公开(公告)号：EP0326020A3

公开(公告)日：1991-10-16

申请号：EP89100877.3

申请日：1989-01-19

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Andrews, Daniel Marshall ,  Spletter, Phillip James ,  Simmons, Richard Linn

IPC: H01L21/60 ,  H01L21/68 ,  B23K1/005

CPC classification number: H01L21/68 ,  B23K1/0056 ,  H01L21/67138 ,  H01L24/86 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

Abstract: A method and apparatus of bonding two electrical members together uses a pulsed YAG laser. Various apparatus and methods may be used to hold the electrical members in contact under pressure to insure uniform bonding. Automation production equipment provides for the automatic bonding of the flat electrical leads of a TAB tape to the flat electrical bumps on a plurality of integrated circuit dies.

公开(公告)号：EP0326020A2

公开(公告)日：1989-08-02

申请号：EP89100877.3

申请日：1989-01-19

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Andrews, Daniel Marshall ,  Spletter, Phillip James ,  Simmons, Richard Linn

IPC: H01L21/60 ,  H01L21/68 ,  B23K1/005

CPC classification number: H01L21/68 ,  B23K1/0056 ,  H01L21/67138 ,  H01L24/86 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

Abstract: A method and apparatus of bonding two electrical members together uses a pulsed YAG laser. Various apparatus and methods may be used to hold the electrical members in contact under pressure to insure uniform bonding. Automation production equipment provides for the automatic bonding of the flat electrical leads of a TAB tape to the flat electrical bumps on a plurality of integrated circuit dies.

Abstract translation: 将两个电气部件结合在一起的方法和装置使用脉冲YAG激光器。 可以使用各种装置和方法来保持电气部件在压力下接触以确保均匀粘合。 自动化生产设备提供了TAB带的扁平电引线与多个集成电路管芯上的扁平电凸点的自动接合。