METHOD FOR ATTACHING SPACER IN FLAT PANEL DISPLAY

    公开(公告)号:JPH1092314A

    公开(公告)日:1998-04-10

    申请号:JP24945197

    申请日:1997-08-28

    Applicant: MOTOROLA INC

    Abstract: PROBLEM TO BE SOLVED: To avoid air tightness tolerance conditions, form a right angle, and enhance processing quantity by aligning a handle/jig structure of a spacer with a joining region of a bonding material formed on a display plate and joining the spacer. SOLUTION: A joining material 130 containing a glass flit pattern-formed on a display plate preferably including an anode plate contains plural joining region 140. In a structure 200, a pair of spacer handles 245 and 246 containing plural spacers 240 to be abutted with each other in parallel to a main surface of a jig 210 and laminated is formed and is separated by a center divider 260. In the jig 210, a support member 230 is movable along a transverse direction on a top surface of a base plate 220. A structure 200 is aligned on the display plate, a part of the spacer 240 is joined with the region 140 by heating, after which the handles 245 and 246 are removed. Thereby, alignment of individual spacers with each other is unnecessary.

    A method for sealing display devices

    公开(公告)号:AU6130501A

    公开(公告)日:2001-11-26

    申请号:AU6130501

    申请日:2001-05-07

    Applicant: MOTOROLA INC

    Abstract: A method of fabricating a high vacuum display with flat form factor, and the display, include an envelope with two major, parallel spaced apart glass sides and a continuous edge therebetween. An opening is formed through one of the glass sides of the envelope. A plate is provided with an area larger than the opening in the envelope. A button with an area slightly smaller than the opening may be formed on one side of the plate. A low temperature melting material is positioned on the plate around the button and the envelope is positioned in a substantial vacuum. The button is placed in the opening with the plate abutting the glass side outside of the envelope and the low temperature melting material is melted using heat and/or pressure to sealingly engage the button within the opening.

    MEMS CONTROL CHIP INTEGRATION
    3.
    发明专利

    公开(公告)号:AU2003302161A1

    公开(公告)日:2004-06-23

    申请号:AU2003302161

    申请日:2003-07-25

    Applicant: MOTOROLA INC

    Abstract: An exemplary method and apparatus for MEMS device control-chip integration and packaging comprises inter alia: a device substrate (300) comprising at least one MEMS device element (315) and at least a first interconnect pad (350); and a control-chip lid substrate (460) comprising at least a second interconnect pad (410), wherein the first interconnect pad (350) is suitably adapted for substantial engagement with the second interconnect pad (410) in order to communicably connect an integrated control chip (400) to a MEMS device element (315). Disclosed features and specifications may be variously controlled, adapted or otherwise optionally modified to improve component density and/or form factor for any MEMS device. An exemplary embodiment of the present invention representatively provides for HV control-chip driver integration and packaging of RF MEMS switches.

    Spacer with passivation layer for a field emission display and method of manufacturing the display

    公开(公告)号:AU5469200A

    公开(公告)日:2001-02-19

    申请号:AU5469200

    申请日:2000-06-07

    Applicant: MOTOROLA INC

    Abstract: A method for fabricating a field emission display (100) includes the steps of providing a cathode plate (102), providing an anode plate (104), providing a spacer substrate (160) made from a bulk spacer material (109), cutting the spacer substrate (160) to define a spacer (108) having a surface (107), passivating the surface (107) of the spacer (108) using the bulk spacer material (109) to form a passivation layer, and disposing the spacer (108) between the cathode plate (102) and the anode plate (104). A field emission display (100) which includes a cathode plate (102) having a plurality of electron emitters (124), an anode plate (104) opposing the cathode plate (102), and a spacer (108) extending between the cathode plate (102) and anode plate (104). The spacer (108) has a passivation layer made from bulk spacer material (109).

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