公开(公告)号：WO1997037948A1

公开(公告)日：1997-10-16

申请号：PCT/US1997005916

申请日：1997-04-08

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  BETHKE, Shelly, J. ,  MIESEM, Ross, A. ,  CHIOU, Wayne, W. ,  PASTOR, Rickey, G.

IPC: C03C03/078

CPC classification number: H01L23/15 ,  C03C8/14 ,  C03C8/20 ,  C03C14/004 ,  C03C2214/04 ,  C03C2214/20 ,  C03C2214/30 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H01L2924/00

Abstract: Multiphase ceramic materials for use in multilayered device fabrication may be fabricated by providing novel glassy precursor materials of a preferred composition, with operable amounts of non-glassy filler materials. The combined materials are fired at appropriate temperatures, so that a non-glassy anorthite type phase is formed. Material so fabricated is formed in a self-limiting process, in that reaction between the glassy precursor material and the non-glassy filler material is terminated when one constituent of the glassy precursor material is fully consumed. The materials of the instant invention, fabricated according to the method disclosed herein, demonstrate excellent dielectric constant, and electrical loss characteristics.

Abstract translation: 用于多层器件制造的多相陶瓷材料可以通过提供具有可操作量的非玻璃状填充材料的优选组成的新型玻璃状前体材料来制造。 组合的材料在合适的温度下烧制，从而形成非玻璃状钙长石型相。 如此制造的材料以自限制的方法形成，因为玻璃状前体材料和非玻璃状填充材料之间的反应在玻璃状前体材料的一个成分被完全消耗时终止。 根据本文公开的方法制造的本发明的材料表现出优异的介电常数和电损耗特性。

公开(公告)号：WO2003018509A1

公开(公告)日：2003-03-06

申请号：PCT/US2002/025251

申请日：2002-08-07

Applicant: MOTOROLA, INC.

Inventor： MIESEM, Ross, A. ,  LAW, Kristen, June ,  BURDON, Jeremy, W. ,  PASTOR, Rickey, G.

IPC: C04B41/90

CPC classification number: C04B41/009 ,  C04B41/52 ,  C04B41/89 ,  C04B2111/00844 ,  H01L21/4857 ,  H05K1/0306 ,  H05K1/167 ,  H05K3/38 ,  C04B41/4539 ,  C04B41/4572 ,  C04B41/4578 ,  C04B41/5031 ,  C04B41/0072 ,  C04B41/51 ,  C04B35/10 ,  C04B35/00

Abstract: An enhanced ceramic layer is produced for use in laminated ceramic devices. A layer of unfired ceramic material (20) is provided and a coating of dielectric material (22) (preferably alumina) is applied on at least one surface (21). The dielectric material forms a reaction barrier between excess glass forced to the surface during firing and metallization (25,26) positioned on the coating. The coating can be applied by screen printing, spraying a slurry of dielectric material, or spraying a slurry of dielectric material and an adhesive allowing low pressure lamination.

Abstract translation: 制造用于层压陶瓷器件的增强陶瓷层。 提供一层未焙烧的陶瓷材料（20），并且在至少一个表面（21）上施加电介质材料（22）（优选氧化铝）的涂层。 电介质材料在烧制过程中强制到表面的过量玻璃和位于涂层上的金属化（25,26）之间形成反应屏障。 可以通过丝网印刷，电介质材料的浆料喷涂或喷涂电介质材料的浆料和允许低压层压的粘合剂来施加涂层。

公开(公告)号：WO1998009324A1

公开(公告)日：1998-03-05

申请号：PCT/US1997011436

申请日：1997-07-08

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  MATTSON, John, E. ,  SKODA, William, G. ,  CHAUDHARI, Piyush ,  YAMAMOTO, Joyce, K. ,  MIESEM, Ross, A.

IPC: H01L21/60

CPC classification number: H01L23/49861 ,  H01L21/4846 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: A method of producing a glass/metal package where a glass portion of the package is built up around a provided leadframe (10) using applications of solderable and glass pastes (20) which are subsequently fired (30). The glass paste and leadframe are chosen to have similar coefficients of expansion and the leadframe is pretreated to degasify and control oxidation of the metal to promote glass adhesion to the leadframe and prevent microcracking at a glass/metal interface. A seal ring is applied to the glass paste (40) and a lid is attached to the seal ring (50). The package is used to provide a sealed inert internal environment for sensitive electronic components such as a piezoelectric element. The package may be configured for leaded or surface mounting (60).

