公开(公告)号：AU8064601A

公开(公告)日：2002-03-22

申请号：AU8064601

申请日：2001-07-19

Applicant: MOTOROLA INC

Inventor： YAMAMOTO JOYCE K ,  HOWARD EMMETT M ,  DWORSKY LAWRENCE N

IPC: H01J29/86 ,  H01J31/12

Abstract: A field emissive display (40) having an anode plate (10) coupled to a cathode plate (20) and a method for manufacturing the field emissive display (40). A substrate (21) of the cathode plate (20) is manufactured or selected such that its coefficient of thermal expansion substantially matches that of the anode plate (10), i.e., the coefficients of thermal expansion of the cathode plate (20) and the anode plate (10) are within ten percent of each other. The cathode plate (20) is coupled to the anode plate (10) by means of a frit structure (41) whose coefficient of thermal expansion preferably substantially matches that of the cathode plate (20) and the anode plate (10). A control circuit can be mounted to the bottom surface of the field emissive display (40).

公开(公告)号：AU5469200A

公开(公告)日：2001-02-19

申请号：AU5469200

申请日：2000-06-07

Applicant: MOTOROLA INC

Inventor： SMITH PETER A ,  YAMAMOTO JOYCE K ,  AMRINE CRAIG ,  NILSSON THOMAS ,  SMITH STEVEN M

IPC: H01J9/24 ,  H01J9/18 ,  H01J29/87 ,  H01J31/12 ,  H01J29/02

Abstract: A method for fabricating a field emission display (100) includes the steps of providing a cathode plate (102), providing an anode plate (104), providing a spacer substrate (160) made from a bulk spacer material (109), cutting the spacer substrate (160) to define a spacer (108) having a surface (107), passivating the surface (107) of the spacer (108) using the bulk spacer material (109) to form a passivation layer, and disposing the spacer (108) between the cathode plate (102) and the anode plate (104). A field emission display (100) which includes a cathode plate (102) having a plurality of electron emitters (124), an anode plate (104) opposing the cathode plate (102), and a spacer (108) extending between the cathode plate (102) and anode plate (104). The spacer (108) has a passivation layer made from bulk spacer material (109).

公开(公告)号：EP0857355A4

公开(公告)日：1999-06-09

申请号：EP97934033

申请日：1997-07-08

Applicant: MOTOROLA INC

Inventor： MATTSON JOHN E ,  SKODA WILLIAM G ,  CHAUDHARI PIYUSH ,  YAMAMOTO JOYCE K ,  MIESEM ROSS A

IPC: H01L23/02 ,  H01L21/48 ,  H01L23/04 ,  H01L23/498 ,  H01L23/50 ,  H01L21/60 ,  H01L23/495

CPC classification number: H01L23/49861 ,  H01L21/4846 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: A method of producing a glass/metal package where a glass portion of the package is built up around a provided leadframe (10) using applications of solderable and glass pastes (20) which are subsequently fired (30). The glass paste and leadframe are chosen to have similar coefficients of expansion and the leadframe is pretreated to degasify and control oxidation of the metal to promote glass adhesion to the leadframe and prevent microcracking at a glass/metal interface. A seal ring is applied to the glass paste (40) and a lid is attached to the seal ring (50). The package is used to provide a sealed inert internal environment for sensitive electronic components such as a piezoelectric element. The package may be configured for leaded or surface mounting (60).

Abstract translation: 一种制造玻璃/金属封装的方法，其中，使用随后烧制的可焊接和玻璃浆料（20），围绕所提供的引线框架（10）构建所述封装的玻璃部分。 玻璃浆料和引线框架被选择为具有相似的膨胀系数，引线框架被预处理以对金属进行脱气和控制氧化，以促进玻璃与引线框架的粘附，并防止在玻璃/金属界面处的微裂纹。 将密封环施加到玻璃糊（40）上，并且将盖附接到密封环（50）。 封装用于为诸如压电元件的敏感电子部件提供密封的惰性内部环境。 封装可以被配置为用于引线或表面安装（60）。