公开(公告)号：AU2002340386A1

公开(公告)日：2003-06-10

申请号：AU2002340386

申请日：2002-11-06

Applicant: MOTOROLA INC

Inventor： PAVIO ANTHONY M ,  MIESEM ROSS A ,  DAI XUNHU

IPC: F04B19/00 ,  F04B53/10 ,  F04B43/04

Abstract: A multilayer ceramic micropump including a monolithic ceramic package formed of a plurality of ceramic layers defining therein an integrated first ball check valve, and a second ball check valve in microfluidic communication with the first ball check valve, and an actuator characterized as actuating a pumping motion, thereby pumping fluids through the first ball check valve and the second ball check valve.

公开(公告)号：AU2571502A

公开(公告)日：2002-06-18

申请号：AU2571502

申请日：2001-11-19

Applicant: MOTOROLA INC

Inventor： BURDON JEREMY W ,  MIESEM ROSS A ,  KORIPELLA CHOWDARY RAMESH

IPC: H01L21/48 ,  H05K1/03 ,  H05K3/40 ,  H01L23/498

Abstract: A method for forming an electrically isolated via in a multilayer ceramic package and an electrical connection formed within the via are disclosed. The method includes punching a first via in a first layer, filling the first via with a cross-linkable paste, curing the paste to form an electrical insulator precursor and forming the via in the insulator precursor. The electrical connection formed includes an insulator made from a cross-linked paste supported by a substrate of a multilayer ceramic package and a conductive connection supported by the insulator.

公开(公告)号：AU4937801A

公开(公告)日：2001-10-08

申请号：AU4937801

申请日：2001-03-22

Applicant: MOTOROLA INC

Inventor： HUANG RONG-FONG ,  SHANG JIAN-KU ,  MIESEM ROSS A

IPC: B23K35/02 ,  B23K35/14 ,  B23K35/26

公开(公告)号：EP0857355A4

公开(公告)日：1999-06-09

申请号：EP97934033

申请日：1997-07-08

Applicant: MOTOROLA INC

Inventor： MATTSON JOHN E ,  SKODA WILLIAM G ,  CHAUDHARI PIYUSH ,  YAMAMOTO JOYCE K ,  MIESEM ROSS A

IPC: H01L23/02 ,  H01L21/48 ,  H01L23/04 ,  H01L23/498 ,  H01L23/50 ,  H01L21/60 ,  H01L23/495

CPC classification number: H01L23/49861 ,  H01L21/4846 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: A method of producing a glass/metal package where a glass portion of the package is built up around a provided leadframe (10) using applications of solderable and glass pastes (20) which are subsequently fired (30). The glass paste and leadframe are chosen to have similar coefficients of expansion and the leadframe is pretreated to degasify and control oxidation of the metal to promote glass adhesion to the leadframe and prevent microcracking at a glass/metal interface. A seal ring is applied to the glass paste (40) and a lid is attached to the seal ring (50). The package is used to provide a sealed inert internal environment for sensitive electronic components such as a piezoelectric element. The package may be configured for leaded or surface mounting (60).

Abstract translation: 一种制造玻璃/金属封装的方法，其中，使用随后烧制的可焊接和玻璃浆料（20），围绕所提供的引线框架（10）构建所述封装的玻璃部分。 玻璃浆料和引线框架被选择为具有相似的膨胀系数，引线框架被预处理以对金属进行脱气和控制氧化，以促进玻璃与引线框架的粘附，并防止在玻璃/金属界面处的微裂纹。 将密封环施加到玻璃糊（40）上，并且将盖附接到密封环（50）。 封装用于为诸如压电元件的敏感电子部件提供密封的惰性内部环境。 封装可以被配置为用于引线或表面安装（60）。

公开(公告)号：WO0172466A2

公开(公告)日：2001-10-04

申请号：PCT/US0109316

申请日：2001-03-22

Applicant: MOTOROLA INC

Inventor： HUANG RONG-FONG ,  SHANG JIAN-KU ,  MIESEM ROSS A

IPC: B23K35/02 ,  B23K35/14 ,  B23K35/26

CPC classification number: B23K35/025 ,  B23K35/0244

Abstract: Solder and a method of manufacturing the solder are disclosed wherein powdered free silver (15) is added to a solder alloy (12) with a particle size sufficient to preserve silver metallization during use and with a concentration sufficient to maximize the effectiveness and avoid adverse effects on solder reflow characteristics. Preferably, the particle size is in a range of approximately 5 mu m to 20 mu m and the powdered free silver is added in a concentration of approximately 5 % to 10 %.

Abstract translation: 公开了焊料和制造焊料的方法，其中向焊料合金（12）添加粉末状游离银（15），其具有足以在使用期间保持银金属化的粒径，并具有足以使效率最大化并避免不利影响的浓度 焊锡回流特性。 优选地，粒度在约5μm至20μm的范围内，并且以约5％至10％的浓度加入粉状游离的银。

公开(公告)号：WO0247148A3

公开(公告)日：2003-05-15

申请号：PCT/US0143858

申请日：2001-11-19

Applicant: MOTOROLA INC

Inventor： BURDON JEREMY W ,  MIESEM ROSS A ,  KORIPELLA CHOWDARY RAMESH

IPC: H01L21/48 ,  H05K1/03 ,  H05K3/40 ,  H01L23/498

CPC classification number: H05K3/4061 ,  H01L21/486 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2201/09809 ,  Y10T29/49083 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method for forming an electrically isolated via in a multilayer ceramic package and an electrical connection formed within the via are disclosed. The method includes punching a first via (30) in a first layer (10), filling the first via with a cross-linkable paste (40), curing the paste to form an electrical insulator precursor and forming the via in the insulator precursor. The electrical connection formed includes an insulator made from a cross-linked paste supported by a substrate of a multilayer ceramic package and a conductive connection supported by the insulator.

Abstract translation: 公开了一种在多层陶瓷封装中形成电隔离通孔的方法和形成在通孔内的电连接。 该方法包括冲压第一层（10）中的第一通孔（30），用可交联的糊剂（40）填充第一通孔，固化糊料以形成电绝缘体前体并在绝缘体前体中形成通孔。 形成的电连接包括由多层陶瓷封装的衬底支撑的交联膏和由绝缘体支撑的导电连接器制成的绝缘体。