公开(公告)号：WO1998001013A3

公开(公告)日：1998-01-08

申请号：PCT/US1997009974

申请日：1997-06-09

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  HU, Kai, X. ,  DOU, Xinyu ,  YEH, Chao-Pin ,  DILLARD, Don ,  JUAREZ, Delbert ,  MUI, Gary, K. ,  BREY, Thomas ,  DLESK, Richard ,  WYATT, Karl ,  ROLLER, Dave

IPC: H05K01/00

公开(公告)号：WO2003022001A1

公开(公告)日：2003-03-13

申请号：PCT/US2002/025867

申请日：2002-08-14

Applicant: MOTOROLA, INC., A CORPORATION OF THE STATE OF DELAWARE

Inventor： YEAGER, David, M. ,  ISABELLE, Scott, K. ,  MUELLER, Karl, F. ,  MUTHUSWAMY, Sivakumar ,  DOU, Xinyu

IPC: H04R5/00

CPC classification number: H04S1/005 ,  H04M3/56 ,  H04R1/1008 ,  H04R2400/11 ,  H04R2420/07 ,  H04R2499/11 ,  H04S7/302 ,  H04S2420/01

Abstract: A method for creating spatially resolved audio signals for a listener (18) that are representative of one or more callers (12, 14, 16). A digital data signal (13) that represents an individual caller's voice (12) contains an embedded tag (24) that is identifiable with the caller. The digital data signal is transmitted from a sending device at the caller's location to a receiving device (30) at the listener's location. At the receiving device, the tag is used to associate the digital data signal with a head related transfer function (32) that is resident preferably in a lookup table of the receiving device. The digital data stream is then convolved (34) with the associated head related transfer function to form a binaural digital signal that is ported to two or more acoustic transducers (36) to create analog audio signals that appear to emanate from different spatial locations around the listener.

Abstract translation: 一种用于为代表一个或多个呼叫者（12,14,16）的收听者（18）创建空间解析音频信号的方法。 表示个人呼叫者的语音（12）的数字数据信号（13）包含可与呼叫者识别的嵌入式标签（24）。 数字数据信号从呼叫者的位置处的发送设备被发送到在收听者位置处的接收设备（30）。 在接收设备处，标签用于将数字数据信号与优先在该接收设备的查找表中驻留的头部相关传送功能（32）相关联。 然后将数字数据流与相关联的头部相关传递函数进行卷积（34）以形成双耳数字信号，该双耳数字信号被移植到两个或更多个声换能器（36），以产生模拟音频信号，其似乎从围绕 监听器。

公开(公告)号：EP0852896A2

公开(公告)日：1998-07-15

申请号：EP97932159.0

申请日：1997-06-09

Applicant: MOTOROLA, INC.

Inventor： HU, Kai, X. ,  DOU, Xinyu ,  YEH, Chao-Pin ,  DILLARD, Don ,  JUAREZ, Delbert ,  MUI, Gary, K. ,  BREY, Thomas ,  DLESK, Richard ,  WYATT, Karl ,  ROLLER, Dave

IPC: H05K1 ,  H05K3

CPC classification number: H05K3/0052 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09827 ,  Y10T29/49155

Abstract: Board delamination during the singulation from a board panel and board sagging during front-end assembly are two of the biggest problems encountered in cellular manufacturing lines. The method and circuit board panel (600) of the present invention substantially eliminate assembly-line delamination and sagging for circuit board manufacturing. A number of slots are punched to fit into a circuit board profile. V-grooves (606, 608) are cut along each of the circuit board profiles through the slots and directly opposite on a top and bottom of the circuit board. Thus, optimization of the cut-outs (604) and v-groove (606, 608) configurations tearing, delamination are eliminated, and sagging is substantially reduced.

公开(公告)号：WO1998033364A1

公开(公告)日：1998-07-30

申请号：PCT/US1997023550

申请日：1997-12-19

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  HU, Kai, X. ,  DILLARD, Don ,  MORAL, Leonardo, D. ,  YEH, Chao-pin ,  DOU, Xinyu ,  WYATT, Karl, W.

IPC: H05K03/02

CPC classification number: H05K3/0052 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09827

Abstract: The present invention provides a method (1100) and circuit board panel (800) for substantially eliminating assembly-line delamination and sagging for complex circuit board manufacturing. The method includes: A) cutting/routing at least two apertures to fit into a circuit board profile, wherein a total length of the apertures is determined in accordance with a predetermined scheme (1102); and B) cutting/routing a channel/gouge on a top of the circuit board and another channel/gouge on a bottom of the circuit board along the circuit board profile through the apertures in accordance with a break-away scheme (1104). The channel/gouges are positioned at a predetermined horizontal critical distance apart with a predetermined vertical critical distance between a deepest cut edge of the channel/gouge on the top of the circuit board and a deepest cut edge of the channel/gouge on the bottom of the circuit board.

Abstract translation: 本发明提供一种方法（1100）和电路板面板（800），用于基本上消除用于复杂电路板制造的组装线分层和下垂。 该方法包括：A）切割/布线至少两个孔以装配到电路板轮廓中，其中根据预定方案（1102）确定孔的总长度; 以及B）根据断开方案（1104），沿着电路板轮廓通过孔切割/布置电路板的顶部上的通道/沟槽和电路板的底部上的另一通道/沟槽。 通道/沟槽定位在预定的水平临界距离处，并且电路板顶部上的通道/沟槽的最深切割边缘与沟槽底部的沟槽/沟槽的最深切割边缘之间的预定垂直临界距离 电路板。

公开(公告)号：WO1998001013A2

公开(公告)日：1998-01-08

申请号：PCT/US1997009974

申请日：1997-06-09

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  HU, Kai, X. ,  DOU, Xinyu ,  YEH, Chao-Pin ,  DILLARD, Don ,  JUAREZ, Delbert ,  MUI, Gary, K. ,  BREY, Thomas ,  DLESK, Richard ,  WYATT, Karl ,  ROLLER, Dave

IPC: H05K00/00

CPC classification number: H05K3/0052 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09827 ,  Y10T29/49155

Abstract: Board delamination during the singulation from a board panel and board sagging during front-end assembly are two biggest problems encountered in cellular manufacturing lines. The method (700) and circuit board panel (600) of the present invention substantially eliminate assembly-line delamination and sagging for circuit board manufacturing. A number of slots are punched to fit into a circuit board profile. V-grooves are cut along each of the circuit board profiles through the slots and directly opposite on a top and bottom of the circuit board. Thus, optimization of the cut-outs and v-groove configurations tearing, delamination are eliminated, and sagging is substantially reduced.

Abstract translation: 在前板组装过程中，板卡分离时板材分层和板下垂是细胞生产线中遇到的两个最大问题。 本发明的方法（700）和电路板面板（600）基本上消除了用于电路板制造的组装线分层和下垂。 多个槽被冲孔以适应电路板轮廓。 沿着每个电路板轮廓通过槽切割V形槽，并且直接相对于电路板的顶部和底部。 因此，消除了切口和V形槽结构的优化，撕裂，分层，并且下垂显着降低。