公开(公告)号：EP0267772B1

公开(公告)日：1993-01-13

申请号：EP87309904.8

申请日：1987-11-09

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Herrell, Dennis, J. ,  Gupta, Omkarnath Ramnath ,  Hilbert, Claude

IPC: H01L23/467 ,  H01L23/367

CPC classification number: H01L23/467 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

公开(公告)号：EP0267772A2

公开(公告)日：1988-05-18

申请号：EP87309904.8

申请日：1987-11-09

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Herrell, Dennis, J. ,  Gupta, Omkarnath Ramnath ,  Hilbert, Claude

IPC: H01L23/467 ,  H01L23/367

CPC classification number: H01L23/467 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A heat exchanger for cooling or heating an object, which heat exchanger (10) comprises a plurality of spaced apart substantially parallel thermally conductive fins (18, 20) characterized in that diverting means (26, 26 b , 26 e , 26 f , 58) are provided which, when a gas is introduced in one direction into said heat exchanger (10) diverts at least part of said gas in a second direction generally perpendicular to said one direction.
In one embodiment, the heat exchanger (10) comprises two interdigitated sets of oppositely facing cooling fins (18, 20) which are of generally right-angled triangular configuration. Cooling air is introduced downwardly into the heat exchanger (10) from duct (16) and is diverted horizontally by the hypotenuse of the cooling fins (18, 20). The cooling air leaves the heat exchanger (19) in mutually opposite directions through the passageways (30) formed between adjacent fins in each set of fins. The heat exchanger (10) is particularly useful as a heat sink for use with electronic chips (12).
Several other embodiments are described.

Abstract translation: 一种用于冷却或加热物体的热交换器，所述热交换器（10）包括多个间隔开的基本上平行的导热翅片（18,20），其特征在于，提供转向装置（26,26b，26e，26f，58） 当将气体沿一个方向引入所述热交换器（10）时，所述气体在大致垂直于所述一个方向的第二方向上转移至少部分所述气体。 在一个实施例中，热交换器（10）包括两个互相指向的一组相对的冷却翅片（18,20），其具有大致直角的三角形构造。 冷却空气从管道（16）向下引入到热交换器（10）中，并且被冷却翅片（18,20）的斜边水平地转向。 冷却空气通过形成在每组翅片中的相邻翅片之间的通道（30）沿彼此相反的方向离开热交换器（19）。 热交换器（10）特别适用于与电子芯片（12）一起使用的散热器。 描述几个其它实施例。

公开(公告)号：EP0267772A3

公开(公告)日：1989-02-22

申请号：EP87309904.8

申请日：1987-11-09

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Herrell, Dennis, J. ,  Gupta, Omkarnath Ramnath ,  Hilbert, Claude

IPC: H01L23/467 ,  H01L23/367

CPC classification number: H01L23/467 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A heat exchanger for cooling or heating an object, which heat exchanger (10) comprises a plurality of spaced apart substantially parallel thermally conductive fins (18, 20) characterized in that diverting means (26, 26 b , 26 e , 26 f , 58) are provided which, when a gas is introduced in one direction into said heat exchanger (10) diverts at least part of said gas in a second direction generally perpendicular to said one direction. In one embodiment, the heat exchanger (10) comprises two interdigitated sets of oppositely facing cooling fins (18, 20) which are of generally right-angled triangular configuration. Cooling air is introduced downwardly into the heat exchanger (10) from duct (16) and is diverted horizontally by the hypotenuse of the cooling fins (18, 20). The cooling air leaves the heat exchanger (19) in mutually opposite directions through the passageways (30) formed between adjacent fins in each set of fins. The heat exchanger (10) is particularly useful as a heat sink for use with electronic chips (12). Several other embodiments are described.

公开(公告)号：EP0374479A1

公开(公告)日：1990-06-27

申请号：EP89121220.1

申请日：1989-11-16

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Nelson, Richard Douglas ,  Gupta, Omkarnath Ramnath ,  Herrell, Dennis J.

