Abstract:
A protective photochromic barrier film for a light-sensitive printed electronic substrate. Light-sensitive semiconductor devices on a dielectric substrate are electrically connected by conductors. A barrier layer containing photochromic dyes covers some or all of the light-sensitive semiconductor devices. Upon exposure to visible, infrared, or ultraviolet light, the photochromic dyes change chemical structure and decrease the amount of visible or non-visible light that can impinge upon the light-sensitive electronic devices. Upon removal of the visible or non-visible light, the photochromic dyes either revert to their original structure or maintain their altered state.
Abstract:
A printed multilayer electronic circuit has printed electronic components on a first level circuit. Electrical conductors are printed on the first level circuit, electrically connected to the electronic components. A layer of dielectric material is printed over the printed electrical conductors. The dielectric layer contains apertures or openings that extend vertically through the dielectric layer down to the electrical conductors. A second set of electrical conductors are then printed on the dielectric layer, situated around the apertures. Electrically conductive material is printed in the apertures so that an electrical connection is made from the second set of electrical conductors to the electrical conductors on the lower level. A second level circuit having additional electronic components is then formed on the dielectric layer and the second set of conductors, so that these electronic components are electrically connected to the electronic components on the first level circuit through the path of the printed second set of electrical conductors, the printed electrically conductive material, and the printed electrical conductors on the lower level.
Abstract:
A printed electronic device and methods for determining the electrical value of the device. A dielectric material is contact printed on a substrate using a preset force. The substrate has a pressure sensitive material that is optically responsive in direct proportion to the amount of force imparted by the contact printing. The force of the contact printing causes the pressure sensitive material to form a pattern that is quantifiable to the amount of force. The pattern is then optically inspected and compared to sets of standards in order to quantify the amount of force that was used in printing. The thickness of the printed dielectric material is then calculated based on the quantified force by comparing to another set of standards. The electrical value of the printed material is calculated based on the calculated thickness of the printed dielectric material, the surface area of the printed dielectric material, and the dielectric constant of the dielectric material.
Abstract:
The present invention (Figure 1) is directed to semiconductor films and a process for their preparation. In accordance with the process of the present invention, semiconductor organic material is blended with a multi-component solvent blend and the blend is deposited on a receiving material to provide a continuous highly ordered film having greater periodicity than films produced with a single solvent/semiconducting material blend under similar processing conditions.
Abstract:
Two or more semiconductor devices (21 and 22) are formed on a substrate (20) and are each comprised of a plurality of printed components (23 and 24). At least one such printed component (25) is shared by both such semiconductor devices.
Abstract:
One facilitates determination of a path that comprises a plurality of specific locations (Fig 1, Bl 101). in an optional though preferred embodiment these specific locations comprise locations where a given functional ink will preferably be printed using a continuous printing spray. Also in an optional though preferred embodiment this path will also avoid at least one predetermined area (Fig 1. Bl 102) where such a functional ink should not be printed. In a preferred approach this process generally provides for identifying these specific locations and further identifying, when applicable, the one or more predetermined areas to be avoided. This process then preferably uses a processor to effect at least one (and preferably both) of using a genetic algorithm to identify a preferred path that includes the plurality of specific locations and using an A* algorithm to process a candidate path to provide a selected path that includes the plurality of specific locations while also avoiding the at least one predetermined area (Fig 1, Bl 104).