公开(公告)号：EP0267772A3

公开(公告)日：1989-02-22

申请号：EP87309904.8

申请日：1987-11-09

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Herrell, Dennis, J. ,  Gupta, Omkarnath Ramnath ,  Hilbert, Claude

IPC: H01L23/467 ,  H01L23/367

CPC classification number: H01L23/467 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A heat exchanger for cooling or heating an object, which heat exchanger (10) comprises a plurality of spaced apart substantially parallel thermally conductive fins (18, 20) characterized in that diverting means (26, 26 b , 26 e , 26 f , 58) are provided which, when a gas is introduced in one direction into said heat exchanger (10) diverts at least part of said gas in a second direction generally perpendicular to said one direction. In one embodiment, the heat exchanger (10) comprises two interdigitated sets of oppositely facing cooling fins (18, 20) which are of generally right-angled triangular configuration. Cooling air is introduced downwardly into the heat exchanger (10) from duct (16) and is diverted horizontally by the hypotenuse of the cooling fins (18, 20). The cooling air leaves the heat exchanger (19) in mutually opposite directions through the passageways (30) formed between adjacent fins in each set of fins. The heat exchanger (10) is particularly useful as a heat sink for use with electronic chips (12). Several other embodiments are described.

公开(公告)号：EP0267772B1

公开(公告)日：1993-01-13

申请号：EP87309904.8

申请日：1987-11-09

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Herrell, Dennis, J. ,  Gupta, Omkarnath Ramnath ,  Hilbert, Claude

IPC: H01L23/467 ,  H01L23/367

CPC classification number: H01L23/467 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

公开(公告)号：EP0267772A2

公开(公告)日：1988-05-18

申请号：EP87309904.8

申请日：1987-11-09

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Herrell, Dennis, J. ,  Gupta, Omkarnath Ramnath ,  Hilbert, Claude

IPC: H01L23/467 ,  H01L23/367

CPC classification number: H01L23/467 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A heat exchanger for cooling or heating an object, which heat exchanger (10) comprises a plurality of spaced apart substantially parallel thermally conductive fins (18, 20) characterized in that diverting means (26, 26 b , 26 e , 26 f , 58) are provided which, when a gas is introduced in one direction into said heat exchanger (10) diverts at least part of said gas in a second direction generally perpendicular to said one direction.
In one embodiment, the heat exchanger (10) comprises two interdigitated sets of oppositely facing cooling fins (18, 20) which are of generally right-angled triangular configuration. Cooling air is introduced downwardly into the heat exchanger (10) from duct (16) and is diverted horizontally by the hypotenuse of the cooling fins (18, 20). The cooling air leaves the heat exchanger (19) in mutually opposite directions through the passageways (30) formed between adjacent fins in each set of fins. The heat exchanger (10) is particularly useful as a heat sink for use with electronic chips (12).
Several other embodiments are described.

Abstract translation: 一种用于冷却或加热物体的热交换器，所述热交换器（10）包括多个间隔开的基本上平行的导热翅片（18,20），其特征在于，提供转向装置（26,26b，26e，26f，58） 当将气体沿一个方向引入所述热交换器（10）时，所述气体在大致垂直于所述一个方向的第二方向上转移至少部分所述气体。 在一个实施例中，热交换器（10）包括两个互相指向的一组相对的冷却翅片（18,20），其具有大致直角的三角形构造。 冷却空气从管道（16）向下引入到热交换器（10）中，并且被冷却翅片（18,20）的斜边水平地转向。 冷却空气通过形成在每组翅片中的相邻翅片之间的通道（30）沿彼此相反的方向离开热交换器（19）。 热交换器（10）特别适用于与电子芯片（12）一起使用的散热器。 描述几个其它实施例。