公开(公告)号：WO1998033364A1

公开(公告)日：1998-07-30

申请号：PCT/US1997023550

申请日：1997-12-19

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  HU, Kai, X. ,  DILLARD, Don ,  MORAL, Leonardo, D. ,  YEH, Chao-pin ,  DOU, Xinyu ,  WYATT, Karl, W.

IPC: H05K03/02

CPC classification number: H05K3/0052 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09827

Abstract: The present invention provides a method (1100) and circuit board panel (800) for substantially eliminating assembly-line delamination and sagging for complex circuit board manufacturing. The method includes: A) cutting/routing at least two apertures to fit into a circuit board profile, wherein a total length of the apertures is determined in accordance with a predetermined scheme (1102); and B) cutting/routing a channel/gouge on a top of the circuit board and another channel/gouge on a bottom of the circuit board along the circuit board profile through the apertures in accordance with a break-away scheme (1104). The channel/gouges are positioned at a predetermined horizontal critical distance apart with a predetermined vertical critical distance between a deepest cut edge of the channel/gouge on the top of the circuit board and a deepest cut edge of the channel/gouge on the bottom of the circuit board.

Abstract translation: 本发明提供一种方法（1100）和电路板面板（800），用于基本上消除用于复杂电路板制造的组装线分层和下垂。 该方法包括：A）切割/布线至少两个孔以装配到电路板轮廓中，其中根据预定方案（1102）确定孔的总长度; 以及B）根据断开方案（1104），沿着电路板轮廓通过孔切割/布置电路板的顶部上的通道/沟槽和电路板的底部上的另一通道/沟槽。 通道/沟槽定位在预定的水平临界距离处，并且电路板顶部上的通道/沟槽的最深切割边缘与沟槽底部的沟槽/沟槽的最深切割边缘之间的预定垂直临界距离 电路板。