tert. amine (e.g. 1-isobutyl-2-methylimidazole) salt of an acid selected from among phosphoric acid and its derivatives having a mol.wt. of 98-1,150, boric acid and its esters having a mol.wt. of 61-146, and aliph. carboxylic acids having a mol.wt. of 46-300, and if necessary a crosslinker, a catalyst, another blowing agent, a foam stabilizer, and other additives. The mixture is poured into a mold and allowed to foam, giving an integral-skin polyurethane foam having a density of 0.3-0.8g/cm .
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公开(公告)号：JPH04352498A
公开(公告)日：1992-12-07
申请号：JP15380891
申请日：1991-05-30
Applicant: MITSUI TOATSU CHEMICALS
Inventor： NAKAYAMA ICHIRO , YOKODE SEIJI
Abstract: PURPOSE:To provide an insulation paste for electromagnetic shield with a high permeability and an insulation property so that an electromagnetic wave which is radiated from a printed-circuit board to the outside can be suppressed and at the same time a noise which is given from the outside to the printed-circuit board can be reduced. CONSTITUTION:A title item which contains a soft magnetic body powder of 200-900 pts.wt. such as ferrite powder or iron alloy powder for an insulation resin of 100 pts.wt. such as a thermoplastic resin, a thermosetting resin, an ultraviolet-rays curing resin, and an electron rays curing resin is applied to an insulation substrate 1 of a circuit substrate by screen printing so that a wiring conductor 2 which is formed on a surface is coated, forming an electromagnetic shield layer 3.
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Patent Agency Ranking
公开(公告)号：JPH08245741A
公开(公告)日：1996-09-24
申请号：JP5003995
申请日：1995-03-09
Applicant: MITSUI TOATSU CHEMICALS
Inventor： KOGA NOBUSHI , INOUE HIROSHI , YOKODE SEIJI , SAKAI MASAMI
Abstract: PURPOSE: To obtain an integrally skinned polyurethane foam which is useful in car parts and furniture having no bulge or blister by casting a reaction mixture containing an aromatic polyisocyanate, a high-molecular isocyanate- reactive compound and a specific expanding agent into a mold. CONSTITUTION: A reaction mixture containing (A) an aromatic polyisocyanate, (B) a high-molecular isocyanate-reactive compound, (C) an expanding agent comprising an organic dicarboxylic acid or its compound (for example, an organic dicarboxylate ester or its salt) and, when needed, a crosslinking agent, a catalyst, a foaming agent, a foam stabilizer and other aids or auxiliary agents is cast into a mold to effect the reactive injection molding to give the objective foam having a molded product density of 0.3-0.8g/cm .
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公开(公告)号：JPH06102668A
公开(公告)日：1994-04-15
申请号：JP24963092
申请日：1992-09-18
Applicant: MITSUI TOATSU CHEMICALS
Inventor： NAKAYAMA ICHIRO , YOKODE SEIJI
Abstract: PURPOSE:To provide a photosensitive resin compsn. easily developable with an aq. alkali soln., capable of forming a high precision protective coating film of an arbitrary shape by a photo process at the time of film formation and protecting the metal part of a precise metal worked product or a printed circuit board requiring fine metal working from heat, chemicals and solvents or preventing the surface of a metal or a conductor circuit from rusting due to acids and moisture in the air. CONSTITUTION:This photosensitive resin compsn. consists essentially of a photosensitive metal acylated compd. having Si, Ge, Ti or Zr as the central metal and an alpha,beta-unsatd. group and a reactional product obtd. by allowing epoxy acrylate to react with a polybasic acid anhydride.
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公开(公告)号：JPH08176250A
公开(公告)日：1996-07-09
申请号：JP32041794
申请日：1994-12-22
Applicant: MITSUI TOATSU CHEMICALS
Inventor： YOKODE SEIJI , KOGA NOBUSHI , INOUE HIROSHI , SAKAI MASAMI
Abstract: PURPOSE: To produce an integral-skin polyurethane foam which cures in a short time without causing swelling even at the free-blow density by pouring a reaction mixture contg. an arom. polyisocyanate, a high-molecular isocyanate- reactive compd., and a specific blowing agent into a mold. CONSTITUTION: A reaction mixture is prepd. by mixing an arom. polyisocyanate, a high-molecular isocyanate-reactive compd. having an OH value of 24-55mgKOH /g, an ethylene oxide content of 10-25wt.%, and a ratio of primary terminal OH groups to all terminal OH groups of 70-95mol%, a blowing agent comprising phosphoric acid and/or its compd., and if necessary a cross-linker, a catalyst, another blowing agent, a foam stabilizer, and other additives. The mixture is poured into a mold and allowed to foam, giving an integral-skin polyurethane foam having a density of 0.3-0.8g/cm .
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公开(公告)号：JPH0595197A
公开(公告)日：1993-04-16
申请号：JP25359991
申请日：1991-10-01
Applicant: MITSUI TOATSU CHEMICALS
Inventor： NAKAYAMA ICHIRO , YOKODE SEIJI
Abstract: PURPOSE:To provide a printed wiring board and a dielectric substrate for use therein, wherein the printed wiring board can suppress electromagnetic waves emitted outside the printed wiring board, and can mitigate high frequency noises entering the printed circuit board from the outside. CONSTITUTION:Dielectric paste is applied to both surfaces of a dielectric substrate 1 to produce magnetic layers 2 and 3, wherein the dielectric paste with a high permeability contains 100 pts.wt. of insulative resin such as thermoplastic resin, thermoset resin, ultraviolet-curing resin, and contains electron-beam curing resin and 200-900 pts.wt. of a soft magnetic material powder such as a ferrite powder or a ferro alloy powder. Conductive layers 4 and 5 are also formed over the magnetic layers, thereby constituting a printed circuit board. A dielectric substrate, for use in a printed wiring board, having a function of electromagnetic shielding is then produced by impregnating a dielectric material with the dielectric paste.
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公开(公告)号：JPS63280497A
公开(公告)日：1988-11-17
申请号：JP11368987
申请日：1987-05-12
Applicant: MITSUI TOATSU CHEMICALS
Inventor： NISHIHARA KUNIO , GOTO YOSHIHISA , SUZUKI SHOZO , YOKODE SEIJI
IPC: H05K3/46
Abstract: PURPOSE:To shorten the time for the process of a multilayer circuit board, simplify the operation and facilitate the material control, by using a circuit board on which a pattern is formed, as the core material to be laminated through a thermo-plastic resin insulating layer with its heat deformation temperature (HDT) in the specific value or more. CONSTITUTION:Polyphenylene sulfide or the like, blended with polyether sulfone, polyether imide, polyallylate, polysulfone, polyamideimide, liquid crystal polymer, thermoplastic polyimide or glass short fiber and the like, is cited for use as thermoplastic resin with its HDT at 150 deg. or more preferably 180 deg. or more. The thermoplastic resin with its HDT lower than 150 deg.C, which generates deformation when a part is soldered to a multilayer circuit board, is not preferable. A board forming a thermoplastic resin layer 4 on both sides of the obtained circuit board B, is drilled in similar manner as an ordinary additive both-side board and then subjected to plating to a through hole and a pattern thereby obtaining the multilayer circuit board via a process of resist film forming or the like.
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