IPC: H01L23/473 ,  H01L23/40

CPC classification number: H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A fluid heat exchanger (12) for mating with an electronic component (14) is supported from a fixed support (16). A connection (32) between the fixed support (16) and the heat exchanger (12) is initially flexible for adjusting the position of the heat exchanger to accommodate variations in the height or attitude of the electronic component (14) for providing a good thermal interface. Thereafter, the connection changes to a rigid connection to provide good structural support for the heat exchanger which allows the support to withstand vibration or shock without overloading the electronic component. The flexibility of the connection may be reversible for later readjusting the position of the heat exchanger relative to the electronic component.

Abstract translation: 在电子部件（14）与配合的流体热交换器（12）由固定支撑件（16）支撑。 固定支撑（16）和所述热交换器（12）之间的连接（32）是用于调节热交换器的位置，以适应在所述电子部件（14）的高度或姿态的变化，用于提供良好的热INITIALLY灵活 接口。 那里之后，该连接改变为刚性连接，以提供允许支撑承受振动或冲击从而避免过载对电子元件进行热交换器良好的结构支撑。 的连接的灵活性可以是可逆的供以后重新调整相对于所述电子部件的换热器的位置。

公开(公告)号：EP0445309A1

公开(公告)日：1991-09-11

申请号：EP90102499.2

申请日：1990-02-08

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Nelson, Richard Douglas ,  Gupta, Omkarnath Ramnath ,  Herrell, Dennis J.

IPC: H01L23/473 ,  H01L23/467

CPC classification number: H01L23/467 ,  H01L23/4336 ,  H01L2924/0002 ,  Y10S165/908 ,  H01L2924/00

Abstract: A high performance fluid heat exchanger (10) for cooling an electronic component (16) which includes housing (12) having a base (14), a plurality of parallel fins (22) in the housing (12), and a center fed inlet (30) connected to the housing (12) opposite the base (14) for supplying cooling fluid towards the base (14) and toward the ends of the fins (28). A plate (36) is positioned between the tops (24) and bottom (26) of the fins (22) and extends generally parallel to the base (14) and extends towards, but is spaced from, the ends of the fins (28) for providing a double cooling pass against the fins.

Abstract translation: 一种用于冷却电子部件（16）的高性能流体热交换器（10），其包括具有基座（14）的壳体（12），以及壳体（12）中的多个平行散热片（22） （30），其连接到与所述基座（14）相对的所述壳体（12），用于朝向所述基座（14）并朝向所述翅片（28）的端部供应冷却流体。 板（36）定位在翅片（22）的顶部（24）和底部（26）之间，并且大致平行于基部（14）延伸并且延伸到翅片（28）的端部但是与翅片 ），用于提供对散热片的双重冷却通道。

公开(公告)号：EP0353437A1

公开(公告)日：1990-02-07

申请号：EP89111006.6

申请日：1989-06-16

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Nelson, Richard Douglas ,  Gupta, Omkarnath Ramnath

IPC: H01L23/473

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A body (12) having a bottom (14) and first (16) and second (18) ends and a cavity (26) therein. A plurality of substantially parallel spaced fins (30a-30h) are positioned in the cavity. A liquid inlet (32) is centrally positioned in the first end of the body and a liquid outlet (34) is centrally positioned in the second end of the body where flowing cooling liquid between the fins from the first end to the second end with higher fluid flow between the fins in the center for preferentially cooling the center of the heat exchanger. A cross-sectional area of the liquid path in the body minimize pressure drops and avoids abrupt direction changes and cross-sectional changes. The width, height and spacing of the fins may be varied to control the temperature of the areas in the bottom.

Abstract translation: 具有底部（14）和第一（16）和第二（18）端部的主体（12）和其中的空腔（26）。 多个基本上平行的间隔开的翅片（30a-30h）定位在空腔中。 液体入口（32）位于主体的第一端中央并且液体出口（34）居中地位于主体的第二端，其中翅片之间的冷却液体从第一端到第二端以较高的速度流动 在中心的翅片之间的流体流动优先冷却热交换器的中心。 体内的液体通道的横截面积使压力下降最小化，避免突然的方向变化和横截面变化。 翅片的宽度，高度和间距可以改变，以控制底部区域的温度。