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公开(公告)号:AU2003256620A1
公开(公告)日:2004-03-03
申请号:AU2003256620
申请日:2003-07-18
Applicant: MOTOROLA INC
Inventor: TALIN ALBERT ALEC , BAKER JEFFREY H , DAUKSHER WILLIAM J , HOOPER ANDY , RESNICK DOUGLAS J
Abstract: This invention relates to semiconductor devices, microelectronic devices, micro electro mechanical devices, microfluidic devices, photonic devices, and more particularly to a lithographic template, a method of forming the lithographic template and a method for forming devices with the lithographic template. The lithographic template ( 10 ) is formed having a substrate ( 12 ), a transparent conductive layer ( 16 ) formed on a surface ( 14 ) of the substrate ( 12 ) by low pressure sputtering to a thickness that allows for preferably 90% transmission of ultraviolet light therethrough, and a patterning layer ( 20 ) formed on a surface ( 18 ) of the transparent conductive layer ( 16 ). The template ( 10 ) is used in the fabrication of a semiconductor device ( 30 ) for affecting a pattern in device ( 30 ) by positioning the template ( 10 ) in close proximity to semiconductor device ( 30 ) having a radiation sensitive material formed thereon and applying a pressure to cause the radiation sensitive material to flow into the relief image present on the template. Radiation is then applied through the template so as to cure portions of the radiation sensitive material and define the pattern in the radiation sensitive material. The template ( 10 ) is then removed to complete fabrication of semiconductor device ( 30 ).
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公开(公告)号:WO2004017388A3
公开(公告)日:2004-08-12
申请号:PCT/US0322559
申请日:2003-07-18
Applicant: MOTOROLA INC
Inventor: TALIN ALBERT ALEC , BAKER JEFFREY H , DAUKSHER WILLIAM J , HOOPER ANDY , RESNICK DOUGLAS J
CPC classification number: B82Y10/00 , B82Y40/00 , C23C14/086 , G03F7/0002 , G03F7/0017 , G03F7/093
Abstract: This invention relates to semiconductor devices, microelectronic devices, micro electro mechanical devices, microfluidic devices, photonic devices, and more particularly to a lithographic template having a substrate (12), a transparent conductive layer (16) formed on a surface (14) of the substrate (12) by low pressure sputtering to a thickness that allows for preferably 90% transmission of ultraviolet light therethrough, and a patterning layer (20) formed on a surface (18) of the transparent conductive layer (16). The template (10) is used in the fabrication of a semiconductor device (30) for affecting a pattern in device (30) by positioning the template (10) in close proximity to semiconductor device (30) having a radiation sensitive material formed thereon and applying a pressure to cause the radiation sensitive material to flow into the relief image present on the template. Radiation is then applied through the template so as to cure portions of the radiation sensitive material and define the pattern in the radiation sensitive material.
Abstract translation: 本发明涉及半导体器件,微电子器件,微机电器件,微流体器件,光子器件,更具体地涉及一种光刻模板,其具有衬底(12),形成在衬底(12)的表面(14)上的透明导电层 通过低压溅射将衬底(12)的厚度设置为允许紫外光优选透过90%的厚度,以及形成在透明导电层(16)的表面(18)上的图案化层(20)。 模板(10)用于制造半导体器件(30),用于通过将模板(10)放置在靠近其上形成有辐射敏感材料的半导体器件(30)的位置来影响器件(30)中的图案,以及 施加压力以使辐射敏感材料流入存在于模板上的浮雕图像中。 然后通过模板施加辐射,以固化辐射敏感材料的一部分并在辐射敏感材料中限定图案。
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