公开(公告)号：WO1998009324A1

公开(公告)日：1998-03-05

申请号：PCT/US1997011436

申请日：1997-07-08

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  MATTSON, John, E. ,  SKODA, William, G. ,  CHAUDHARI, Piyush ,  YAMAMOTO, Joyce, K. ,  MIESEM, Ross, A.

IPC: H01L21/60

CPC classification number: H01L23/49861 ,  H01L21/4846 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: A method of producing a glass/metal package where a glass portion of the package is built up around a provided leadframe (10) using applications of solderable and glass pastes (20) which are subsequently fired (30). The glass paste and leadframe are chosen to have similar coefficients of expansion and the leadframe is pretreated to degasify and control oxidation of the metal to promote glass adhesion to the leadframe and prevent microcracking at a glass/metal interface. A seal ring is applied to the glass paste (40) and a lid is attached to the seal ring (50). The package is used to provide a sealed inert internal environment for sensitive electronic components such as a piezoelectric element. The package may be configured for leaded or surface mounting (60).

Abstract translation: 一种制造玻璃/金属封装的方法，其中使用随后烧制（30）的可焊接和玻璃浆料（20），围绕提供的引线框架（10）构建封装的玻璃部分。 玻璃浆料和引线框架被选择为具有相似的膨胀系数，引线框架经预处理以对金属进行脱气和控制氧化，以促进玻璃与引线框架的粘附，并防止玻璃/金属界面的微裂纹。 将密封环施加到玻璃膏（40）上，并且将盖子附接到密封环（50）。 该封装用于为诸如压电元件的敏感电子部件提供密封的惰性内部环境。 封装可以被配置为用于引线或表面安装（60）。

公开(公告)号：EP0857355A1

公开(公告)日：1998-08-12

申请号：EP97934033.0

申请日：1997-07-08

Applicant: MOTOROLA, INC.

Inventor： MATTSON, John, E. ,  SKODA, William, G. ,  CHAUDHARI, Piyush ,  YAMAMOTO, Joyce, K. ,  MIESEM, Ross, A.

IPC: H01L23 ,  H01L21

CPC classification number: H01L23/49861 ,  H01L21/4846 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: A method of producing a glass/metal package where a glass portion of the package is built up around a provided leadframe (10) using applications of solderable and glass pastes (20) which are subsequently fired (30). The glass paste and leadframe are chosen to have similar coefficients of expansion and the leadframe is pretreated to degasify and control oxidation of the metal to promote glass adhesion to the leadframe and prevent microcracking at a glass/metal interface. A seal ring is applied to the glass paste (40) and a lid is attached to the seal ring (50). The package is used to provide a sealed inert internal environment for sensitive electronic components such as a piezoelectric element. The package may be configured for leaded or surface mounting (60).