公开(公告)号：AU2003224701A8

公开(公告)日：2003-11-10

申请号：AU2003224701

申请日：2003-03-17

Applicant: MOTOROLA INC

Inventor： LIAN KERYN ,  ELIACIN MANES ,  LEMPKOWSKI ROBERT B ,  LIU JUNHUA

IPC: B81C1/00 ,  B81B3/00 ,  H01H59/00 ,  H01P1/10

公开(公告)号：AU2003224701A1

公开(公告)日：2003-11-10

申请号：AU2003224701

申请日：2003-03-17

Applicant: MOTOROLA INC

Inventor： LIAN KERYN ,  LIU JUNHUA ,  LEMPKOWSKI ROBERT B ,  ELIACIN MANES

IPC: B81C1/00 ,  B81B3/00 ,  H01H59/00

公开(公告)号：WO03092048B1

公开(公告)日：2004-10-07

申请号：PCT/US0308255

申请日：2003-03-17

Applicant: MOTOROLA INC

Inventor： ELIACIN MANES ,  LIAN KERYN ,  LIU JUNHUA ,  LEMPKOWSKI ROBERT B

IPC: B81C1/00 ,  B81B3/00 ,  H01H59/00 ,  H01P1/10

CPC classification number: H01H59/0009 ,  H01G5/16 ,  H01H2001/0073 ,  H01H2059/0054

Abstract: A meso-scale MEMS device having a cantilevered beam (113) is formed using standard printed wiring board and high density interconnect technologies and practices. The beam includes at least some polymer material (71) to constitute its length, and in some embodiments also comprises a conductive material as a load-bearing component thereof. In varying embodiments, the beam is attached at a location proximal to an end thereof, or distal to an end thereof.

Abstract translation: 使用标准印刷线路板和高密度互连技术和实践形成具有悬臂梁（113）的中尺度MEMS器件。 梁包括至少一些聚合物材料（71）以构成其长度，并且在一些实施例中还包括导电材料作为其承载部件。 在不同的实施例中，梁被附接在靠近其端部或远离其端部的位置处。

公开(公告)号：WO03092048A2

公开(公告)日：2003-11-06

申请号：PCT/US0308255

申请日：2003-03-17

Applicant: MOTOROLA INC

Inventor： ELIACIN MANES ,  LIAN KERYN ,  LIU JUNHUA ,  LEMPKOWSKI ROBERT B

IPC: B81C1/00 ,  B81B3/00 ,  H01H59/00 ,  H01L

CPC classification number: H01H59/0009 ,  H01G5/16 ,  H01H2001/0073 ,  H01H2059/0054

Abstract: A meso-scale MEMS device having a cantilevered beam is formed using standard printed wiring board and high density interconnect technologies and practices. The beam includes at least some polymer material to constitute its length, and in some embodiments also comprises a conductive material as a load-bearing component thereof. In varying embodiments, the beam is attached at a location proximal to an end thereof, or distal to an end thereof.

Abstract translation: 使用标准印刷线路板和高密度互连技术和实践形成具有悬臂梁的中尺度MEMS器件。 梁包括构成其长度的至少一些聚合物材料，并且在一些实施例中还包括作为其承载部件的导电材料。 在不同的实施例中，梁被附接在靠近其端部的位置处，或者远离其端部。

公开(公告)号：EP1502282A4

公开(公告)日：2007-06-13

申请号：EP03721384

申请日：2003-03-17

Applicant: MOTOROLA INC

Inventor： ELIACIN MANES ,  LIAN KERYN ,  LIU JUNHUA ,  LEMPKOWSKI ROBERT B

IPC: B81C1/00 ,  B81B3/00 ,  H01H59/00 ,  H01L21/00

CPC classification number: H01H59/0009 ,  H01G5/16 ,  H01H2001/0073 ,  H01H2059/0054

Abstract: A meso-scale MEMS device having a cantilevered beam (113) is formed using standard printed wiring board and high density interconnect technologies and practices. The beam includes at least some polymer material (71) to constitute its length, and in some embodiments also comprises a conductive material as a load-bearing component thereof. In varying embodiments, the beam is attached at a location proximal to an end thereof, or distal to an end thereof.