公开(公告)号：WO1998001013A3

公开(公告)日：1998-01-08

申请号：PCT/US1997009974

申请日：1997-06-09

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  HU, Kai, X. ,  DOU, Xinyu ,  YEH, Chao-Pin ,  DILLARD, Don ,  JUAREZ, Delbert ,  MUI, Gary, K. ,  BREY, Thomas ,  DLESK, Richard ,  WYATT, Karl ,  ROLLER, Dave

IPC: H05K01/00

公开(公告)号：EP0852896A2

公开(公告)日：1998-07-15

申请号：EP97932159.0

申请日：1997-06-09

Applicant: MOTOROLA, INC.

Inventor： HU, Kai, X. ,  DOU, Xinyu ,  YEH, Chao-Pin ,  DILLARD, Don ,  JUAREZ, Delbert ,  MUI, Gary, K. ,  BREY, Thomas ,  DLESK, Richard ,  WYATT, Karl ,  ROLLER, Dave

IPC: H05K1 ,  H05K3

CPC classification number: H05K3/0052 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09827 ,  Y10T29/49155

Abstract: Board delamination during the singulation from a board panel and board sagging during front-end assembly are two of the biggest problems encountered in cellular manufacturing lines. The method and circuit board panel (600) of the present invention substantially eliminate assembly-line delamination and sagging for circuit board manufacturing. A number of slots are punched to fit into a circuit board profile. V-grooves (606, 608) are cut along each of the circuit board profiles through the slots and directly opposite on a top and bottom of the circuit board. Thus, optimization of the cut-outs (604) and v-groove (606, 608) configurations tearing, delamination are eliminated, and sagging is substantially reduced.

公开(公告)号：WO1998033364A1

公开(公告)日：1998-07-30

申请号：PCT/US1997023550

申请日：1997-12-19

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  HU, Kai, X. ,  DILLARD, Don ,  MORAL, Leonardo, D. ,  YEH, Chao-pin ,  DOU, Xinyu ,  WYATT, Karl, W.

IPC: H05K03/02

CPC classification number: H05K3/0052 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09827

Abstract: The present invention provides a method (1100) and circuit board panel (800) for substantially eliminating assembly-line delamination and sagging for complex circuit board manufacturing. The method includes: A) cutting/routing at least two apertures to fit into a circuit board profile, wherein a total length of the apertures is determined in accordance with a predetermined scheme (1102); and B) cutting/routing a channel/gouge on a top of the circuit board and another channel/gouge on a bottom of the circuit board along the circuit board profile through the apertures in accordance with a break-away scheme (1104). The channel/gouges are positioned at a predetermined horizontal critical distance apart with a predetermined vertical critical distance between a deepest cut edge of the channel/gouge on the top of the circuit board and a deepest cut edge of the channel/gouge on the bottom of the circuit board.

Abstract translation: 本发明提供一种方法（1100）和电路板面板（800），用于基本上消除用于复杂电路板制造的组装线分层和下垂。 该方法包括：A）切割/布线至少两个孔以装配到电路板轮廓中，其中根据预定方案（1102）确定孔的总长度; 以及B）根据断开方案（1104），沿着电路板轮廓通过孔切割/布置电路板的顶部上的通道/沟槽和电路板的底部上的另一通道/沟槽。 通道/沟槽定位在预定的水平临界距离处，并且电路板顶部上的通道/沟槽的最深切割边缘与沟槽底部的沟槽/沟槽的最深切割边缘之间的预定垂直临界距离 电路板。

公开(公告)号：WO1998001013A2

公开(公告)日：1998-01-08

申请号：PCT/US1997009974

申请日：1997-06-09

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  HU, Kai, X. ,  DOU, Xinyu ,  YEH, Chao-Pin ,  DILLARD, Don ,  JUAREZ, Delbert ,  MUI, Gary, K. ,  BREY, Thomas ,  DLESK, Richard ,  WYATT, Karl ,  ROLLER, Dave

IPC: H05K00/00

CPC classification number: H05K3/0052 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09827 ,  Y10T29/49155

Abstract: Board delamination during the singulation from a board panel and board sagging during front-end assembly are two biggest problems encountered in cellular manufacturing lines. The method (700) and circuit board panel (600) of the present invention substantially eliminate assembly-line delamination and sagging for circuit board manufacturing. A number of slots are punched to fit into a circuit board profile. V-grooves are cut along each of the circuit board profiles through the slots and directly opposite on a top and bottom of the circuit board. Thus, optimization of the cut-outs and v-groove configurations tearing, delamination are eliminated, and sagging is substantially reduced.

Abstract translation: 在前板组装过程中，板卡分离时板材分层和板下垂是细胞生产线中遇到的两个最大问题。 本发明的方法（700）和电路板面板（600）基本上消除了用于电路板制造的组装线分层和下垂。 多个槽被冲孔以适应电路板轮廓。 沿着每个电路板轮廓通过槽切割V形槽，并且直接相对于电路板的顶部和底部。 因此，消除了切口和V形槽结构的优化，撕裂，分层，并且下垂显着降低。