公开(公告)号：EP0374479A1

公开(公告)日：1990-06-27

申请号：EP89121220.1

申请日：1989-11-16

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Nelson, Richard Douglas ,  Gupta, Omkarnath Ramnath ,  Herrell, Dennis J.

IPC: H01L23/473 ,  H01L23/40

CPC classification number: H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A fluid heat exchanger (12) for mating with an electronic component (14) is supported from a fixed support (16). A connection (32) between the fixed support (16) and the heat exchanger (12) is initially flexible for adjusting the position of the heat exchanger to accommodate variations in the height or attitude of the electronic component (14) for providing a good thermal interface. Thereafter, the connection changes to a rigid connection to provide good structural support for the heat exchanger which allows the support to withstand vibration or shock without overloading the electronic component. The flexibility of the connection may be reversible for later readjusting the position of the heat exchanger relative to the electronic component.

Abstract translation: 在电子部件（14）与配合的流体热交换器（12）由固定支撑件（16）支撑。 固定支撑（16）和所述热交换器（12）之间的连接（32）是用于调节热交换器的位置，以适应在所述电子部件（14）的高度或姿态的变化，用于提供良好的热INITIALLY灵活 接口。 那里之后，该连接改变为刚性连接，以提供允许支撑承受振动或冲击从而避免过载对电子元件进行热交换器良好的结构支撑。 的连接的灵活性可以是可逆的供以后重新调整相对于所述电子部件的换热器的位置。

公开(公告)号：EP0445309A1

公开(公告)日：1991-09-11

申请号：EP90102499.2

申请日：1990-02-08

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Nelson, Richard Douglas ,  Gupta, Omkarnath Ramnath ,  Herrell, Dennis J.

IPC: H01L23/473 ,  H01L23/467

CPC classification number: H01L23/467 ,  H01L23/4336 ,  H01L2924/0002 ,  Y10S165/908 ,  H01L2924/00

Abstract: A high performance fluid heat exchanger (10) for cooling an electronic component (16) which includes housing (12) having a base (14), a plurality of parallel fins (22) in the housing (12), and a center fed inlet (30) connected to the housing (12) opposite the base (14) for supplying cooling fluid towards the base (14) and toward the ends of the fins (28). A plate (36) is positioned between the tops (24) and bottom (26) of the fins (22) and extends generally parallel to the base (14) and extends towards, but is spaced from, the ends of the fins (28) for providing a double cooling pass against the fins.

Abstract translation: 一种用于冷却电子部件（16）的高性能流体热交换器（10），其包括具有基座（14）的壳体（12），以及壳体（12）中的多个平行散热片（22） （30），其连接到与所述基座（14）相对的所述壳体（12），用于朝向所述基座（14）并朝向所述翅片（28）的端部供应冷却流体。 板（36）定位在翅片（22）的顶部（24）和底部（26）之间，并且大致平行于基部（14）延伸并且延伸到翅片（28）的端部但是与翅片 ），用于提供对散热片的双重冷却通道。