公开(公告)号：EP0407649A1

公开(公告)日：1991-01-16

申请号：EP89112993.4

申请日：1989-07-14

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Andrews, Daniel Marshall

IPC: H05K5/06 ,  H01L21/60 ,  H01L21/00 ,  H01L21/56

CPC classification number: H01L21/50 ,  Y10T29/49121 ,  Y10T29/49169

Abstract: Forming a body (10) of insulating material with a shelf (14) and an opening (12) therethrough with a plurality of electrical conductors (16) extending from the shelf (14) to the exterior of the body. A plurality of tape automated bonding leads (26) are placed in the opening (12) in which the inner ends of the leads are connected together. The outer ends (28) of the leads are aligned with the electrical conductors (16) and bonded thereto and the inner ends (30) of the leads are disconnected from each other. An electronic component (50) is bonded to a bottom cover (52), aligned in the opening (12), and the inner ends (30) of the leads are bonded to the electrical component (50). The bottom (52) and a top cover (60) are sealably connected to the body (10) enclosing the opening and the electronic component.

Abstract translation: 形成具有搁板（14）和上开口（12）通过与电导体（16）从所述搁板（14）到所述主体的外部延伸的多个绝缘材料存在的主体（10）。 带自动键合引线（26）的多个被置于其中的引线的内端连接在一起的开口（12）。 引线的外端（28）与所述电导体（16）和与其结合和内端的引线（30）从断开海誓山盟对齐。 一种电子部件（50）被键合到下盖（52），在开口（12）和引线的内端（30）对齐的键合到电元件（50）。 底部（52）和顶盖（60）以可密封地连接到所述本体（10）包围所述开口和所述电子元件。

公开(公告)号：EP0326020A3

公开(公告)日：1991-10-16

申请号：EP89100877.3

申请日：1989-01-19

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Andrews, Daniel Marshall ,  Spletter, Phillip James ,  Simmons, Richard Linn

IPC: H01L21/60 ,  H01L21/68 ,  B23K1/005

CPC classification number: H01L21/68 ,  B23K1/0056 ,  H01L21/67138 ,  H01L24/86 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

Abstract: A method and apparatus of bonding two electrical members together uses a pulsed YAG laser. Various apparatus and methods may be used to hold the electrical members in contact under pressure to insure uniform bonding. Automation production equipment provides for the automatic bonding of the flat electrical leads of a TAB tape to the flat electrical bumps on a plurality of integrated circuit dies.

公开(公告)号：EP0326020A2

公开(公告)日：1989-08-02

申请号：EP89100877.3

申请日：1989-01-19

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Andrews, Daniel Marshall ,  Spletter, Phillip James ,  Simmons, Richard Linn

IPC: H01L21/60 ,  H01L21/68 ,  B23K1/005

CPC classification number: H01L21/68 ,  B23K1/0056 ,  H01L21/67138 ,  H01L24/86 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

Abstract: A method and apparatus of bonding two electrical members together uses a pulsed YAG laser. Various apparatus and methods may be used to hold the electrical members in contact under pressure to insure uniform bonding. Automation production equipment provides for the automatic bonding of the flat electrical leads of a TAB tape to the flat electrical bumps on a plurality of integrated circuit dies.

Abstract translation: 将两个电气部件结合在一起的方法和装置使用脉冲YAG激光器。 可以使用各种装置和方法来保持电气部件在压力下接触以确保均匀粘合。 自动化生产设备提供了TAB带的扁平电引线与多个集成电路管芯上的扁平电凸点的自动接合。