公开(公告)号：EP0391057A3

公开(公告)日：1992-04-15

申请号：EP90103424.9

申请日：1990-02-22

Applicant: MOTOROLA INC.

Inventor： Craft, Scott

IPC: H05K7/20 ,  H01L23/36 ,  H01L23/373

CPC classification number: H05K1/0209 ,  H01L23/36 ,  H01L23/3731 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K7/20 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10204 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: Printed circuit board electronic assemblies (76) having improved thermal dissipation capabilities are obtained by adding electrically insulating but thermally conductive heat shunt components (80-85,90) to the circuit board (56) along with the regular electronic components (14-23). The heat shunt components (80-85,90) have a shape so that they may be placed on the printed circuit boards by the same assembly equipment used for the other electronic components (14-23). A typical heat shunt (80,90) component is a small parallelepiped of a highly thermally conducting electrically insulating dielectric (92), such as for example, alumina, beryllia, sapphire or aluminum nitride. It desirably has spaced-apart metal attachment lands (94,96) on one face (95) and an optional continuous metal layer (98) on the opposite face (97). In a typical application, one end (94) is soldered to the contact pad (66,68) where a power dissipating component (12) is also attached, and the other end (96) is soldered to a nearby ground lead (26′).

Abstract translation: 通过将电绝缘但导热的热分流组件（80-85,90）与常规电子部件（14-23）一起添加到电路板（56），获得具有改善的散热能力的印刷电路板电子组件（76） 。 热分流元件（80-85,90）具有这样的形状，使得它们可以通过与其它电子部件（14-23）相同的组装设备放置在印刷电路板上。 典型的热分流（80,90）组件是高导热电绝缘电介质（92）的小平行六面体，例如氧化铝，氧化铍，蓝宝石或氮化铝。 理想地，在相对面（97）上的一个面（95）和可选的连续金属层（98）上具有间隔开的金属附接平台（94,96）。 在典型的应用中，一端（94）被焊接到接触焊盘（66,68），其中功率消散部件（12）也被连接，另一端（96）被焊接到附近的接地引线（26分钟） ）。

公开(公告)号：EP0391057A2

公开(公告)日：1990-10-10

申请号：EP90103424.9

申请日：1990-02-22

Applicant: MOTOROLA INC.

Inventor： Craft, Scott

IPC: H05K7/20 ,  H01L23/36 ,  H01L23/373

CPC classification number: H05K1/0209 ,  H01L23/36 ,  H01L23/3731 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K7/20 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10204 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: Printed circuit board electronic assemblies (76) having improved thermal dissipation capabilities are obtained by adding electrically insulating but thermally conductive heat shunt components (80-85,90) to the circuit board (56) along with the regular electronic components (14-23). The heat shunt components (80-85,90) have a shape so that they may be placed on the printed circuit boards by the same assembly equipment used for the other electronic components (14-23).
A typical heat shunt (80,90) component is a small parallelepiped of a highly thermally conducting electrically insulating dielectric (92), such as for example, alumina, beryllia, sapphire or aluminum nitride. It desirably has spaced-apart metal attachment lands (94,96) on one face (95) and an optional continuous metal layer (98) on the opposite face (97).
In a typical application, one end (94) is soldered to the contact pad (66,68) where a power dissipating component (12) is also attached, and the other end (96) is soldered to a nearby ground lead (26′).

Abstract translation: 通过将电绝缘但导热的热分流组件（80-85,90）与常规电子部件（14-23）一起添加到电路板（56），获得具有改善的散热能力的印刷电路板电子组件（76） 。 热分流元件（80-85,90）具有这样的形状，使得它们可以通过与其它电子部件（14-23）相同的组装设备放置在印刷电路板上。 典型的热分流（80,90）组件是高导热电绝缘电介质（92）的小平行六面体，例如氧化铝，氧化铍，蓝宝石或氮化铝。 理想地，在相对面（97）上的一个面（95）和可选的连续金属层（98）上具有间隔开的金属附接平台（94,96）。 在典型的应用中，一端（94）被焊接到接触焊盘（66,68），其中功率消散部件（12）也被连接，另一端（96）被焊接到附近的接地引线（26分钟） ）。

公开(公告)号：EP0579293A1

公开(公告)日：1994-01-19

申请号：EP93116610.2

申请日：1990-06-21

Applicant: MOTOROLA, INC.

Inventor： Craft, Scott ,  Pfizenmayer, Henry L. ,  Wernett, Frederick C.

IPC: H01L25/16 ,  H01L23/64 ,  H01L23/66

CPC classification number: H03F3/19 ,  H01L2223/6644 ,  H01L2924/0002 ,  H03F1/22 ,  H03F3/26 ,  H05K1/0237 ,  H05K1/181 ,  H01L2924/00

Abstract: Hybrid RF amplifiers (10) of improved performance are obtained by arranging film resistors (R1,R2,R3,R4), metallization and other components on a circuit board (40) so that symmetrical parts of the electrical circuit (10) are arranged in a mirror symmetrical fashion about a line (60) extending along the circuit board (40) and by aligning symmetrical resistors (R1,R2) either parallel or orthogonal to this line (60) and by utilizing common ground metal regions (54,54') to terminate resistors (R1,R2) that are aligned and orthogonal to the mirror line (60) and spaced apart by a gap (56) but joined to a common ground (50) at a single location.