Abstract translation: 一种制造玻璃/金属封装的方法，其中使用随后烧制（30）的可焊接和玻璃浆料（20），围绕提供的引线框架（10）构建封装的玻璃部分。 玻璃浆料和引线框架被选择为具有相似的膨胀系数，引线框架经预处理以对金属进行脱气和控制氧化，以促进玻璃与引线框架的粘附，并防止玻璃/金属界面的微裂纹。 将密封环施加到玻璃膏（40）上，并且将盖子附接到密封环（50）。 该封装用于为诸如压电元件的敏感电子部件提供密封的惰性内部环境。 封装可以被配置为用于引线或表面安装（60）。

公开(公告)号：WO2003046381A1

公开(公告)日：2003-06-05

申请号：PCT/US2002/035557

申请日：2002-11-06

Applicant: MOTOROLA, INC.

Inventor： DAI, Xunhu, ,  PAVIO, Anthony, M. ,  MIESEM, Ross, A.

IPC: F04B43/04

CPC classification number: F04B19/006 ,  F04B53/1002 ,  Y10T137/7838 ,  Y10T156/1056

Abstract: A multilayer ceramic micropump (10) including a monolithic ceramic package (13) formed of a plurality of ceramic layers (12) defining therein an integrated first ball check valve (14), and a second ball check valve (30) in microfluidic communication (24) with the first ball check valve, and an actuator characterized as actuating (44) a pumping motion, thereby pumping fluids through the first ball check valve and the second ball check valve.

Abstract translation: 一种多层陶瓷微型泵（10），包括由限定有集成的第一球止回阀（14）的多个陶瓷层（12）形成的单片陶瓷封装（13）和在微流体通信中的第二球止回阀（30） 24）与第一球止回阀，以及致动器，其特征在于致动（44）泵送运动，从而泵送流体通过第一球止回阀和第二球止回阀。

公开(公告)号：WO2002081143A1

公开(公告)日：2002-10-17

申请号：PCT/US2002/005721

申请日：2002-02-27

Applicant: MOTOROLA, INC.

Inventor： HUANG, Rong-Fong, ,  SHANG, Jian-Ku, ,  MIESEM, Ross, A.

IPC: B23K35/02

CPC classification number: B23K35/025 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/3006 ,  B23K2201/34 ,  B23K2201/38

Abstract: Solder and a method of manufacturing the solder are disclosed wherein powdered free silver (15) is added to a solder alloy (12) with a particle size sufficient to preserve silver metallization during use and with a concentration sufficient to maximize the effectiveness and avoid adverse effects on solder reflow characteristics. Preferably, the particle size is in a range of approximately 5 µm to 20 µm and the powdered free silver is added in a concentration of approximately 5% to 10%.

Abstract translation: 公开了焊料和制造焊料的方法，其中向焊料合金（12）添加粉末状游离银（15），其具有足以在使用期间保持银金属化的粒径，并具有足以使效率最大化并避免不利影响的浓度 焊锡回流特性。 优选地，粒径在约5μm至20μm的范围内，粉末状游离银以约5％至10％的浓度加入。

公开(公告)号：EP0857355A1

公开(公告)日：1998-08-12

申请号：EP97934033.0

申请日：1997-07-08

Applicant: MOTOROLA, INC.

Inventor： MATTSON, John, E. ,  SKODA, William, G. ,  CHAUDHARI, Piyush ,  YAMAMOTO, Joyce, K. ,  MIESEM, Ross, A.

IPC: H01L23 ,  H01L21

CPC classification number: H01L23/49861 ,  H01L21/4846 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: A method of producing a glass/metal package where a glass portion of the package is built up around a provided leadframe (10) using applications of solderable and glass pastes (20) which are subsequently fired (30). The glass paste and leadframe are chosen to have similar coefficients of expansion and the leadframe is pretreated to degasify and control oxidation of the metal to promote glass adhesion to the leadframe and prevent microcracking at a glass/metal interface. A seal ring is applied to the glass paste (40) and a lid is attached to the seal ring (50). The package is used to provide a sealed inert internal environment for sensitive electronic components such as a piezoelectric element. The package may be configured for leaded or surface mounting (60).