公开(公告)号：AU2003218288A1

公开(公告)日：2003-10-08

申请号：AU2003218288

申请日：2003-03-18

Applicant: NANONEXUS INC

Inventor： SWIATOWIEC FRANK ,  CHONG FU-CHIUNG ,  MOK SAMMY ,  CHIEH ERH-KONG ,  MILTER ROMAN L ,  HAEMER JOSEPH M ,  LIN CHANG-MING ,  CHEN YI-HSENG ,  DOAN DAVID THANH ,  LAHIRI SYAMAL KUMAR

IPC: B81B3/00 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01L23/48 ,  H01R13/24 ,  H05K3/40 ,  H05K7/10 ,  H01R12/04 ,  H01R12/36

Abstract: This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs (507), which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs (507). In addition, the invention also presents a method to fabricate the springs (507) that allow passage of relatively higher current without significantly degrading their lifetime.

公开(公告)号：DE10392441T5

公开(公告)日：2005-07-07

申请号：DE10392441

申请日：2003-03-18

Applicant: NANONEXUS INC

Inventor： LAHIRI SYAMAL KUMAR ,  SWIATOWIEC FRANK ,  CHONG FU-CHIUNG ,  MOK SAMMY ,  CHIEH ERH-KONG ,  MILTER ROMAN L ,  HAEMER JOSEPH M ,  LIN CHANG-MING ,  CHEN YI-HSENG ,  DOAN DAVID THANH

IPC: B81B3/00 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01L23/48 ,  H01R13/24 ,  H05K3/40 ,  H05K7/10 ,  H01R12/16 ,  H01L23/482

公开(公告)号：WO03081725A2

公开(公告)日：2003-10-02

申请号：PCT/US0308520

申请日：2003-03-18

Applicant: NANONEXUS INC

Inventor： LAHIRI SYAMAL KUMAR ,  SWIATOWIEC FRANK ,  CHONG FU-CHIUNG ,  MOK SAMMY ,  CHIEH ERH-KONG ,  MILTER ROMAN L ,  HAEMER JOSEPH M ,  LIN CHANG-MING ,  CHEN YI-HSENG ,  DOAN DAVID THANH

IPC: B81B3/00 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01L23/48 ,  H01R13/24 ,  H05K3/40 ,  H05K7/10 ,  H01R12/04 ,  H01R12/36

CPC classification number: B81B3/0072 ,  B81B2201/018 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06761 ,  G01R1/07357 ,  G01R3/00 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/09701 ,  H01L2924/14 ,  H01R12/718 ,  H01R13/24 ,  H05K3/4092 ,  H05K7/1061

Abstract: This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs (507), which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs (507). In addition, the invention also presents a method to fabricate the springs (507) that allow passage of relatively higher current without significantly degrading their lifetime.

Abstract translation: 本发明提供了一种提高微型弹簧（507）的屈服强度和疲劳强度的解决方案，该微型弹簧（507）可以以超小节距阵列制造。 它还公开了一种解决方案，以在重复接触时使接触垫材料与弹簧尖端的粘附最小化，而不影响小型化弹簧（507）的可靠性。 此外，本发明还提出了一种制造弹簧（507）的方法，其允许相对较高的电流通过而不显着降低其寿命。

公开(公告)号：WO03081725B1

公开(公告)日：2004-03-25

申请号：PCT/US0308520

申请日：2003-03-18

Applicant: NANONEXUS INC

Inventor： LAHIRI SYAMAL KUMAR ,  SWIATOWIEC FRANK ,  CHONG FU-CHIUNG ,  MOK SAMMY ,  CHIEH ERH-KONG ,  MILTER ROMAN L ,  HAEMER JOSEPH M ,  LIN CHANG-MING ,  CHEN YI-HSENG ,  DOAN DAVID THANH

IPC: B81B3/00 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01L23/48 ,  H01R13/24 ,  H05K3/40 ,  H05K7/10 ,  H01R12/04 ,  H01R12/36

CPC classification number: B81B3/0072 ,  B81B2201/018 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06761 ,  G01R1/07357 ,  G01R3/00 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/09701 ,  H01L2924/14 ,  H01R12/718 ,  H01R13/24 ,  H05K3/4092 ,  H05K7/1061

Abstract: This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs (507), which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs (507). In addition, the invention also presents a method to fabricate the springs (507) that allow passage of relatively higher current without significantly degrading their lifetime.

Abstract translation: 本发明提供了一种提高小型化弹簧（507）的屈服强度和疲劳强度的解决方案，其可以以超小间距阵列制造。 它还公开了一种解决方案，以便在重复接触时最小化接触垫材料对弹簧尖端的粘附，而不影响小型化弹簧（507）的可靠性。 此外，本发明还提供了一种制造弹簧（507）的方法，所述弹簧允许相对较高的电流通过而不会使其寿命显着降低。