Abstract translation: 通过将电阻（R1，R2，R3，R4），金属化等部件布置在电路板（40）上，使得电路（10）的对称部分布置在 关于沿着电路板（40）延伸的线（60）的镜子对称方式，并且通过对准与该线（60）平行或正交的对称电阻器（R1，R2）并且通过利用公共接地金属区域（54,54' ）端接电阻器（R1，R2），其与镜线（60）对齐并且正交并且间隔开间隙（56），但是在单个位置处连接到公共接地（50）。

公开(公告)号：EP0427002A2

公开(公告)日：1991-05-15

申请号：EP90119685.7

申请日：1990-10-15

Applicant: MOTOROLA, INC.

Inventor： Craft, Scott

IPC: H03F3/191 ,  H03F1/02

CPC classification number: H03F1/0233 ,  H03F3/191

Abstract: A two-stage, interstage transformer-coupled amplifier (11,12,13,14) is provided with a degeneration resistor (33) coupled between the collector of the first stage transistor (27) and the power supply to limit the power dissipated in the first stage transistor (27). The first (26) and second (44) stages are coupled to ground through capacitor/inductor circuits to eliminate signal noise in the supply voltage. The output is filtered to remove harmonics and provide output impedance matching.

Abstract translation: 两级级间变压器耦合放大器（11,12,13,14）设置有耦合在第一级晶体管（27）的集电极和电源之间的退化电阻（33），以限制在 第一级晶体管（27）。 第一（26）和第二（44）级通过电容器/电感器电路耦合到地，以消除电源电压中的信号噪声。 输出滤波以去除谐波并提供输出阻抗匹配。

公开(公告)号：EP0407778A2

公开(公告)日：1991-01-16

申请号：EP90111748.1

申请日：1990-06-21

Applicant: MOTOROLA, INC.

Inventor： Craft, Scott ,  Pfizenmayer, Henry L ,  Wernett, Frederick C.

IPC: H01L25/16 ,  H01L23/66

CPC classification number: H03F1/22 ,  H01L23/66 ,  H01L2223/6644 ,  H01L2924/0002 ,  H01L2924/19105 ,  H01L2924/3011 ,  H03F3/19 ,  H05K1/0237 ,  H05K1/181 ,  H01L2924/00

Abstract: Hybrid RF amplifiers (10) of improved performance are obtained by arranging film resistors (R1,R2,R3,R4), metallization and other components on a circuit board (40) so that symmetrical parts of the electrical circuit (10) are arranged in a mirror symmetrical fashion about a line (60) extending along the circuit board (40) and by aligning symmetrical resistors (R1,R2) either parallel or orthogonal to this line (60) and by utilizing common ground metal regions (54,54′) to terminate resistors (R1,R2) that are aligned and orthogonal to the mirror line (60) and spaced apart by a gap (56) but joined to a common ground (50) at a single location.

Abstract translation: 通过将电阻（R1，R2，R3，R4），金属化等部件布置在电路板（40）上，使得电路（10）的对称部分布置在 围绕沿着电路板（40）延伸的线（60）和通过对准与该线（60）平行或正交的对称电阻器（R1，R2）并通过利用公共接地金属区域（54,54分钟）的反射镜对称方式 ）端接电阻器（R1，R2），其与镜线（60）对齐并且正交并且间隔开间隙（56），但是在单个位置处连接到公共接地（50）。

公开(公告)号：EP0407778B1

公开(公告)日：1995-04-05

申请号：EP90111748.1

申请日：1990-06-21

Applicant: MOTOROLA, INC.

Inventor： Craft, Scott ,  Pfizenmayer, Henry L ,  Wernett, Frederick C.

IPC: H01L25/16 ,  H01L23/66

CPC classification number: H03F1/22 ,  H01L23/66 ,  H01L2223/6644 ,  H01L2924/0002 ,  H01L2924/19105 ,  H01L2924/3011 ,  H03F3/19 ,  H05K1/0237 ,  H05K1/181 ,  H01L2924/00

公开(公告)号：EP0427002A3

公开(公告)日：1991-08-14

申请号：EP90119685.7

申请日：1990-10-15

Applicant: MOTOROLA, INC.

Inventor： Craft, Scott

IPC: H03F3/191 ,  H03F1/02

CPC classification number: H03F1/0233 ,  H03F3/191

Abstract: A two-stage, interstage transformer-coupled amplifier (11,12,13,14) is provided with a degeneration resistor (33) coupled between the collector of the first stage transistor (27) and the power supply to limit the power dissipated in the first stage transistor (27). The first (26) and second (44) stages are coupled to ground through capacitor/inductor circuits to eliminate signal noise in the supply voltage. The output is filtered to remove harmonics and provide output impedance matching.

公开(公告)号：EP0407778A3

公开(公告)日：1991-07-24

申请号：EP90111748.1

申请日：1990-06-21

Applicant: MOTOROLA, INC.

Inventor： Craft, Scott ,  Pfizenmayer, Henry L ,  Wernett, Frederick C.

IPC: H01L25/16 ,  H01L23/66

CPC classification number: H03F1/22 ,  H01L23/66 ,  H01L2223/6644 ,  H01L2924/0002 ,  H01L2924/19105 ,  H01L2924/3011 ,  H03F3/19 ,  H05K1/0237 ,  H05K1/181 ,  H01L2924/00

Abstract: Hybrid RF amplifiers (10) of improved performance are obtained by arranging film resistors (R1,R2,R3,R4), metallization and other components on a circuit board (40) so that symmetrical parts of the electrical circuit (10) are arranged in a mirror symmetrical fashion about a line (60) extending along the circuit board (40) and by aligning symmetrical resistors (R1,R2) either parallel or orthogonal to this line (60) and by utilizing common ground metal regions (54,54′) to terminate resistors (R1,R2) that are aligned and orthogonal to the mirror line (60) and spaced apart by a gap (56) but joined to a common ground (50) at a single location.