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公开(公告)号：US4864276C1
公开(公告)日：2001-01-09
申请号：US20233188
申请日：1988-06-03
Applicant: MOTOROLA INC
Inventor： TRIBBEY DAVID A , MOONEY CHARLES W , ROLLINS THOMAS J
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Patent Agency Ranking
公开(公告)号：AU6032394A
公开(公告)日：1994-08-15
申请号：AU6032394
申请日：1994-01-19
Applicant: MOTOROLA INC
Inventor： HERTZ ALLEN DAVID , TRIBBEY DAVID A
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公开(公告)号：CA2117404A1
公开(公告)日：1995-02-03
申请号：CA2117404
申请日：1994-07-25
Applicant: MOTOROLA INC
Inventor： TRIBBEY DAVID A , LIEBMAN HENRY F , HERTZ ALLEN D , ALBERTSON PETER E
Abstract: A method and an apparatus align and attach a leadless surface mount component (402) including a termination at each end of the component (402). The termination has bottom (704) and end (702) portions for attaching to a corresponding pad on a substrate (102) by a reflow solder process (1200). A pad arrangement (100) is formed including two opposite pads (108), each pad (108) occupying a tri-oval-shaped area. The tri-oval-shaped area includes an elliptical area (110) substantially centered un der the bottom portion (704) of the corresponding termination of the component (402) when the component (402) is aligned with the pad arrangement (100), and an arcuate area (112) contiguous with the elliptical area (110) and extending towards the opposite pad (108) in a central lengthwise direction. A solder paste (202) is applied to the elliptical area (110), and thereafter reflowed, whereby solder (302) in the solder paste (202) liquefies and flows onto the arcuate area (112), thereby facilitating alignment of the component (402) with the pad arrangement (100).
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公开(公告)号：AU5143693A
公开(公告)日：1994-01-24
申请号：AU5143693
申请日：1993-05-18
Applicant: MOTOROLA INC
Inventor： HERTZ ALLEN D , TRIBBEY DAVID A , THOMPSON KENNETH R
Abstract: A mounting pad arrangement (FIG. 5) improves reliability of placement of a surface mount component. A first pad array is disposed throughout an area on the surface (308) of a substrate (202), the area having four outside corners. The first pad array includes contact pads (502) arranged in a first linear grid pattern, and eight aligning pads (504,506,510,514,518), larger than the contact pads (502). Two aligning pads (504,506,510,514,518) are near each of the four outside corners. Each aligning pad (504,506,510,514,518) is positioned off center with respect to the first linear grid pattern such that a tangential line (608,610,612,614) can be drawn between an innermost point of the aligning pad (504,506,510,514,518) and corresponding innermost points of the contact pads (502) that are collinear on the first linear grid pattern. A second pad array (406) is disposed on the surface mount component and arranged in a second linear grid pattern that aligns with the first linear grid pattern. Eight pads of the second pad array (406) also align with points of intersection of the first linear grid pattern that fall within each of the eight aligning pads (504,506,510,514,518). Each pad of the second pad array (406) is equal in size to any other pad of the second pad array (406). Solder (312) is disposed between and contacting each pad of the first and second pad arrays.
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公开(公告)号：CA2138032A1
公开(公告)日：1994-01-06
申请号：CA2138032
申请日：1993-05-18
Applicant: MOTOROLA INC
Inventor： HERTZ ALLEN D , TRIBBEY DAVID A , THOMPSON KENNETH R
Abstract: A surface mount component placement arrangement includes a circuit supporting substrate (202) having a first surface (308), and disposed thereon are a first pad array (502) and a first at least one aligning pad (506). A component (802) has a second surface (801), the second surface (801) substantially opposing the first surface (308), and disposed on the second surface (801) are second pad array (406) and a second at least one aligning pad (508). The first and second pad arrays (406, 502) at least partially overlap with each other. The aligning pads (506, 508) at least partially overlap with each other relative to a second tolerance of the placement operation. The partially overlapping pair of pads (506, 508) are oriented relative to each other such that when solder therebetween is liquid the surface tension of the solder can move the component (802) relative to the circuit supporting substrate.
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公开(公告)号：EP0651937A4
公开(公告)日：1995-08-30
申请号：EP93911348
申请日：1993-05-18
Applicant: MOTOROLA INC
Inventor： HERTZ ALLEN D , TRIBBEY DAVID A , THOMPSON KENNETH R
CPC classification number: B23K1/20 , B23K2201/40 , H01L2224/13012 , H01L2224/1403 , H01L2224/14051 , H05K1/111 , H05K3/3436 , H05K13/046 , H05K2201/094 , H05K2201/10719 , H05K2201/10734 , H05K2203/048 , H05K2203/166 , Y02P70/611 , Y02P70/613
Abstract: A surface mount component placement arrangement includes a circuit supporting substrate (202) having a first surface (308), and disposed thereon are a first pad array (502) and a first at least one aligning pad (506). A component (802) has a second surface (801), the second surface (801) substantially opposing the first surface (308), and disposed on the second surface (801) are second pad array (406) and a second at least one aligning pad (508). The first and second pad arrays (406, 502) at least partially overlap with each other. The aligning pads (506, 508) at least partially overlap with each other relative to a second tolerance of the placement operation. The partially overlapping pair of pads (506, 508) are oriented relative to each other such that when solder therebetween is liquid the surface tension of the solder can move the component (802) relative to the circuit supporting substrate.
Abstract translation: 安装垫装置（图5）提高了表面安装部件的放置的可靠性。 第一衬垫阵列设置在衬底（202）的表面（308）上的整个区域中，该区域具有四个外角。 第一焊盘阵列包括以第一线性栅格图案布置的接触焊盘（502）和大于接触焊盘（502）的八个对准焊盘（504,506,510,514,518）。 两个对准垫（504,506,510,514,518）在四个外角中的每一个附近。 每个对准衬垫（504,506,510,514,518）相对于第一线性网格图案偏离中心，使得可以在对准衬垫（504,506,510,514,518）的最内点和接触垫（502）的相应最内点之间绘制切线（608,610,612,614） ），其在第一线性网格图案上是共线的。 第二衬垫阵列（406）设置在表面安装部件上并且布置成与第一线性网格图案对准的第二线性网格图案。 第二焊盘阵列（406）的八个焊盘还与落在八个对准焊盘（504,506,510,514,518）的每一个中的第一线性栅格图案的交点相对准。 第二焊盘阵列（406）的每个焊盘的大小与第二焊盘阵列（406）的任何其它焊盘相同。 焊料（312）设置在第一和第二焊盘阵列之间并接触第一和第二焊盘阵列的每个焊盘。
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