公开(公告)号：US20230147645A1

公开(公告)日：2023-05-11

申请号：US17768883

申请日：2020-09-18

Applicant: NAMICS CORPORATION

Inventor： Ayako SATO

IPC: C08F22/14 ,  C08F2/26 ,  C08K5/17 ,  C09J135/02 ,  H01L23/29

CPC classification number: C08F22/14 ,  C08F2/26 ,  C08K5/17 ,  C09J135/02 ,  H01L23/293

Abstract: A polymerizable composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound and (b) at least one ionic compound including a specific anion.

公开(公告)号：US20210380851A1

公开(公告)日：2021-12-09

申请号：US17282696

申请日：2019-10-04

Applicant: NAMICS CORPORATION

Inventor： Ayako SATO ,  Fuminori ARAI

IPC: C09J135/02 ,  C08F122/14 ,  C09J4/00

Abstract: A resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) an initiator comprising at least one basic substance, and (c) an anionic polymerization inhibitor including at least one borate ester compound.

公开(公告)号：US20200283599A1

公开(公告)日：2020-09-10

申请号：US16764646

申请日：2018-12-12

Applicant: NAMICS CORPORATION

Inventor： Masashi KAJITA ,  Ayako SATO

IPC: C08K9/06 ,  C08K3/36 ,  C08K5/5435 ,  C08K5/5425 ,  C08K5/17 ,  C09J7/30 ,  C09J11/06 ,  C09J163/00 ,  C09C1/30 ,  H01L23/29

Abstract: To improve storage stability of a resin composition used for applications such as a semiconductor sealing material. The resin composition is a resin composition that includes (A) an epoxy resin, (B) a curing agent, and (C) a silica filler. The silica filler of component (C) is surface-treated with a basic substance having a conjugate acid dissociation constant (pKa) of 9.4 or more. The resin composition further includes (D) a silane coupling agent, or the silica filler of component (C) is further surface-treated with a silane coupling agent.

公开(公告)号：US20190338138A1

公开(公告)日：2019-11-07

申请号：US16474586

申请日：2017-11-28

Applicant: NAMICS Corporation

Inventor： Ayako SATO ,  Masashi KAJITA

IPC: C09C1/30 ,  C01B33/18 ,  C09J11/04 ,  C09J7/30 ,  H01L23/29

Abstract: The present invention provides a surface-treated silica filler for suppressing an increase in viscosity when added to a resin composition used for applications such as a semiconductor sealing material, and the resin composition containing the surface-treated silica filler. The surface-treated silica filler of the present invention is surface-treated with a basic substance having an acid dissociation constant (pKa) of its conjugate acid of 9.4 or more.

公开(公告)号：US20230399550A1

公开(公告)日：2023-12-14

申请号：US18033660

申请日：2021-10-25

Applicant: NAMICS CORPORATION

Inventor： Ayako SATO

IPC: C09J11/06 ,  C09J133/10 ,  C08K5/07 ,  C08F220/18

CPC classification number: C09J11/06 ,  C09J133/10 ,  C08K5/07 ,  C08F220/1818 ,  C08F220/1812 ,  H01L27/14618

Abstract: A base-releasing composition which suppresses release of a basic compound at room temperature and rapidly releases the basic compound under predetermined conditions. The base-releasing composition includes (A) a side-chain crystalline (meth)acrylate copolymer includes (i) repeating units each derived from an ester of a C8-C32 saturated, linear primary alcohol with acrylic acid or methacrylic acid and (ii) repeating units each derived from acrylic acid or methacrylic acid, and (B) a basic compound. The amount of basic groups in the (B) basic compound is 0.01 to 1.00 mmol per 1 g of the base-releasing composition, and at least a portion of the Component (B) is included in the Component (A). A curable resin composition includes a specific 2-methylene-1,3-dicarbonyl compound in combination with the base-releasing composition.

公开(公告)号：US20230143754A1

公开(公告)日：2023-05-11

申请号：US17912204

申请日：2021-03-15

Applicant: NAMICS CORPORATION

Inventor： Ayako SATO ,  Rieko NAGATA

IPC: C08F122/14

CPC classification number: C08F122/14

Abstract: An object of the present invention is to provide a photocurable resin composition which is quickly cured through anionic polymerization even by irradiation with ultraviolet light from a ultraviolet light-emitting diode in the UV-A or UV-B range, the resin composition suitable for the manufacture of electronic components.
The photocurable resin composition of the present invention comprises (a) a 2-methylene-1,3-dicarbonyl compound, (b) an ionic photo base generator and (c) a photo-sensitizer. The 2-methylene-1,3-dicarbonyl compound is a compound comprising at least one specific structural unit, and the ionic photo base generator is a salt comprising specific anion (i) and cation (ii).

公开(公告)号：US20240132714A1

公开(公告)日：2024-04-25

申请号：US18277309

申请日：2022-06-22

Applicant: NAMICS CORPORATION

Inventor： Yuki MATSUURA ,  Ayako SATO ,  Tomoya YAMAZAWA

IPC: C08L63/00 ,  H01L21/56 ,  H01L23/29

CPC classification number: C08L63/00 ,  H01L21/563 ,  H01L23/295 ,  C08K2201/003

Abstract: To suppress the bias of the distribution of a filler dispersed in a sealing material (cured product) covering an electrode connection portion, provided is an epoxy resin composition, including: (A) an epoxy resin; (B) a curing agent; (C) a filler; and (D) an ionic compound in which at least one of a cation or an anion is organic matter.